Circuits Assembly - October 2008 - (Page 45) SPOTLIGHT with area of inspection of 11” x 16” in a single scan. Defect coverage includes SMT and PTH parts down to 0402, part presence/absence verification, part polarity and pin #1 orientation, part position and skew errors, laser marking, wrong part and device differences. FocalSpot Inc., focalspot.com Product Dual Vacuum Stencil Cleaner i8 fully automatic screen printer now has an improved understencil cleaner with dual vacuum cleaning changers; the solvent holes tube is easier to remove from the main understencil cleaner body. Also comes with Pad on Pad Verification (PPV) post-print inspection, using Hawkeye camera and inspection software. ICON Technologies, iconprinter.com Thermal Profiler with DPMO KIC 24/7 thermal profiler now comes standard with a feature that reportedly transforms a reflow oven to a transparent process tool. Generates reports for defects per million opportunities and reflow process yield. This information is said to be instantly understandable. Also comes with communication software said to enable quick programming by reading current Seho oven configuration and set points, and automatically downloading and loading optimized recipes. Reportedly prevents errors associated with manual inputs. Alarms can be integrated. KIC, kicthermal.com ‘1-Touch’ Thermal Profiler V-M.O.L.E. is a thermal profiler designed to complement MegaM.O.L.E. 20, SuperM.O.L.E. Gold, and oven profilers such as OvenRIDER and OvenWatch. Has one-touch profile verification. Warnings are given on batteries, core temperature and TC connectivity. Reportedly simplifies verification of a target profile through placement of a minimal number of thermocouples. Is powered by MAP software. ECD, ecd.com Fluid Jetting Valve DispenseJet DJ-9500 is for high-speed underfill applications and jetting silicone for LEDs. Flexible pneumatic design enables jetting a wider range of fluid types, reportedly at up to 10 times faster than needle-type dispensers, with better repeatability and increased flexibility. Asymtek, asymtek.com Benchtop Solder Dross Recovery KDS-101 recovers purified solder from dross in all soldering operations. Recovered solder can be immediately reused and dross disposed of efficiently. Koki Tec Corp. /Christopher Associates Inc., christopherweb.com Dual Mode Screen Printer SP150 is manual or semiautomatic, with metal or rubber squeegees. Features squeegee lengths of 130, 220, 260, 300 or 400 mm. Has an adjustable print pressure force of 4-140N, programmable printing speeds of 10 to 99 mm/sec, and adjustable separation speed from 1 to 5 mm/s. Print cycle counter records from 0 to 999,999. Has a manual drawer and manual drawer alignment. Reportedly handles PCBs up to 410 x 400 mm and substrate heights to 4 mm. Maximum printing area is 390 x 360 mm. Provides manual width adjustment, two support boards with lengths of 410 mm, four vacuum fixation pins, 10 support pins, two centering pins with 3 mm diameters, and a Venturi-type vacuum pump. Features X-Y alignment range of ±3 mm, theta of ±2° and accuracy of ±30 µm. Essemtec, essemtec.com High-Temp, NonSilicone Tape 815 is said to withstand temperatures up to 350°F. Is designed to mask and hold tools, forms and parts for metal and composite bonding, and for masking PCB contacts during conformal coating. Consists of a high-temperature nylon backing, single coated with a rubber adhesive that reportedly eliminates the potential for silicone contamination. Is 0.0032” thick. Scapa North America, scapana.com 9-MP Color Camera SV9C10 12-bit color 9-MP 7 fps camera is externally triggered or free run, compact and rugged. Has flexible interface cable, software control. Area of interest is adjustable for higher frame rates. EPIX Inc., epixinc.com circuitsassembly.com Circuits Assembly OCTOBER 2008 45 http://www.iconprinter.com http://www.focalspot.com http://www.ecd.com http://www.asymtek.com http://www.kicthermal.com http://www.christopherweb.com http://www.essemtec.com http://www.scapana.com http://www.epixinc.com http://www.circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - October 2008 Circuits Assembly - September 2008 Contents Letters Caveat Lector Industry News Market Watch Talking Heads Global Sourcing Screen Printing Better Manufacturing 'Checking Up' on Medical Electronics Solder Ball Attachment Using Laser Soldering Improving QFN Reliability Reflow Soldering Tech Tips Test and Inspection Process Doctor Pb-Free Lessons Learned Alternative Energies Eastern Advances Product Spotlight Ad Index Assembly Insider Technical Abstracts Circuits Assembly - October 2008 Circuits Assembly - October 2008 - Circuits Assembly - September 2008 (Page Cover1) Circuits Assembly - October 2008 - Circuits Assembly - September 2008 (Page Cover2) Circuits Assembly - October 2008 - Circuits Assembly - September 2008 (Page 1) Circuits Assembly - October 2008 - Circuits Assembly - September 2008 (Page 2) Circuits Assembly - October 2008 - Contents (Page 3) Circuits Assembly - October 2008 - Letters (Page 4) Circuits Assembly - October 2008 - Letters (Page 5) Circuits Assembly - October 2008 - Caveat Lector (Page 6) Circuits Assembly - October 2008 - Caveat Lector (Page 7) Circuits Assembly - October 2008 - Industry News (Page 8) Circuits Assembly - October 2008 - Industry News (Page 9) Circuits Assembly - October 2008 - Industry News (Page 10) Circuits Assembly - October 2008 - Industry News (Page 11) Circuits Assembly - October 2008 - Industry News (Page 12) Circuits Assembly - October 2008 - Industry News (Page 13) Circuits Assembly - October 2008 - Market Watch (Page 14) Circuits Assembly - October 2008 - Market Watch (Page 15) Circuits Assembly - October 2008 - Talking Heads (Page 16) Circuits Assembly - October 2008 - Talking Heads (Page best1) Circuits Assembly - October 2008 - Talking Heads (Page best2) Circuits Assembly - October 2008 - Global Sourcing (Page 17) Circuits Assembly - October 2008 - Screen Printing (Page 18) Circuits Assembly - October 2008 - Screen Printing (Page 19) Circuits Assembly - October 2008 - Better Manufacturing (Page 20) Circuits Assembly - October 2008 - Better Manufacturing (Page 21) Circuits Assembly - October 2008 - Better Manufacturing (Page 22) Circuits Assembly - October 2008 - Better Manufacturing (Page 23) Circuits Assembly - October 2008 - 'Checking Up' on Medical Electronics (Page 24) Circuits Assembly - October 2008 - 'Checking Up' on Medical Electronics (Page 25) Circuits Assembly - October 2008 - 'Checking Up' on Medical Electronics (Page 26) Circuits Assembly - October 2008 - 'Checking Up' on Medical Electronics (Page 27) Circuits Assembly - October 2008 - Solder Ball Attachment Using Laser Soldering (Page 28) Circuits Assembly - October 2008 - Solder Ball Attachment Using Laser Soldering (Page 29) Circuits Assembly - October 2008 - Solder Ball Attachment Using Laser Soldering (Page 30) Circuits Assembly - October 2008 - Solder Ball Attachment Using Laser Soldering (Page 31) Circuits Assembly - October 2008 - Improving QFN Reliability (Page 32) Circuits Assembly - October 2008 - Improving QFN Reliability (Page 33) Circuits Assembly - October 2008 - Reflow Soldering (Page 34) Circuits Assembly - October 2008 - Tech Tips (Page 35) Circuits Assembly - October 2008 - Test and Inspection (Page 36) Circuits Assembly - October 2008 - Test and Inspection (Page 37) Circuits Assembly - October 2008 - Process Doctor (Page 38) Circuits Assembly - October 2008 - Pb-Free Lessons Learned (Page 39) Circuits Assembly - October 2008 - Alternative Energies (Page 40) Circuits Assembly - October 2008 - Alternative Energies (Page 41) Circuits Assembly - October 2008 - Eastern Advances (Page 42) Circuits Assembly - October 2008 - Eastern Advances (Page 43) Circuits Assembly - October 2008 - Product Spotlight (Page 44) Circuits Assembly - October 2008 - Product Spotlight (Page 45) Circuits Assembly - October 2008 - Ad Index (Page 46) Circuits Assembly - October 2008 - Assembly Insider (Page 47) Circuits Assembly - October 2008 - Technical Abstracts (Page 48) Circuits Assembly - October 2008 - Technical Abstracts (Page Cover3) Circuits Assembly - October 2008 - Technical Abstracts (Page Cover4)
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