Circuits Assembly - October 2008 - (Page 46)

Ad Index ADVERTISER INFO: To learn about the advertisers in this issue, go to circuitsassembly.com and select “Advertiser Index” in the gray horizontal menu bar at the top of the page. This will provide you with direct links to the home or product pages of each advertiser in this index. Company Page No. SPOTLIGHT No-Clean Pb-free Solder Paste DSP862 is said to have a broad processing window and accommodates a range of applications. Complies with ROL0 IPC and IPC Class III. Available in standard form as well as green for SAC and most other Pb-free alloys. Has brick definition, extended stencil life and “response-to-pause” time. Provides print speed window from 25 to 150 mm/ sec. Handles CSP and QFN on Pb-free board finishes, OSP, immersion Ag, immersion Sn, ENIG and LF HASL. Reportedly will perform for at least 8 hr. of continuous printing. Is said to yield no or low solder beading and solder bridging. PWB assemblies in both air and nitrogen reflow using straight ramp or soak profiles up to 200°C. Tack life said to be greater than 48 hr. Qualitek International Inc., qualitek.com Product Assembléon, www.assembleon.com/facts . . . . . . . . . . . . . . . . . . C4 Bare Board Group, www.bareboard.com. . . . . . . . . . . . . . . . . . . . 47 BEST, Inc., www.solder.net . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Cookson Electronic Assembly Materials, www.cooksonelectronics.com . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 CyberOptics, www.cyberoptics.com . . . . . . . . . . . . . . . . . . . . . . . 11 Digi-Key, www.digikey.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 DYMAX Corporation, www.dymax.com . . . . . . . . . . . . . . . . . . . . . 25 ERSA, www.ersa.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . C2 Grid-Lok, www.grid-lok.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Imagineering, Inc., www.pcbnet.com . . . . . . . . . . . . . . . . . . . . . . 1 Indium Corporation of America, www.indium.com . . . . . . . . . . . . 7 JETPCB Inc., www.jetpcb.com . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 MEPTEC, www.meptec.org . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Mexitronica 2008, www.mexitronica.com . . . . . . . . . . . . . . . . . . . 43 Miller-Stephenson Chemical Co., www.miller-stephenson.com . . 29 MIRTEC Corp., www.mirtecusa.com . . . . . . . . . . . . . . . . . . . . . . . 19 Mydata Automation, www.mydata.com . . . . . . . . . . . . . . . . . . . . C3 Nihon Superior Co., Ltd., www.nihonsuperior.co.jp . . . . . . . . . . . 15 Northern Electronics Automation (NEA), www.neainc.com. . . . . 23 P. Kay Metal, Inc., www.pkaymetal.com . . . . . . . . . . . . . . . . . . . . 23 Precision Placement Machines, Inc., www.goppm.com . . . . . . . . 47 SEHO Systems GmbH, www.seho.de . . . . . . . . . . . . . . . . . . . . . . . 31 Service Excellence Awards, circuitsassembly.com/sea. . . . . . . . . 41 Speedline Technologies, www.speedlinetech.com . . . . . . . . . . . . 5 Virtual PCB, www.virtual-pcb.com . . . . . . . . . . . . . . . . . . . . . . . . 22 VJ Electronix, www.vjelectronix.com . . . . . . . . . . . . . . . . . . . . . . . 21 Rosin-, Halide-Free Flux 355-35 no-clean, Bellcore-compliant liquid flux is a rosin-free, halide-free, halogen-free, VOC-free flux designed for high-temperature Pb-free applications. Is said to promote fast wetting and maximum wetting spread; eliminates skips and shorts in wave solder assembly. Designed for spray applications. Delivers topside hole fill with OSP-coated bare copper boards. Qualitek International Inc., qualitek.com Conformal Coat Adhesion Promotion AdPro Plus is said to increase adhesion between Parylene conformal coatings and various substrates. Reportedly improves adhesion of Parylene to materials such as titanium, stainless steel, gold, chromium, Santoprene, polyimide, polycarbonate and solder mask. Has demonstrated improved stability at elevated temperatures. Specialty Coating Systems, scscoatings. com Large Board Undersupport VacuNest shape memory board support is said to handle large board products up to 450 x 450 mm, including backplanes, solar and fuel cell panels and multiple substrate printing. Designed to eliminate problems associated with conventional dedicated or programmable pin tooling systems. Each module consists of a pliable, anti-static chamber containing a foam former surrounded by polymer granules. The chamber can be profiled to match the contours of different populated board undersides. Under vacuum, that profile can be locked into place indefinitely without shrinkage. Releasing the vacuum, manufacturers can reset the nest as an elastic material brings the chamber back to its original position. Novatec EAP, novatec-eap.com Acrylic Conformal Coating Turbo-Coat is designed to speed board production throughput without additional UV systems or other capital equipment. Is said to dry tack-free in 3 min.; full cure achieved in 10 min. with elevated temperatures. Can be sprayed or brushed; boards can be dipped directly. One-pass application; IPC-CC-830 and MIL-I-46058C tested; UL94 V-0 rated; UV indicator for black light QC inspection; MEK, Toluene and Xylene-Free; adjustable spray head. Techspray, techspray.com Advertising Sales North UP Media Group, Inc. America: 2400 Lake Park Drive, Suite 440 Smyrna, GA 30080 Susan Jones Group Sales Director, (404) 822-8900 email: sjones@upmediagroup.com Krista Fabian Sales Associate, (678) 589-8840 email: kfabian@upmediagroup.com Low Foaming Defluxer Bioact EC-88 is made with AquaEdge technology. Is recommended for cleaning Pbfree, no-clean and high-temperature solder pastes. Is said to have high flux loading capacity, low foaming property and low environmental impact. Used with aqueous spray equipment. Petroferm, petroferm.com Green Pb-Free Solder Paste Green Paste is said to help eliminate crosscontamination between leaded and Pb-free boards in a mixed production environment. Is visually green, permitting operators to distinguish it from gray-colored SnPb paste. Color remains until reflowed, leaving normal metallic joint appearance. Residues are clear, but fluoresce under black light. Available in SAC 305, Sn100e for no-clean and water- Asia: Korea: Young Media, 82 2 756 4819 email: ymedia@ymedia.co.kr 46 Circuits Assembly OCTOBER 2008 circuitsassembly.com http://www.circuitsassembly.com http://www.assembleon.com/facts http://www.bareboard.com http://www.solder.net http://www.cooksonelectronics.com http://www.cyberoptics.com http://www.digikey.com http://www.dymax.com http://www.qualitek.com http://www.ersa.com http://www.grid-lok.com http://www.pcbnet.com http://www.indium.com http://www.jetpcb.com http://www.qualitek.com http://www.meptec.org http://www.mexitronica.com http://www.miller-stephenson.com http://www.mirtecusa.com http://www.mydata.com http://www.nihonsuperior.co.jp http://www.neainc.com http://www.pkaymetal.com http://www.goppm.com http://www.seho.de http://www.circuitsassembly.com/sea http://www.speedlinetech.com http://www.techspray.com http://www.virtual-pcb.com http://www.novatec-eap.com http://www.vjelectronix.com http://www.petroferm.com http://www.circuitsassembly.com

Table of Contents Feed for the Digital Edition of Circuits Assembly - October 2008

Circuits Assembly - September 2008 Contents Letters Caveat Lector Industry News Market Watch Talking Heads Global Sourcing Screen Printing Better Manufacturing 'Checking Up' on Medical Electronics Solder Ball Attachment Using Laser Soldering Improving QFN Reliability Reflow Soldering Tech Tips Test and Inspection Process Doctor Pb-Free Lessons Learned Alternative Energies Eastern Advances Product Spotlight Ad Index Assembly Insider Technical Abstracts

Circuits Assembly - October 2008

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