Circuits Assembly - October 2008 - (Page 47) Special Advertising Section Assembly Insider soluble flux types, and others. Qualitek International Inc., qualitek. com Instant Online Quotes, Day or Night SPECIAL LIMITED-TIME PROMOTION Delivered, all testing and shipping included: Single/Double-Sided $79.99 1st piece $29.99 up to 5th piece allow 7 working days Real-Time Thermal Profile Updating Explorer thermal profiler comes in radio frequency version that beams profile data in real-time to the computer, as the profiler runs through the reflow oven or wave solder machine. Instantly shows what is going on with the process. There is said to be less potential stress to the profiler or production board; any over-temp situation is instantly revealed. Alerts operator to such pitfalls as forgetting to turn on prior to a run; when a TC pops off; wrong oven recipe, and when profiler gets stuck in the oven tunnel. KIC, kicthermal.com Even One Piece, We Care!! 4-Layer $129.99 1st piece $79.99 up to 5th piece allow 8 working days 6-Layer $149.99 1st piece $99.99 up to 5th piece allow 9 working days Based on standard specifications. See the HOME page and Calculate for other options. Register to receive other special promotions. www.jetpcb.com/eng VISIT For anWWW.JETPCB.COM/ENG instant PCB Quote visit FOR OTHER PROMOTIONAL www.pcbjet.com/eng LOW-COST PCB PROTOTYPES Sn-Based Solder SN100e Pb-free solder is manufactured from tin, copper and cobalt. Is RoHScompliant and reportedly reduces copper dissolution. Is said to provide brighter, shinier solder joints compared to SAC alloys. Is compatible with all SAC and SnCu alloys. Performs with ENIG, immersion tin, immersion silver, OSP, and HAL board finishes. Meets requirements of J-STD-006. Qualitek International, qualitek.com Continued from pg. 34 Flex Handler for Pickand-Place The FLX2011-MKL placement machine now comes with a twin vacuum table said to ease flex board and film substrate handling; reportedly doubles productivity. Is twice the size of the former table, with ends that protrude from both sides of the placement machine. Features a pneumatic servo drive said to move easily and without vibration. Has a working area of 31.5” x 23.6”. Essemtec, essemtec.com After longer production periods, one is able to decide whether the decision was correct. It is, therefore, a good choice to have an oven that can switch easily from air to nitrogen. Reflow ovens are set up to achieve <100 ppm throughout the tunnel. The more nitrogen used, the higher the system lifecycle cost. To reduce nitrogen consumption, ppm levels should be optimized and nitrogen applied only in critical zones of the reflow oven: end of soak zone, peak zones and first cooling zones where the assemblies are sensitive to oxidation. The optimal ppm levels depend on the application. An internal study1 suggested ppm level up to 2500 ppm. n References 1. U. Marquez, D. Barbini and W. Enroth, “Impact of Soldering Atmosphere on Solder Joint Formation,” SMTA Pan Pacific Symposium, January 2008. Email: ppm@goppm.com or Call: 603.895.5112 circuitsassembly.com Circuits Assembly OCTOBER 2008 47 http://www.bareboard.com http://www.jetpcb.com/eng http://www.bareboard.com http://www.kicthermal.com http://www.jetpcb.com/eng http://www.qualitek.com http://www.goppm.com http://www.essemtec.com http://www.circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - October 2008 Circuits Assembly - September 2008 Contents Letters Caveat Lector Industry News Market Watch Talking Heads Global Sourcing Screen Printing Better Manufacturing 'Checking Up' on Medical Electronics Solder Ball Attachment Using Laser Soldering Improving QFN Reliability Reflow Soldering Tech Tips Test and Inspection Process Doctor Pb-Free Lessons Learned Alternative Energies Eastern Advances Product Spotlight Ad Index Assembly Insider Technical Abstracts Circuits Assembly - October 2008 Circuits Assembly - October 2008 - Circuits Assembly - September 2008 (Page Cover1) Circuits Assembly - October 2008 - Circuits Assembly - September 2008 (Page Cover2) Circuits Assembly - October 2008 - Circuits Assembly - September 2008 (Page 1) Circuits Assembly - October 2008 - Circuits Assembly - September 2008 (Page 2) Circuits Assembly - October 2008 - Contents (Page 3) Circuits Assembly - October 2008 - Letters (Page 4) Circuits Assembly - October 2008 - Letters (Page 5) Circuits Assembly - October 2008 - Caveat Lector (Page 6) Circuits Assembly - October 2008 - Caveat Lector (Page 7) Circuits Assembly - October 2008 - Industry News (Page 8) Circuits Assembly - October 2008 - Industry News (Page 9) Circuits Assembly - October 2008 - Industry News (Page 10) Circuits Assembly - October 2008 - Industry News (Page 11) Circuits Assembly - October 2008 - Industry News (Page 12) Circuits Assembly - October 2008 - Industry News (Page 13) Circuits Assembly - October 2008 - Market Watch (Page 14) Circuits Assembly - October 2008 - Market Watch (Page 15) Circuits Assembly - October 2008 - Talking Heads (Page 16) Circuits Assembly - October 2008 - Talking Heads (Page best1) Circuits Assembly - October 2008 - Talking Heads (Page best2) Circuits Assembly - October 2008 - Global Sourcing (Page 17) Circuits Assembly - October 2008 - Screen Printing (Page 18) Circuits Assembly - October 2008 - Screen Printing (Page 19) Circuits Assembly - October 2008 - Better Manufacturing (Page 20) Circuits Assembly - October 2008 - Better Manufacturing (Page 21) Circuits Assembly - October 2008 - Better Manufacturing (Page 22) Circuits Assembly - October 2008 - Better Manufacturing (Page 23) Circuits Assembly - October 2008 - 'Checking Up' on Medical Electronics (Page 24) Circuits Assembly - October 2008 - 'Checking Up' on Medical Electronics (Page 25) Circuits Assembly - October 2008 - 'Checking Up' on Medical Electronics (Page 26) Circuits Assembly - October 2008 - 'Checking Up' on Medical Electronics (Page 27) Circuits Assembly - October 2008 - Solder Ball Attachment Using Laser Soldering (Page 28) Circuits Assembly - October 2008 - Solder Ball Attachment Using Laser Soldering (Page 29) Circuits Assembly - October 2008 - Solder Ball Attachment Using Laser Soldering (Page 30) Circuits Assembly - October 2008 - Solder Ball Attachment Using Laser Soldering (Page 31) Circuits Assembly - October 2008 - Improving QFN Reliability (Page 32) Circuits Assembly - October 2008 - Improving QFN Reliability (Page 33) Circuits Assembly - October 2008 - Reflow Soldering (Page 34) Circuits Assembly - October 2008 - Tech Tips (Page 35) Circuits Assembly - October 2008 - Test and Inspection (Page 36) Circuits Assembly - October 2008 - Test and Inspection (Page 37) Circuits Assembly - October 2008 - Process Doctor (Page 38) Circuits Assembly - October 2008 - Pb-Free Lessons Learned (Page 39) Circuits Assembly - October 2008 - Alternative Energies (Page 40) Circuits Assembly - October 2008 - Alternative Energies (Page 41) Circuits Assembly - October 2008 - Eastern Advances (Page 42) Circuits Assembly - October 2008 - Eastern Advances (Page 43) Circuits Assembly - October 2008 - Product Spotlight (Page 44) Circuits Assembly - October 2008 - Product Spotlight (Page 45) Circuits Assembly - October 2008 - Ad Index (Page 46) Circuits Assembly - October 2008 - Assembly Insider (Page 47) Circuits Assembly - October 2008 - Technical Abstracts (Page 48) Circuits Assembly - October 2008 - Technical Abstracts (Page Cover3) Circuits Assembly - October 2008 - Technical Abstracts (Page Cover4)
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