Circuits Assembly - December 2008 - (Page 9) You know silver is the key to soldering performance and reliability ALPHA® SACX® Wave Solder Alloy Technology Hole Fill Thermal Fatigue Resistance SACX ® Cross section of wave soldered SMT devices after 1000, -45º to +125ºC, 70 minute thermal cycles. ALPHA® SACX® ALPHA® SACX® SAC305 SAC305 but why pay for more than you may need? Even small amounts of silver in a SACX® alloy deliver: • lower alloy liquidus temperature • reduced molten alloy surface tension that improves hole fill • increased alloy thermal fatigue resistance At Cookson Electronics, we’ve engineered a range of lead-free alloys that have the optimum amounts of silver needed to produce excellent solderability and reliability results across a wide variety of assembly types. From simple, single-sided assemblies, to those that are thick and complex, we have the right amount of silver for you. Many studies* have demonstrated that ALPHA® SACX® low-Ag alloys deliver these additional benefits when tested against Ag-free, lead-free alloys (i.e., SnCuNi, etc.): • lower solder pot temperature • lower overall soldering defects • higher reliability • lower dross rates Join the thousands of companies that have saved money with ALPHA® SACX® alloys. They made just the right amount of silver their KEY to soldering success. GO TO www.newalphaproducts.com for more information Or, contact your Cookson Electronics representative. * Data available alpha ® Worldwide Headquarters • 109 Corporate Boulevard • South Plainfield, NJ 07080 • USA • +1-800-367-5460 • www.alpha.cooksonelectronics.com European Headquarters • Forsyth Road • Sheerwater • Woking GU215RZ • United Kingdom • +44-1483-758-400 Asia-Pacific Headquarters • 1/F, Block A • 21 Tung Yuen Street • Yau Tong Bay • Kowloon, Hong Kong • +852-3190-3100 © 2008 Cookson Electronics http://www.newalphaproducts.com http://www.alpha.cooksonelectronics.com
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