Circuits Assembly - December 2008 - (Page 46) Ad Index ADVERTISER INFO: To learn about the advertisers in this issue, go to circuitsassembly.com and select “Advertiser Index” in the gray horizontal menu bar at the top of the page. This will provide you with direct links to the home or product pages of each advertiser in this index. Company Page No. Solder Joint Reliability Continued from pg. 31 Assembléon, www.assembleon.com . . . . . . . . . . . . . . . . . 21, 23, 25 Bare Board Group, www.bareboard.com. . . . . . . . . . . . . . . . . . . . 47 BEST, Inc., www.solder.net . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Charlie Barnhart & Associates, www.charliebarnhart.com . . . . . 39 Cookson Electronic Assembly Materials, www.cooksonelectronics.com . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 CyberOptics, www.cyberoptics.com . . . . . . . . . . . . . . . . . . . . . . . C3 Digi-Key, www.digikey.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Electronics West Show, www.electronicswestshow.com . . . . . . . . 22 Green Rules!, www.envisionrules.com . . . . . . . . . . . . . . . . . . . . . 35 Grid-Lok, www.grid-lok.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . C4 Imagineering, Inc., www.pcbnet.com . . . . . . . . . . . . . . . . . . . . . . 1 Indium Corporation of America, www.indium.com . . . . . . . . . . . . 7 JETPCB Inc., www.jetpcb.com . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Juki Automation Systems, www.jas-smt.com . . . . . . . . . . . . . . . . 11 MIRTEC Corp., www.mirtecusa.com . . . . . . . . . . . . . . . . . . . . . . . 15 Nihon Superior Co., Ltd., www.nihonsuperior.co.jp . . . . . . . . . . . 13 PCB East, www.pcbeast.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 PCB Phoenix, www.pcbshows.com/phoenix . . . . . . . . . . . . . . . . . . 4 Powell-Mucha Consulting, www.powell-muchaconsulting.com . . . . . . . . . . . . . . . . . . . . . 41 Precision Placement Machines, Inc., www.goppm.com . . . . . . . . 47 Seika Machinery, www.seikausa.com . . . . . . . . . . . . . . . . . . . . . . 27 SMTA - Pan Pac Conference, www.smta.org. . . . . . . . . . . . . . . . . 24 Speedline Technologies, www.speedlinetech.com . . . . . . . . . . . . 5 Ticona Engineering Polymers, www.ticona.com/halogenfree . . . C2 Virtual PCB, www.virtual-pcb.com . . . . . . . . . . . . . . . . . . . . . 29, 35 This indicates solder pastes with an activation system able to provide sustainable high-temperature fluxing activity are capable of creating a homogenous connection beyond the ball and the paste alloy interface. Figure 6 shows a HIP formed using a lower-temperature activation system. Figure 7 is a joint formed with a high-temperature activation system; no evidence of HIP is seen. Based on these experiments, Table 1 was generated to show the relative impact of variable(s) that contribute to HIP, rated on a scale of one to 10, with 10 as the most likely to eliminate the issue. Conclusions Based on this preliminary study, it appears the two significant factors are solder paste flux chemistry and BGA alloy ball wetting. Frosty, non-uniform structures appear to perform the worst for BGA HIP. This is logical, as these are intermetallic regions on the surface of the solder ball. The intermetallic connection of AgSn and CuSn possesses much higher melting temperatures than the alloy themselves. They are also crystalline in structure and can repel wetting. Although additional studies are necessary to corroborate these results, there is a strong indication this surface structure is one of the leading causes of the HIP defect. n References 1. Chrys Shea, “HOP-ping Mad,” CirCuits Assembly, July 2008. 2. American Competitiveness Institute, “Stop the HOP,” CirCuits Assembly, August 2008. Karl Seelig is vice president of technology at AIM (aimsolder.com); kseelig@aimsolder.com. United States Postal Service Statement of Ownership, Management, and Circulation 1. Publication Title: CIRCUITS ASSEMBLY 2. Publication No.: 1054-0407 3. Filing Date: 10/01/2008 4. Issue Frequency: Monthly 5. No. of Issues Published Annually: 12 6. Annual Subscription Price: $80.00 7. Complete Mailing Address of Known Office of Publication: UP Media Group Inc. - 2400 Lake Park Drive, Suite 440 - Smyrna, GA 30080; Contact Person: Jennifer Schuler; Telephone: 918496-1476 8. Complete Mailing Address of Headquarters or General Business Office of Publisher (Not printer): 2400 Lake Park Drive, Suite 440 - Smyrna, GA 30080 9. Full Names and Complete Mailing addresses of Publisher, Editor, and Managing Editor: Publisher, Pete Waddell - 2400 Lake Park Drive, Suite 440 - Smyrna, GA 30080; Editor, Mike Buetow - 2400 Lake Park Drive, Suite 440 - Smyrna, GA 30080; Managing Editor, Javier Longoria - 2400 Lake Park Drive, Suite 440 - Smyrna, GA 30080 10. Owner: UP Media Group, Inc., 2400 Lake Park Drive, Suite 440 - Smyrna, GA 30080 11. Known Bondholders, Mortgagees, and Other Security Holders Owning or Holding 1 Percent or More of Total Amount of Bonds, Mortgages, or Other Securities: None 12. Does not apply 13. Publication Name: CIRCUITS ASSEMBLY 14. Issue Date for Circulation Data Below: October 1, 2008 15. Extent and Nature of Circulation: Average No. copies Each Issue During Preceding 12 Months; No. Copies of Single Issue Published Nearest to Filing date a. Total Number of Copies (Net Press Run): 43,672; 43,709 b. Paid and/or Requested Circulation: (1) Mailed Outside-Country Paid Subscriptions Stated on PS Form 3541 (include paid distribution above nominal rate, advertiser's proof copies, and exchange copies) 0, 0 (2) Mailed In-Country Paid Subscriptions Stated on PS Form 3541 (Include paid distribution above nominal rate, advertiser's proof copies, and exchange copies): 18,385; 22,533 (3) Paid Distribution Outside the Mails Including Sales Through Dealers and Carriers, Street Vendors, Counter Sales and Other Paid Distribution Outside USPS: 24,638; 20,543 (4) Paid Distribution by Other Classes Mailed Through the USPS: 0; 0 c. Total paid and/or Requested Circulation (Sum of 15b (1), (2), (3), and (4): 43,023; 43,076 d. Free or Nominal Rate Distribution (By Mail and Outside the Mail): (1) Free or Nominal Rate Outside-County Copies Included on Form 3541: 0; 0 (2) Free or Nominal Rate In-County Copies Included on PS Form 3541: 0; 0 (3) Free or Nominal Rate Copies Mailed at Other Classes Through the USPS (e.g. First-Class Mail): 0; 0 (4) Free or Nominal Rate Distribution Outside the Mail (Carriers or other means): 603; 594 e. Total Free or Nominal Distribution (Sum of 15d (1), (2), (3) and (4)): 603; 594 f. Total Distribution ( Sum of 15c and 15e): 43,626; 43,670 g. Copies not Distributed (See Instructions to Publishers #4 (page #3)): 46; 39 h. Total (Sum of 15f, and g): 43,672; 43,709 i. Percent Paid and/or Requested Circulation (15c. Divided by 15f times 100): 98.61779673; 98.63979849 j. Percent Paid and/or Requested Circulation (15c. Divided by 15g times 100): 99.00763887; 98.15612 16. If the publication is a general publication, this statement is required. Will be printed in the December 2008 issue of this publication. 17. Signature and Title of Editor, Publisher, Business Manager, or Owner: I certify that all information furnished on this form is true and complete. I understand that anyone who furnishes false or misleading information on this form or who omits material or information requested on the form may be subject to criminal sanctions (including fines and imprisonment) and/or civil sanctions (including civil penalties). (signed) Pete Waddell, October 1, 2008. Advertising Sales North UP Media Group, Inc. America: 2400 Lake Park Drive, Suite 440 Smyrna, GA 30080 Krista Fabian Sales Associate, (678) 589-8840 email: kfabian@upmediagroup.com Asia: Korea: Young Media, 82 2 756 4819 email: ymedia@ymedia.co.kr Circuits Assembly DECEMBER 2008 circuitsassembly.com http://www.circuitsassembly.com http://www.assembleon.com http://www.bareboard.com http://www.solder.net http://www.charliebarnhart.com http://www.cooksonelectronics.com http://www.cyberoptics.com http://www.digikey.com http://www.electronicswestshow.com http://www.envisionrules.com http://www.grid-lok.com http://www.pcbnet.com http://www.indium.com http://www.aimsolder.com http://www.jetpcb.com http://www.jas-smt.com http://www.mirtecusa.com http://www.nihonsuperior.co.jp http://www.pcbeast.com http://www.pcbshows.com/phoenix http://www.powell-muchaconsulting.com http://www.goppm.com http://www.seikausa.com http://www.smta.org http://www.speedlinetech.com http://www.ticona.com/halogenfree http://www.virtual-pcb.com http://www.circuitsassembly.com
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