Circuits Assembly - November 2008 - (Page 46) Ad Index ADVERTISER INFO: To learn about the advertisers in this issue, go to circuitsassembly.com and select “Advertiser Index” in the gray horizontal menu bar at the top of the page. This will provide you with direct links to the home or product pages of each advertiser in this index. Company Page No. SPOTLIGHT Inline 3-D SPI VP5000 is said to have 12 µm resolution with a 23 x 31 mm field of view. Includes warning thresholds to the pass/fail outputs. Interfaces with Qup-Navi software for height calculations and volumetric inspection. Uses color stripe phase shift method. Combines red-green-blue light sources and a 3-CCD camera with texture mapping or gradation displays. Inspects for average height, volume, excessive deposition, insufficient solder, smearing, misalignment and bridging. Displays defective pad locations on the substrate map with up to eight raw images of defective pads. Handles substrates from 2” x 2” to 18” x 20”. Omron Electronics, omron247.com Product Aim Solder, www.aimsolder . . . . . . . . . . . . . . . . . . . . . . . . . . C3, 19 Bare Board Group, www.bareboard.com. . . . . . . . . . . . . . . . . . . . 47 Cookson Electronic Assembly Materials, www.cooksonelectronics.com . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 CyberOptics, www.cyberoptics.com . . . . . . . . . . . . . . . . . . . . . . . 21 DEK USA, www.dek.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . C4 Digi-Key, www.digikey.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 EFD, Inc., www.efd-inc.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Electronics Group of Henkel, www.electronics.henkel.com . . . . . . . 5 Endicott Interconnect Technologies, www.eitny.com. . . . . . . . . . . . 4 FCT Assembly, www.fctassembly.com . . . . . . . . . . . . . . . . . . . . . C3 Grid-Lok, www.grid-lok.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Imagineering, Inc., www.pcbnet.com . . . . . . . . . . . . . . . . . . . . . . 1 Indium Corporation of America, www.indium.com . . . . . . . . . . . . 7 IPC, www.ipc.org . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 ITW Chemtronics, www.chemtronics.com . . . . . . . . . . . . . . . . . . . 29 JETPCB Inc., www.jetpcb.com . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Juki Automation Systems, www.jas-smt.com . . . . . . . . . . . . . . . . 15 MIRTEC Corp., www.mirtecusa.com . . . . . . . . . . . . . . . . . . . . . . . 23 Miyachi Unitek Corp., www.miyachiunitek.com . . . . . . . . . . . . . . 13 Nihon Superior Co., Ltd., www.nihonsuperior.co.jp . . . . . . . . . . . C3 NPI Awards, circuitsassembly.com/npi. . . . . . . . . . . . . . . . . . . . . 24 PCB Orlando 2008, www.pcbshows.com/orlando . . . . . . . . . . . . . . 4 Precision Placement Machines, Inc., www.goppm.com . . . . . . . . 47 Seika Machinery, www.seikausa.com . . . . . . . . . . . . . . . . . . . . . . 12 Service Excellence Awards, circuitsassembly.com/sea. . . . . . . . . 41 Speedline Technologies, www.speedlinetech.com . . . . . . . . . . . 11 Ticona Engineering Polymers, www.ticona.com . . . . . . . . . . . C2, 47 Virtual PCB, www.virtual-pcb.com . . . . . . . . . . . . . . . . . . . . . . . . 28 ZESTRON America, www.zestron.com . . . . . . . . . . . . . . . . . . . . . . 27 Vacuum Interrupter for Hand Tools V3025-B assists in precision placement of small parts. The interrupter block controls the vacuum. Permits part positioning with a vacuum tweezer pen with one hand, while the other controls the interrupter block to release the part. Virtual Industries, virtual-ii.com Stencil Printer with Integrated Vision SP003-ML-V is for small and medium volumes. Has an integrated vision system. Consists of two quick-fix cameras that look directly through the stencil apertures down to the PCB. Images are simultaneously displayed on two 8” monitors to check alignment. Correction of X, Y and theta axes possible using backlash-free adjusting screws. Controls squeegee and speed attributes and reportedly can reproduce them securely. Adjustable magnetic table can accept single- and double-sided substrates. Print area measures up to 360 x 400 mm; screens and stencils can be mounted in frames up to 23” x 23” in size. Essemtec AG, essemtec.com Automatic Wire Bond AOI S6053BO-V is for small wire bond analysis. Comes with universal, high-resolution VHR camera module; camera and transport reportedly can be adapted to varying production demands. Is said to inspect to 2 to 5 µm per pixel. Camera module can be arrayed with one or several cameras and illumination units. Bond wires smaller than 20 µm in diameter can be inspected 100%. Is available in a dual-track configuration, including an integrated shuttle that loads the second track as inspection is conducted on the first track. Also inspects components and ASICs. Viscom, viscom.com Advertising Sales North UP Media Group, Inc. America: 2400 Lake Park Drive, Suite 440 Smyrna, GA 30080 Krista Fabian Sales Associate, (678) 589-8840 email: kfabian@upmediagroup.com Asia: Korea: Young Media, 82 2 756 4819 email: ymedia@ymedia.co.kr 46 Circuits Assembly NOVEMBER 2008 circuitsassembly.com http://www.circuitsassembly.com http://www.aimsolder.com http://www.bareboard.com http://www.cooksonelectronics.com http://www.cyberoptics.com http://www.dek.com http://www.digikey.com http://www.efd-inc.com http://www.omron247.com http://www.electronics.henkel.com http://www.eitny.com http://www.fctassembly.com http://www.grid-lok.com http://www.pcbnet.com http://www.indium.com http://www.virtual-ii.com http://www.ipc.org http://www.chemtronics.com http://www.jetpcb.com http://www.jas-smt.com http://www.mirtecusa.com http://www.miyachiunitek.com http://www.nihonsuperior.co.jp http://www.circuitsassembly.com/npi http://www.pcbshows.com/orlando http://www.goppm.com http://www.seikausa.com http://www.essemtec.com http://www.circuitsassembly.com/sea http://www.speedlinetech.com http://www.ticona.com http://www.virtual-pcb.com http://www.zestron.com http://www.viscom.com http://www.circuitsassembly.com
Table of Contents Feed for the Digital Edition of Circuits Assembly - November 2008 Circuits Assembly - November 2008 Contents Caveat Lector Industry News Market Watch Talking Heads Focus on Business On the Forefront Screen Printing Better Manufacturing RoHS Conversion for Medical Devices Supporting Full-Service Customer Requirements at the Regional EMS Level Speed Thrills Tech Tips Wave Soldering Process Doctor Pb-Free Lessons Learned The Defects Database Getting Lean Materials World Product Spotlight Ad Index Assembly Insider Technical Abstracts Circuits Assembly - November 2008 Circuits Assembly - November 2008 - Circuits Assembly - November 2008 (Page Cover1) Circuits Assembly - November 2008 - Circuits Assembly - November 2008 (Page Cover2) Circuits Assembly - November 2008 - Circuits Assembly - November 2008 (Page 1) Circuits Assembly - November 2008 - Circuits Assembly - November 2008 (Page 2) Circuits Assembly - November 2008 - Contents (Page 3) Circuits Assembly - November 2008 - Contents (Page 4) Circuits Assembly - November 2008 - Contents (Page 5) Circuits Assembly - November 2008 - Caveat Lector (Page 6) Circuits Assembly - November 2008 - Caveat Lector (Page 7) Circuits Assembly - November 2008 - Industry News (Page 8) Circuits Assembly - November 2008 - Industry News (Page 9) Circuits Assembly - November 2008 - Industry News (Page 10) Circuits Assembly - November 2008 - Industry News (Page 11) Circuits Assembly - November 2008 - Industry News (Page 12) Circuits Assembly - November 2008 - Industry News (Page 13) Circuits Assembly - November 2008 - Market Watch (Page 14) Circuits Assembly - November 2008 - Market Watch (Page 15) Circuits Assembly - November 2008 - Talking Heads (Page 16) Circuits Assembly - November 2008 - Talking Heads (Page 17) Circuits Assembly - November 2008 - Focus on Business (Page 18) Circuits Assembly - November 2008 - Focus on Business (Page 19) Circuits Assembly - November 2008 - On the Forefront (Page 20) Circuits Assembly - November 2008 - On the Forefront (Page 21) Circuits Assembly - November 2008 - Screen Printing (Page 22) Circuits Assembly - November 2008 - Screen Printing (Page 23) Circuits Assembly - November 2008 - Screen Printing (Page 24) Circuits Assembly - November 2008 - Better Manufacturing (Page 25) Circuits Assembly - November 2008 - RoHS Conversion for Medical Devices (Page 26) Circuits Assembly - November 2008 - RoHS Conversion for Medical Devices (Page 27) Circuits Assembly - November 2008 - RoHS Conversion for Medical Devices (Page 28) Circuits Assembly - November 2008 - RoHS Conversion for Medical Devices (Page 29) Circuits Assembly - November 2008 - RoHS Conversion for Medical Devices (Page 30) Circuits Assembly - November 2008 - RoHS Conversion for Medical Devices (Page 31) Circuits Assembly - November 2008 - RoHS Conversion for Medical Devices (Page 32) Circuits Assembly - November 2008 - RoHS Conversion for Medical Devices (Page 33) Circuits Assembly - November 2008 - Supporting Full-Service Customer Requirements at the Regional EMS Level (Page 34) Circuits Assembly - November 2008 - Supporting Full-Service Customer Requirements at the Regional EMS Level (Page 35) Circuits Assembly - November 2008 - Speed Thrills (Page 36) Circuits Assembly - November 2008 - Speed Thrills (Page 37) Circuits Assembly - November 2008 - Tech Tips (Page 38) Circuits Assembly - November 2008 - Wave Soldering (Page 39) Circuits Assembly - November 2008 - Process Doctor (Page 40) Circuits Assembly - November 2008 - Process Doctor (Page 41) Circuits Assembly - November 2008 - Pb-Free Lessons Learned (Page 42) Circuits Assembly - November 2008 - The Defects Database (Page 43) Circuits Assembly - November 2008 - Getting Lean (Page 44) Circuits Assembly - November 2008 - Materials World (Page 45) Circuits Assembly - November 2008 - Ad Index (Page 46) Circuits Assembly - November 2008 - Assembly Insider (Page 47) Circuits Assembly - November 2008 - Technical Abstracts (Page 48) Circuits Assembly - November 2008 - Technical Abstracts (Page Cover3) Circuits Assembly - November 2008 - Technical Abstracts (Page Cover4)
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