Circuits Assembly - November 2008 - (Page 3)

Broadband Printing Suggestions, pg. 22 NOVEMBER 2008 circuitsassembly.com Inside That Counts How the RoHS transition is driving better process traceability, even for medical devices It’s What’s NOVEMBER 2008 – Vol. 19 No. 11 Celestica Gets Small Why ‘Small-Sized’ Doesn’t Have to Mean ‘No Service’ Shrink Holes FIRST PERSON 6 Caveat Lector Fakes get high-tech. Mike Buetow FEATURES COVER STORY ON THE COVER: As RoHS spreads its reach, implantable medical devices will eventually need to go Pb-free too. 16 Talking Heads Celestica’s Dave Ellison and Peter Tomaiuolo. Mike Buetow 26 RoHS Conversion for Medical Devices Product marketing and component supply chain concerns are pushing many medical companies to assess RoHS conversion. Either way, companies face risks. The risks and considerations to take into account include tin whisker mitigation, analysis and criteria / rating methods; design changes and verification; material availability and cost; and component obsolescence and sourcing. By Kim Sharpe MONEY MATTERS 18 Focus on Business Defining the service package. Susan Mucha Value-Add Service TECH TALK 20 On the Forefront R&D not on P/L. E. Jan Vardaman 34 Supporting Full-Service Customer Requirements at the Regional EMS Level OEMs, especially in medical, automotive, avionics and defense, want greater levels of valueadded support from EMS providers. And the transition to RoHS manufacturing is driving a need for better process traceability to support OEM studies of the impact of new processes on longterm product reliability. This article discusses typical OEM process traceability requirements; strategies for automating process monitoring and real-time corrective action throughout the SMT process; benefits of the Process Window Index (PWI) in a multi-customer manufacturing environment; and examples of ways OEMs can team with EMS firms to translate improved process visibility to improved product quality. By Jeff Roberts 22 Screen Printing Broadband printing suggestions. Dr. Rita Mohanty 25 Better Manufacturing The education foundation. Peter Grundy Milwaukee Electronics Co. 38 Tech Tips Wirebonder pattern recognition. American Competitiveness Institute 36 Speed Thrills MEC is distinct for its extreme use of Lean at all points within the facilities; the depth of consideration to the roadblocks–not just to process flow, but to customer deliverables; and a startling emphasis on understanding the role marketing plays in customers’ strategies. By Mike Buetow 39 Wave Soldering Don’t shrink from these holes. Ursula Marquez de Tino This month at PCDandF.com PCB West Review: An Interview with NBS Design President Craig Arcuri talks about the company credo: passion, quality and speed that translates into end-product perfection. By Kathy Nargi-Toth 40 Process Doctor Applications of FTIR. Terry Munson 42 Pb-Free Lessons Learned A mystery no longer. Chrys Shea NEW! 43 The Defects Database Defect analysis, online and interactive. Dr. Davide Di Maio The Influence of Final Finish on Lead-Free Assembly Reliability Understanding a PCB’s intended end-use is critical in solderable final finish selection for Pb-free applications. By Mohammad Hossain, Nikhil Lakhkar, Puligandla Viswanadham and Dereje Agonafer 44 Getting Lean “Wave” goodbye. By Chris Munroe 45 Materials World Phase change materials. Dr. Renzhe Zhao 48 Technical Abstracts DEPARTMENTS 8 Industry News 14 Market Watch 46 Product Spotlight 46 Ad Index 47 Assembly Insider Cover illustration by Max Delson http://www.PCDandF.com

Table of Contents Feed for the Digital Edition of Circuits Assembly - November 2008

Circuits Assembly - November 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Focus on Business On the Forefront Screen Printing Better Manufacturing RoHS Conversion for Medical Devices Supporting Full-Service Customer Requirements at the Regional EMS Level Speed Thrills Tech Tips Wave Soldering Process Doctor Pb-Free Lessons Learned The Defects Database Getting Lean Materials World Product Spotlight Ad Index Assembly Insider Technical Abstracts

Circuits Assembly - November 2008

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