Circuits Assembly - December 2008 - (Page Cover2)

340°C. V-0 Halogen-Free Flame Resistance. Now that’s hot. Ticona enables eco-friendly innovation Today. Ticona Engineering Polymers, the global leader in LCP for connectors, knows high-performance E/E components and what it takes to help you meet the ever-increasing demands of the electronics market. Vectra® LCP: Halogen-free Inherently ﬂame resistant High temperature resistance (short-term up to 340°C) for lead-free soldering High-ﬂow characteristics to ﬁll long, thin and complex ﬂow paths Extremely fast cycle times over long production runs Very high HDT and low CTE Portfolio of High-Performance Solutions for Greener Electronics: Vectra® LCP The proven performer. Halogen free. No ﬂame retardants added. Fortron® PPS Inherently ﬂame resistant Celanex® XFR® PBT and Riteﬂex® XFR® TPC-ET Polyesters with a halogen-free ﬂame retardant system Navigating the Green Landscape We focus the full power of our world-class engineering polymers, global reach, deep technical knowledge, and design and application development experience to help you navigate the green landscape. To learn more: www.ticona.com/halogenfree or call: 1.800.833.4882 Ticona Engineering Polymers, 8040 Dixie Highway, Florence, KY USA 41042 © 2008 Ticona. Except as otherwise noted, trademarks are owned by Ticona or its afﬁliates. Fortron is a registered trademark of Fortron Industries LLC. Ticona is a business of Celanese Corporation. http://www.ticona.com/halogenfree http://www.ticona.com/halogenfree http://www.ticona.com/halogenfree Table of Contents for the Digital Edition of Circuits Assembly - December 2008Circuits Assembly - December 2008ContentsCaveat LectorIndustry NewsMarket WatchGlobal SourcingScreen PrintingBetter ManufacturingThe Plexus RxIn MemoriamHIP Defects in BGAsTech TipsTest and InspectionWave SolderingProcess DoctorPb-Free Lessons LearnedThe Defects DatabaseStandardsGetting LeanEastern AdvancesProduct SpotlightAd IndexAssembly InsiderTechnical AbstractsCircuits Assembly - December 2008Circuits Assembly - December 2008 - Circuits Assembly - December 2008 (Page Cover1)Circuits Assembly - December 2008 - Circuits Assembly - December 2008 (Page Cover2)Circuits Assembly - December 2008 - Circuits Assembly - December 2008 (Page 1)Circuits Assembly - December 2008 - Circuits Assembly - December 2008 (Page 2)Circuits Assembly - December 2008 - Contents (Page 3)Circuits Assembly - December 2008 - Contents (Page 4)Circuits Assembly - December 2008 - Contents (Page 5)Circuits Assembly - December 2008 - Caveat Lector (Page 6)Circuits Assembly - December 2008 - Caveat Lector (Page 7)Circuits Assembly - December 2008 - Industry News (Page 8)Circuits Assembly - December 2008 - Industry News (Page 9)Circuits Assembly - December 2008 - Industry News (Page 10)Circuits Assembly - December 2008 - Industry News (Page 11)Circuits Assembly - December 2008 - Industry News (Page 12)Circuits Assembly - December 2008 - Industry News (Page 13)Circuits Assembly - December 2008 - Industry News (Page 14)Circuits Assembly - December 2008 - Industry News (Page 15)Circuits Assembly - December 2008 - Market Watch (Page 16)Circuits Assembly - December 2008 - Market Watch (Page Best1)Circuits Assembly - December 2008 - Market Watch (Page Best2)Circuits Assembly - December 2008 - Global Sourcing (Page 17)Circuits Assembly - December 2008 - Screen Printing (Page 18)Circuits Assembly - December 2008 - Better Manufacturing (Page 19)Circuits Assembly - December 2008 - The Plexus Rx (Page 20)Circuits Assembly - December 2008 - The Plexus Rx (Page 21)Circuits Assembly - December 2008 - The Plexus Rx (Page 22)Circuits Assembly - December 2008 - The Plexus Rx (Page 23)Circuits Assembly - December 2008 - The Plexus Rx (Page 24)Circuits Assembly - December 2008 - The Plexus Rx (Page 25)Circuits Assembly - December 2008 - In Memoriam (Page 26)Circuits Assembly - December 2008 - In Memoriam (Page 27)Circuits Assembly - December 2008 - HIP Defects in BGAs (Page 28)Circuits Assembly - December 2008 - HIP Defects in BGAs (Page 29)Circuits Assembly - December 2008 - HIP Defects in BGAs (Page 30)Circuits Assembly - December 2008 - HIP Defects in BGAs (Page 31)Circuits Assembly - December 2008 - Tech Tips (Page 32)Circuits Assembly - December 2008 - Test and Inspection (Page 33)Circuits Assembly - December 2008 - Wave Soldering (Page 34)Circuits Assembly - December 2008 - Wave Soldering (Page 35)Circuits Assembly - December 2008 - Process Doctor (Page 36)Circuits Assembly - December 2008 - Pb-Free Lessons Learned (Page 37)Circuits Assembly - December 2008 - Pb-Free Lessons Learned (Page 38)Circuits Assembly - December 2008 - The Defects Database (Page 39)Circuits Assembly - December 2008 - Standards (Page 40)Circuits Assembly - December 2008 - Standards (Page 41)Circuits Assembly - December 2008 - Getting Lean (Page 42)Circuits Assembly - December 2008 - Eastern Advances (Page 43)Circuits Assembly - December 2008 - Product Spotlight (Page 44)Circuits Assembly - December 2008 - Product Spotlight (Page 45)Circuits Assembly - December 2008 - Ad Index (Page 46)Circuits Assembly - December 2008 - Assembly Insider (Page 47)Circuits Assembly - December 2008 - Technical Abstracts (Page 48)Circuits Assembly - December 2008 - Technical Abstracts (Page Cover3)Circuits Assembly - December 2008 - Technical Abstracts (Page Cover4)http://www.nxtbook.com/nxtbooks/upmg/ca_200812http://www.nxtbook.com/nxtbooks/upmg/ca_200811http://www.nxtbook.com/nxtbooks/upmg/ca_200810http://www.nxtbook.com/nxtbooks/upmg/ca_200809http://www.nxtbook.com/nxtbooks/upmg/ca_200808http://www.nxtbook.com/nxtbooks/upmg/ca_200807http://www.nxtbook.com/nxtbooks/upmg/ca_200806http://www.nxtbook.com/nxtbooks/upmg/ca_200804http://www.nxtbook.com/nxtbooks/upmg/ca_200803http://www.nxtbook.com/nxtbooks/upmg/ca_200802http://www.nxtbook.com/nxtbooks/upmg/ca_200801http://www.nxtbook.com/nxtbooks/upmg/ca_200712http://www.nxtbook.com/nxtbooks/upmg/ca_200711http://www.nxtbookMEDIA.com

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