Circuits Assembly - November 2008 - (Page 32)

Figure 3. Relabeled component. Cover Story Figure 5. Suspect lot reel label. Blue box: RoHS lettering/logo center Figure 4. Component package marking for an AMD AM7969in date Suspect lot reel Figure 5.Receiver; however, the dies were an Figure 4. Component package marking for an AMD AM7969-125JC code marking. label. Blue Box: RoHS lettering/logo center 125JC receiver; however, the dies were an AM7968-125JC transjustified. Red Box: No period after C Blue code RoHS lettering/logo center Figure AM7968-125JC transmitter and an unit. mitter and an NEC PD71051 serial controlNEC PD71051 serial control unit. 5. Suspect lot reel label.in date box: marking. in date code marking. • Sheet metal and enclosure drawings. • Plastic materials and enclosure drawings. • Cable and connector drawings. The OEM needs to make it clear to the supplier that compliance is required and the appropriate supporting documentation is available. Many aspects of a documentation system are also affected: • Ability to roll up component and BoM data to confirm product compliance. The OEM should determine if this could be done within the current Product Data Management (PDM) software. • Supplier purchase order (PO) terms and agreements should reflect compliance requirements. • Methods to request, capture and validate supplier compliance data. • Methods to store supplier material declarations at a component level. • Process to handle supplier certificate of compliance with each shipment. • Process at incoming inspection to identify compliance requirements and methods to measure. • Methods to monitor production processes in assembly manufacturing. • Process for handling field service units to identify which products are RoHS-compliant and have appropriate repair materials available. • Methods for approval, purchase and inspection of brokersourced parts. Counterfeit components have long been a problem in electronics, but lately, part counterfeiters are becoming more technically savvy. In the past, most counterfeit parts have been passives; however, now counterfeit semiconductors can be found. The level of sophistication in the packaging and labeling of counterfeit parts is alarming (Figures 1 to 4). OEMs must have special procedures for handling broker parts. Figures 5 to 8 demonstrate labeling issues and the subtle differences between the confirmed vendor’s label and the counterfeit label. Three items were identified: 1) The RoHS label should be left-justified (Figure 5), while the counterfeit was centered; 2) there should be a period after “D.C.” (date code) (Figure 6); and 3) the “H” in the reel batch lot line was not detected by the barcode scanner (Figures 7 and 8, online). 32 Circuits Assembly NOVEMBER 2008 Figure 6. Vendor A sourced reel label. Blue box: RoHS lettering/logo Figure 6. Red box: Period after C in date code marking. left justified.Vendor A sourced reel label. Blue box: RoHS lettering/logo C in date code marking. Due Diligence A sourced reel label. Blue box: RoHS lettering/logo Figure 6. Vendor Establishing due diligence to monitoring and controlling operaC in date code marking. tions is critical in the event a noncompliant product reaches the market and is identified by a governmental agency. The UK works with a number of EU member states on defining the approach for due diligence. For example, the Department of Trade and Industry’s “RoHS Regulations, Government Guidant Note,” of June 2006, Annex D, further defines methods. The Figure 7. Suspect lot reel batch lot line. The laser scanner result for th OEM must demonstrate compliance by providing satisfactory Z210548U387. The (H) at the beginning of the line was not in the barc evidence in the form of relevant technical documentation. The Figure 7. Suspect lot reel batch lot line. The laser scanner result for th approach is self-declaration with the enforcement authority conZ210548U387. The (H) at the beginning of the line was not in the barc ducting market surveillance by testing products. OEMs should consider material declarations and material analysis as good methods for technical documentation. In Annex D, guidance is provided for material analysis based on the OEM’s confidence in the supplier’s material declaration, supplier qualification and the potential risk of the material containing a restricted substance based on historical data. This supplier documentation should be maintained for up to four years.7 A due diligence process should be defined within your organization to help ensure compliance. One method is to base this process on a “trust, but verify” approach. It begins with capturing the product documentation for compliance. This information is stored and internal flags are set so the appropriate procedures are followed to handle this compliant material. This involves many areas, ranging from purchasing, incoming, warehouse, kit-pull, production and shipping. XRF is a key capability deployed at a number of process steps. At a minimum, this is used at incoming inspection, process monitoring (i.e., soldering materials) and shipping. Some considerations when using XRF include a method to handle failures because of exempt product (i.e., lead in glass) and failures due to supplier issues. Methods should quickly identify exempt failures, which can be ignored, versus legitimate failures as a result of supplier issues. The procedures circuitsassembly.com http://www.circuitsassembly.com

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Circuits Assembly - November 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Focus on Business On the Forefront Screen Printing Better Manufacturing RoHS Conversion for Medical Devices Supporting Full-Service Customer Requirements at the Regional EMS Level Speed Thrills Tech Tips Wave Soldering Process Doctor Pb-Free Lessons Learned The Defects Database Getting Lean Materials World Product Spotlight Ad Index Assembly Insider Technical Abstracts

Circuits Assembly - November 2008

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