PCB West Brochure 2008 - (Page 10) PR O FESSI ON AL D EVE L OPME NT CE RTIF ICATE PROGRA M Ten courses are available in this year’s Professional Development Certificate Program—one 3-day and four 2-day Design Excellence Curriculum courses (DECs) and five 1-day Tutorials (T courses). These technical courses are taught by industry experts who will provide you with the technology, theory, application and best practice information that you need to achieve professional growth and development. You’ll receive a certificate of completion for each Professional Development course that you attend and complete. Note: Professional Development courses are NOT included on the Technical Conference Proceedings CD-ROM. SUNDAY, SEPT. 14 – MONDAY, SEPT. 15 9 am – 5 pm DEC 1 – Control of Signal Integrity, EMI, Crosstalk and Grounding in High-Speed Printed Circuits Speaker: Rick Hartley, L-3 Communications, Avionics Systems This two-day course provides a crisp focus on the high-speed PCB and circuit design concepts needed to ensure success when utilizing the fast and ultra-fast ICs of today and tomorrow. In today’s printed circuits, it’s not the rate at which the circuit is clocked, rather the output edge rate (rise/fall time) of ICs that causes most signal integrity, EMI and cross talk issues. This course will cover: circuit parasitics, high-frequency currents, signal and wave propagation, time and velocity, transmission lines, proper routing technique, control of noise budgets, control of signal cross talk, power distribution and decoupling, source control of EMI, control of EMI coupling, split planes and plane islands, PCB layer stack-ups, filters and filtering techniques, system RF shielding and grounding, metal vs. plastic enclosures, slots in enclosures, and conducted EMI filters. Attendees also will learn about interfacing with the fabricator, PCB fabrication methods and concerns, PCB fabrication drawings, impedance testing and cost differential of controlled impedance PCBs. design techniques for the interconnection of area array components from ASIC packaging, portable products, high-performance computing and telecom to dense multichip modules. PCB design rules, materials and selection of PCB structures (blind, buried and microvias) will be examined and compared. The tutorial will define the buried passive technologies, distributed capacitance, HDI technologies, circuit routing guidelines and materials required to permit the use of widely accepted fine-pitch and BGA components. One millimeter, 0.8 mm, 0.65 mm and 0.5 mm fine-pitch components are the focus of pad, spacing and layer assignments. Channel routing techniques using blind vias will show how layers can be reduced by as much as 3X, with the associated cost reductions. Examples will be the 1,247 and 2,577 I/O 1.0 mm CCGAs. Part 2 of this two-day course is a hands-on session. It will take the principles learned in earlier in the course and apply them to real-world designs. Part 2 will begin with a discussion of CAD tool sets and include the use of an actual tool set to strengthen the understanding of how HDI can be used to solve everyday design challenges. covered in depth. Equipment, processes and materials specific to the client will receive additional focus. 9 am – 5 pm NEW! T2 – Electrical Principles: Digital Circuits and Electrical Systems Speaker: Ralph Morrison, consultant This one-day tutorial is a review of the basic principles of electrical behavior. It covers the electric field, the magnetic field, definitions of voltage, capacitance and inductance, shielding principles, dielectrics, permeability, transformer action, Lenz’s law and analog circuits. In addition, common impedance coupling, common-mode rejection, transformer shielding, energy storage in circuits, decoupling, basic transmission line theory, stripline, microstrip, buried microstrip, reflections, characteristic impedance, line matching, shorts and opens will also be discussed. Also part of the discussion will be balanced lines, ground planes, breaks in ground planes, power planes, energy stored in the ground/power plane, energy time delays, energy transport, traces jumping planes, vias, board radiation, cross coupling, ohms per square, skin effect, spectrum of waveforms, and mixing analog and digital. Lightning protection, antenna radiation, RF shielding, apertures, wave guides, reflections from conductive surfaces, absorptions, RF coupling, ESD, line filters, isolation transformers, separately derived transformers, equipment ground, isolated grounds, safety ground and screen rooms will also be reviewed. 9 am – 5 pm DEC 4 – EMI and EMC for the Design Engineer Speaker: Robert Hanson, Americom Seminars If you’re a PCB design engineer, it pays for you to know how and why EMI testing is conducted, as well as the typical causes of failure, even if an outside company performs your actual testing. This course offers all of the EMI information you’ll need – including design considerations at CAE and CAD levels – for you to provide a compliant radiation/ susceptibility product. You’ll examine and identify ways to prevent common EMI/EMC problems regarding power supplies, cables, connectors, slots, discontinuity of ground planes and more. This twoday course will focus on EMI and RFI issues regarding PCBs, computers, analog designs and systems, along with relevant EMI regulations in the U.S., the European Union and Asia. Highlights include PCB radiation basics, radiation and bypass on PCBs. PCB radiation suppression techniques, grounding designs/ filtering, crosstalk/termination, power and ground planes, antenna loops, spread spectrum clocking, and differential-mode and common-mode radiation. 9 am – 5 pm DEC 2 – PCB Design 101 Speakers: Gary Ferrari, FTG Circuits; and Susy Webb, Fairfield Industries Managers often ask, “Where can I send my entrylevel designers to learn the tricks of the trade?” This tutorial is the answer! Technical sessions at conferences often emphasize the latest techniques and technologies, but unfortuantely those classes are usually too in-depth for the typical novice designer. This class is targeted at the entry-level PCB designer or someone just starting out in this profession. Attendees will begin with the components and the schematic, and continue through layout and post-processing. Attendess will learn how to interpret component specification sheets and schematics, how to plan component placement, as well as routing strategies, DFM, DFT, post-processing and more. WEDNESDAY, SEPT. 17 – FRIDAY, SEPT. 19 9 am – 5 pm NEW! DEC 5 – High-Speed Design, Including Simulation Tool Use Speaker: Lee Ritchey, Speeding Edge This special three-day course will cover the design of high-speed PCBs and their associated systems. It covers all the physics involved in high-speed design, explaining the science behind each one of the principles, their role in high-speed systems and how to properly manage the design process to account for them. In addition, this three-day course integrates the use of simulation for high-speed design validation. This course will give the engineering professional the fundamental knowledge necessary to make the most efficient design rule set, organize the design process to efficiently execute the design, select the appropriate PCB materials and choose the toolsets that will best suit the design process. This course is especially relevant to PCB and IC designers as device speeds outstrip the traditional packages and application notes. SUNDAY, SEPT. 14 9 am – 5 pm NEW! T1 – Design for SMT Manufacturability From an Assembly Point of View Speaker: Jim Hall, ITM Consulting Providing a printed circuit design that can be cost effectively reproduced and converted into a high-quality, reliable, functional electronic product requires that the designer have a grasp of the total assembly process. In addition to designing for speed, frequency and packaging requirements, the successful designer must be knowledgeable with respect to the characteristics and capabilities of the SMT assembly process including soldering, placement, cleaning and testing. This full-day tutorial is intended to provide the participant with a broad overview of the SMT assembly processes and the design issues associated with manufacturing them. How the design effects manufacturing capability and vice versa will be FRIDAY, SEPT. 19 9 am – 5 pm T3 – Placement and Routing of Complex PCBs Speaker: Rick Hartley, L-3 Communication, Avionics Systems; and Susy Webb, Fairfield Industries The concepts behind parts placement and trace routing always seem to pique the interest of PCB designers, 9 am – 5 pm DEC 3 – Design Challenges With HDI/Microvias, Including Hands-On Design Speakers: Happy Holden, Mentor Graphics; and Mike Fitts, Plexus Part 1 of this two-day course will examine PCB W EST 2008 | WWW .PCBWEST. CO M | IN TH E H E AR T OF S I LI C O N VAL L E Y http://www.pcbwest.com
Table of Contents Feed for the Digital Edition of PCB West Brochure 2008 PCB West Brochure 2008 Free Special Events Travel Information Registration Information Schedule-At-A-Glance Professional Development Certificate Program 3-Day Technical Conference Program Speaker Biographies PCB West Brochure 2008 PCB West Brochure 2008 - PCB West Brochure 2008 (Page 1) PCB West Brochure 2008 - PCB West Brochure 2008 (Page 2) PCB West Brochure 2008 - PCB West Brochure 2008 (Page 3) PCB West Brochure 2008 - Free Special Events (Page 4) PCB West Brochure 2008 - Free Special Events (Page 5) PCB West Brochure 2008 - Travel Information (Page 6) PCB West Brochure 2008 - Registration Information (Page 7) PCB West Brochure 2008 - Schedule-At-A-Glance (Page 8) PCB West Brochure 2008 - Schedule-At-A-Glance (Page 9) PCB West Brochure 2008 - Professional Development Certificate Program (Page 10) PCB West Brochure 2008 - Professional Development Certificate Program (Page 11) PCB West Brochure 2008 - 3-Day Technical Conference Program (Page 12) PCB West Brochure 2008 - 3-Day Technical Conference Program (Page 13) PCB West Brochure 2008 - 3-Day Technical Conference Program (Page 14) PCB West Brochure 2008 - Speaker Biographies (Page 15) PCB West Brochure 2008 - Speaker Biographies (Page 16)
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