Circuits Assembly - November 2008 - (Page 45) 导热材料的选择 随着当今快速发展的电子器件对导热性能要求 的提高,封装技术也在不断更新以提供各种方法 来满足相应的需求。不同的产品应用,客户的主 观意向,及不同的产品性能要求直接决定了不同 的材料种类的选择。但是,所有的应用都有一个 共同点,那就是随着器件的体积越来越小及功能 越 来 越强 大, 产生的热量越来越多,因此对有 效 的 热传 导性 能的需求比以往更为苛刻,特别 是TIM2 水平。为了能给客户提供更适用的,价 格更实惠的产品来满足不同应用和用户的不同需 求,行业领导地位的公司已经研发出一套完整的 解决方案来满足众多不同的要求。 传统的热导介质有两种:导热油脂或膏,或固 态导热衬垫。固态导热衬垫以其易于应用及具有 长期稳定性的特点得以广泛应用,与之相比,导 热油脂或膏则可提供更好的润湿性,因此获得更 好的总体导热性能。但是,选择哪种类型的材料 往往取决于多种因素:对某种材料的信任度,最 重要的性能指标,当然还有价格。一种基于薄膜 技术的导热相变材料的应用正变得越来越广泛, 这种材料在常温下是固态,但随着器件温度的升 高而逐渐融化为液态。这些高效及易于使用的特 点使相变材料得以广泛的应用。 Continued from pg. 44 Materials World The carrier-based configuration also adds the benefit of selective soldering. Masking pallets can be designed to protect sensitive components or masking areas from the solder bath. Tight control on pallet designs and materials have proven successful in wave soldering LCD and sensitive LED technologies, ensuring peak temperature limits are not exceeded on the components. The added benefit of the masking pallet also adds value for part numbers with tight design constraints. Double-sided SMT and through-hole wave solder can be accomplished with little restriction to the board layout. Top- and bottom-side through-hole soldering can be accomplished with component heights greater than 5.5 mm, and selective soldering of both assembly sides. DfM is made easier through use of masking pallets. Point style selective soldering systems can do the same, but adding processes to an assembly cycle is not always the most feasible solution. There are materials, environmental and energy savings as well. The benefits of Lean manufacturing can be enhanced significantly when production and engineering teams think outside the box. Partnering and working alongside equipment suppliers can lead to considerable cost benefits over time for manufacturers that drive and implement these improvements. n circuitsassembly.com 虽然相变薄膜材料以其高性能而著称,但它也 有一些缺陷。薄膜的厚度虽有很多种,可是比较 薄的薄膜其生产工艺比较困难而且通常难于从薄 膜衬垫完全剥离。为了克服这些障碍,一项新的 使用液态配方的技术随之诞生。此新型的液态配 方兼顾了原来液态油脂所有的优点比如较好的应 用性和较高的产出量,并且避免了液态油脂在一 些应用上的缺陷。这种新型的液态配方可以像胶 水一样运用点胶和丝网印刷的工艺使用,随着时 间的延续,此产品会由液态慢慢变干而逐渐演变 为相变薄膜。此种新材料兼具了薄膜相变材料的 良好的长期可靠性能和应用性能,并且由于其初 始的液态形式,所以其厚度可以随着应用的不同 而任意调节。在应用方面,可以采用全自动生产 来增加产出率,并且生产厂家可以沿用现有的生 产设备如普通的点胶和丝网印刷设备。此外,液 态形式的相变材料具有很好的润湿性并可以填充 由于器件基体表面高低不同而产生的空洞,因此 它可提供针对表面平整性的有效控制。对于一些 更喜欢液态材料并又期待薄膜材料的性能优点的 厂商,这种新产品为其提供了一个理想的选择。 对于那些倾向于使用导热油脂的厂家,这种新 的材料具有类似于导热油脂的性能,容易补偿由 于粗糙的界面所产生的空洞,所以为那些有平整 性或共面性问题的器件提供了一个好的解决方 案。然而相变液体必须经过一个附加的步骤才能 获得所期望的性能,与之相比,导热油脂则在应 用之后马上实现其作用。当制造商想避免使用相 变材料所需的额外工艺要求时,导热油脂为其提 供一个可行的替代办法,同时新的以有机硅为基 础的水清洗配方提供了更好的使用便利性,并赋 予了导热油脂已知的好处。虽然相变材料通常提 供更好的长期可靠性,因为他们不会像导热油脂 那样随着时间的推移而流失,但是需要采取额外 的的工艺步骤。人们必须仔细评估每一个具体的 应用,以确定哪个散热解决方案是最合适的。 当设计师们持续挑战功能极限,向越来越小的 器件里填塞越来越多的功能,高性能的导热管理 系统将是确保实际应用成功的至关重要的组成部 分。虽然有多种已被证明的商业化导热材料可供 选择,但是新材料给予了简单的工艺并同时具有 同样的应用功能,也值得考虑。需要时间来仔细 评估个人的喜好,及所有的TIM2导热产品的使用 性能和应用性能的优缺点,移除热量也许并非如 你所想象的那样困难! n Dr. Renzhe Zhao is technical manager, applications engineering at the electronics group of Henkel (henkel.com); renzhe. zhao@us.henkel.com. For the English version, visit circuits assembly.com. Circuits Assembly NOVEMBER 2008 45 http://www.henkel.com http://www.assembly.com http://www.circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - November 2008 Circuits Assembly - November 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Focus on Business On the Forefront Screen Printing Better Manufacturing RoHS Conversion for Medical Devices Supporting Full-Service Customer Requirements at the Regional EMS Level Speed Thrills Tech Tips Wave Soldering Process Doctor Pb-Free Lessons Learned The Defects Database Getting Lean Materials World Product Spotlight Ad Index Assembly Insider Technical Abstracts Circuits Assembly - November 2008 Circuits Assembly - November 2008 - Circuits Assembly - November 2008 (Page Cover1) Circuits Assembly - November 2008 - Circuits Assembly - November 2008 (Page Cover2) Circuits Assembly - November 2008 - Circuits Assembly - November 2008 (Page 1) Circuits Assembly - November 2008 - Circuits Assembly - November 2008 (Page 2) Circuits Assembly - November 2008 - Contents (Page 3) Circuits Assembly - November 2008 - Contents (Page 4) Circuits Assembly - November 2008 - Contents (Page 5) Circuits Assembly - November 2008 - Caveat Lector (Page 6) Circuits Assembly - November 2008 - Caveat Lector (Page 7) Circuits Assembly - November 2008 - Industry News (Page 8) Circuits Assembly - November 2008 - Industry News (Page 9) Circuits Assembly - November 2008 - Industry News (Page 10) Circuits Assembly - November 2008 - Industry News (Page 11) Circuits Assembly - November 2008 - Industry News (Page 12) Circuits Assembly - November 2008 - Industry News (Page 13) Circuits Assembly - November 2008 - Market Watch (Page 14) Circuits Assembly - November 2008 - Market Watch (Page 15) Circuits Assembly - November 2008 - Talking Heads (Page 16) Circuits Assembly - November 2008 - Talking Heads (Page 17) Circuits Assembly - November 2008 - Focus on Business (Page 18) Circuits Assembly - November 2008 - Focus on Business (Page 19) Circuits Assembly - November 2008 - On the Forefront (Page 20) Circuits Assembly - November 2008 - On the Forefront (Page 21) Circuits Assembly - November 2008 - Screen Printing (Page 22) Circuits Assembly - November 2008 - Screen Printing (Page 23) Circuits Assembly - November 2008 - Screen Printing (Page 24) Circuits Assembly - November 2008 - Better Manufacturing (Page 25) Circuits Assembly - November 2008 - RoHS Conversion for Medical Devices (Page 26) Circuits Assembly - November 2008 - RoHS Conversion for Medical Devices (Page 27) Circuits Assembly - November 2008 - RoHS Conversion for Medical Devices (Page 28) Circuits Assembly - November 2008 - RoHS Conversion for Medical Devices (Page 29) Circuits Assembly - November 2008 - RoHS Conversion for Medical Devices (Page 30) Circuits Assembly - November 2008 - RoHS Conversion for Medical Devices (Page 31) Circuits Assembly - November 2008 - RoHS Conversion for Medical Devices (Page 32) Circuits Assembly - November 2008 - RoHS Conversion for Medical Devices (Page 33) Circuits Assembly - November 2008 - Supporting Full-Service Customer Requirements at the Regional EMS Level (Page 34) Circuits Assembly - November 2008 - Supporting Full-Service Customer Requirements at the Regional EMS Level (Page 35) Circuits Assembly - November 2008 - Speed Thrills (Page 36) Circuits Assembly - November 2008 - Speed Thrills (Page 37) Circuits Assembly - November 2008 - Tech Tips (Page 38) Circuits Assembly - November 2008 - Wave Soldering (Page 39) Circuits Assembly - November 2008 - Process Doctor (Page 40) Circuits Assembly - November 2008 - Process Doctor (Page 41) Circuits Assembly - November 2008 - Pb-Free Lessons Learned (Page 42) Circuits Assembly - November 2008 - The Defects Database (Page 43) Circuits Assembly - November 2008 - Getting Lean (Page 44) Circuits Assembly - November 2008 - Materials World (Page 45) Circuits Assembly - November 2008 - Ad Index (Page 46) Circuits Assembly - November 2008 - Assembly Insider (Page 47) Circuits Assembly - November 2008 - Technical Abstracts (Page 48) Circuits Assembly - November 2008 - Technical Abstracts (Page Cover3) Circuits Assembly - November 2008 - Technical Abstracts (Page Cover4)
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