Circuits Assembly - December 2008 - (Page 3) Analyzing Pb-Free Wave Soldering Defects, pg. 34 DECEMBER 2008 circuitsassembly.com Plexus DECEMBER 2008 – Vol. 19 No. 12 Flux’s Role in HIP Defects on the Move A Look Inside Our EMS Company of the Year FIRST PERSON 6 Caveat Lector Foxconn goes south of the border. Mike Buetow Pb-Free Wetting Tests Predicting Lean Outcomes ON THE COVER: Plexus has perfected the art of the workcell. FEATURES COVER STORY MONEY MATTERS 17 Global Sourcing Relationship ruiners. Jennifer Read 20 The Plexus Rx The best-performing publicly held EMS company is not Jabil, Benchmark nor Flextronics, but a quiet Midwestern entity with a primarily North American footprint and “too many” engineers. Why Plexus is our 2008 EMS Company of the Year. By Mike Buetow TECH TALK 18 Screen Printing Post-print inspection. Clive Ashmore Retrospective 26 28 In Memoriam CIRCUITS ASSEMBLY recalls friends and industry colleagues who won’t see 2009. 19 Better Manufacturing What I don’t like about you. Dr. H.J. Zapfardt III Solder Joint Reliability HIP Defects in BGAs Solder joints afflicted with head-in-pillow lack strength, and the components may fail under minimal mechanical or thermal stress. HIP is now known to be caused by certain process variables, including the BGA ball alloy, reflow process type, reflow profile and solder paste chemistry. The role each of these variables plays, and certain mitigation techniques, are identified in this study. By Karl Seelig 32 Tech Tips Solder wetting tests. American Competitiveness Institute 33 Test and Inspection In support of DfT. Stacy Kalisz Johnson This month at PCDandF.com Electronic System Design ECAD-MCAD collaboration supports bidirectional communication that can shorten design times, reduce errors and bring products to market faster. By John Isaac 34 Wave Soldering Drop-ins are out. Ursula Marquez de Tino 36 Process Doctor Analyzing SEM and EDX. Terry Munson 37 Pb-Free Lessons Learned The HIP epidemic proliferates. Chrys Shea PCB Dielectric Materials for High-Speed Applications The glass weave in a laminate can affect the propagation velocity and loss profile, leading to signal loss and skew in differential pairs. By Ravindra Gali 39 The Defects Database Paste residue and solvent incompatibilities. Dr. Davide Di Maio 40 Standards All marked up. John Perry PCB Designers Take on Technology Challenges in 2008 Decisions made in the design seat determine not only the size and shape of the PCB, but also the technology type and materials used to build the board. By Kathy Nargi-Toth 42 Getting Lean Predicting outcomes. Robert Hemmant 43 Eastern Advances Soldering terminations, part 2. Sanqiang Cai 48 Technical Abstracts DEPARTMENTS 8 Industry News 16 Market Watch 44 Product Spotlight 46 Ad Index 47 Assembly Insider Photo courtesy of Plexus Corp. http://www.PCDandF.com
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