Circuits Assembly - November 2008 - (Page 44) Getting Lean Leaning the Line How a high-mix EMS firm “waved” goodbye to one soldering machine. factor in EPIC Technologies’ adoption of Lean manufacturing principles is to ensure aspects such as floor space and utilization are considered. Eliminating work-in-process (WIP) translates to faster throughput and enhanced scheduling flexibility. In addition, floor space is freed as WIP and inventory are reduced. However, the company took equipment and floor space optimization one step further by teaming with a wave soldering equipment manufacturer in adapting a comprehensive wave soldering system capable of both lead and Pb-free wave soldering. The result was a duplex wave solution that supports both lead and Pb-free solder processes, while ensuring rapid changeover between the processes. The system architecture adapts to Lean methodologies, saving floor space, utilities and resources. The duplex wave is a carrier-based system. Unlike board finger conveyors, the machine has a palletized conveyor that requires a carrier to transport product. There are costs associated with the carriers, but to minimize this, universal tooling has been designed for standard PCB array sizes. The carrier-based system also has a large benefit in that it permits multiple products to be soldered collectively without system changeover. This is extremely important to minimize batch sizing in front of the wave, increasing system utilization and efficiency as a whole. However, with the duplex wave option, this only applies to the solder process currently set up on the system. A switch remains to convert the system from lead to Pb-free and vice-versa. This process takes five to 10 minutes to purge product from the line and exchange wave solder pots. As a result, Pb-free assemblies are run as a batch process. Each carrier is bar-coded with a unique ID that links to the duplex system for total profile control. A barcode reader on the conveyor signals the machine’s computer to change profiles as different products approach the input. The barcode system also serves as a control point to ensure the correct solder process is selected for the product to be soldered. If the wrong barcode is received, the system will lock down the input and flag the error to the operator, never permitting an incorrect board-profile interaction. Once the barcode is verified and accepted, and the product enters the machine, flux is applied based on the control settings for the product. The area and volume are predetermined during engineering development with control based on product complexity. The machine offers a dual spray fluxing option to allow users the ability to select a secondary flux type. This Circuits Assembly NOVEMBER 2008 A Figure 1. An operator places a pallet on the conveyorized line in EPIC Technologies’ Juarez facility. Chris Munroe is director of engineering at EPIC Technologies (epictech.com); chris. munroe@epictech. com. His column appears bimonthly. feature has not been necessary, as EPIC is utilizing a VOC-free, no-clean flux formula capable of lead, Pbfree, no-clean and water-wash applications. After flux application, the carbon-based preheat elements are used to heat the assembly to the prescribed topside temperature. An IR pyrometer is used to measure board temperature during preheat. Closedloop controls automatically adjust heat settings for the product based on IR readings and convection temperatures. With the duplex wave, only one solder pot is available for production use at a given time. The second wave remains in a liquid standby state outside the conveyance in an enclosed chamber sealed within the main unit. Each solder pot contains a dual wave system, including chip and Lambda operations. Although consistent with standard wave systems, the Lambda wave includes agitation properties to improve solder quality. This agitation permits the Lambda wave to penetrate into selective wave pallets, further enhancing the machine’s ability to selective solder. Pros and cons. Improving floor space is a major factor in Lean, and it is easy to see the advantage of reducing from two wave systems to support lead and Pb-free production to a single, comprehensive unit. History also tells us effective utilization of conveyance and carriers can permit multiple wave systems to be consolidated to one. EPIC’s volume production facilities in Juarez, Mexico, run in excess of 20,000 assemblies per day across a single wave. This is not a challenge with an assembly line dedicated to a single product. However, the product mix contains more than 40 different assemblies. With this system, there are zero changeovers because of the conveyance system flexibility. The need for 40 or more changeovers on wave systems of the past would significantly impact operational efficiency. Continued on pg. 45 44 circuitsassembly.com http://www.epictech.com http://www.circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - November 2008 Circuits Assembly - November 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Focus on Business On the Forefront Screen Printing Better Manufacturing RoHS Conversion for Medical Devices Supporting Full-Service Customer Requirements at the Regional EMS Level Speed Thrills Tech Tips Wave Soldering Process Doctor Pb-Free Lessons Learned The Defects Database Getting Lean Materials World Product Spotlight Ad Index Assembly Insider Technical Abstracts Circuits Assembly - November 2008 Circuits Assembly - November 2008 - Circuits Assembly - November 2008 (Page Cover1) Circuits Assembly - November 2008 - Circuits Assembly - November 2008 (Page Cover2) Circuits Assembly - November 2008 - Circuits Assembly - November 2008 (Page 1) Circuits Assembly - November 2008 - Circuits Assembly - November 2008 (Page 2) Circuits Assembly - November 2008 - Contents (Page 3) Circuits Assembly - November 2008 - Contents (Page 4) Circuits Assembly - November 2008 - Contents (Page 5) Circuits Assembly - November 2008 - Caveat Lector (Page 6) Circuits Assembly - November 2008 - Caveat Lector (Page 7) Circuits Assembly - November 2008 - Industry News (Page 8) Circuits Assembly - November 2008 - Industry News (Page 9) Circuits Assembly - November 2008 - Industry News (Page 10) Circuits Assembly - November 2008 - Industry News (Page 11) Circuits Assembly - November 2008 - Industry News (Page 12) Circuits Assembly - November 2008 - Industry News (Page 13) Circuits Assembly - November 2008 - Market Watch (Page 14) Circuits Assembly - November 2008 - Market Watch (Page 15) Circuits Assembly - November 2008 - Talking Heads (Page 16) Circuits Assembly - November 2008 - Talking Heads (Page 17) Circuits Assembly - November 2008 - Focus on Business (Page 18) Circuits Assembly - November 2008 - Focus on Business (Page 19) Circuits Assembly - November 2008 - On the Forefront (Page 20) Circuits Assembly - November 2008 - On the Forefront (Page 21) Circuits Assembly - November 2008 - Screen Printing (Page 22) Circuits Assembly - November 2008 - Screen Printing (Page 23) Circuits Assembly - November 2008 - Screen Printing (Page 24) Circuits Assembly - November 2008 - Better Manufacturing (Page 25) Circuits Assembly - November 2008 - RoHS Conversion for Medical Devices (Page 26) Circuits Assembly - November 2008 - RoHS Conversion for Medical Devices (Page 27) Circuits Assembly - November 2008 - RoHS Conversion for Medical Devices (Page 28) Circuits Assembly - November 2008 - RoHS Conversion for Medical Devices (Page 29) Circuits Assembly - November 2008 - RoHS Conversion for Medical Devices (Page 30) Circuits Assembly - November 2008 - RoHS Conversion for Medical Devices (Page 31) Circuits Assembly - November 2008 - RoHS Conversion for Medical Devices (Page 32) Circuits Assembly - November 2008 - RoHS Conversion for Medical Devices (Page 33) Circuits Assembly - November 2008 - Supporting Full-Service Customer Requirements at the Regional EMS Level (Page 34) Circuits Assembly - November 2008 - Supporting Full-Service Customer Requirements at the Regional EMS Level (Page 35) Circuits Assembly - November 2008 - Speed Thrills (Page 36) Circuits Assembly - November 2008 - Speed Thrills (Page 37) Circuits Assembly - November 2008 - Tech Tips (Page 38) Circuits Assembly - November 2008 - Wave Soldering (Page 39) Circuits Assembly - November 2008 - Process Doctor (Page 40) Circuits Assembly - November 2008 - Process Doctor (Page 41) Circuits Assembly - November 2008 - Pb-Free Lessons Learned (Page 42) Circuits Assembly - November 2008 - The Defects Database (Page 43) Circuits Assembly - November 2008 - Getting Lean (Page 44) Circuits Assembly - November 2008 - Materials World (Page 45) Circuits Assembly - November 2008 - Ad Index (Page 46) Circuits Assembly - November 2008 - Assembly Insider (Page 47) Circuits Assembly - November 2008 - Technical Abstracts (Page 48) Circuits Assembly - November 2008 - Technical Abstracts (Page Cover3) Circuits Assembly - November 2008 - Technical Abstracts (Page Cover4)
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