Printed Circuit Design & Fab - June 2008 - (Page 2)

JUNE 2008 • VOL. 25 • NO. 6 FEATURES Modeling is critical in high-speed PCB design. Using various modeling methods, designers can minimize inductance and improve signal integrity. Images ©iStockPhoto/Carlos Martinez and Ermin Gutenberger Design by Katherine Haddox 22 DFA / DFT Improving Design Communication Using DfA Analysis and Feedback Creating a single data format from design through manufacturing can accelerate design data transfer, improving yields and reducing cost. by MARK LAING 26 SIGNAL INTEGRITY POINT OF VIEW 4 Modeling Common Ground Noise in High-Speed Multi-board PCB Systems The amount of noise between reference planes in two adjoining boards depends on the inductance produced by the inter-board connector. by MOSIN MONDAL, BHYRAV MUTNUR, PRAVIN PATEL, SAMUEL CONNOR, BRUCE ARCHAMBEAULT, and MOISES CASES 30 FROM THE FIELD OUR LINE The partnership paradox. Kathy Nargi-Toth 14 ROI Clear lines of responsibility keep highly functional cross-trained teams error free. Collaborations and Conferences At PCB East, bi-directional communication was more than a catch-phrase. by KATHY NARGI-TOTH 34 DFA Peter Bieglow 16 TIP JAR Life is a learning excursion, and the more questions you ask, the richer your journey. AOI – Defining Reliability for Complex Designs Advanced AOI techniques provide manufacturers and OEM customers with exceptional inspection reliability. by ZULKI KAHN 38 FAB BASICS Jack Olson 18 INTERCONNECT STRATEGIES Mathcad can solve complicated SI expressions including those with complex/imaginary terms, logarithmic and exponential functions. When a Good DOE Goes Bad Estimate the time constant of a process prior to conducting the DOE to prevent erroneous results. by J LEE PARKER 40 DRILL Dr. Abe (Abbas) Riazi 20 Drilling of PCBs – an Overview Engineering advances have increase throughput and enabled smaller via sizes with increased process reliability. by TODD LIZOTTE, GABOR KARDOS and RONALD D. SCHAEFFER FINAL FINISH FORUM Decisions about final finishes are often made from the design seat. George Milad 48 BGA BULLETIN Creating effective fanout patterns for microvias in an HDI stackup. DEPARTMENTS 6 8 MARKET WATCH AROUND THE WORLD 12 43 HAPPENINGS OFF THE SHELF 44 47 MARKETPLACE AD INDEX Charles Pfeil Circuits Assembly Online Manufacturing Steps Onto the Enterprise IT Stage The concept of a single, comprehensive information solution collapses when one enters the manufacturing, quality and process engineering offices, and certainly the factory floor. This has led to a new category of “enterprise level” tools called manufacturing operations system (MOS) software. by JASON SPERA circuitsassembly.com Improving Production Line Performance Balanced lines are thought to be standard for efficient production, yet in some cases, the total buffer capacity has to be spaced unevenly. The latest research shows why deliberately unbalancing the buffers may be beneficial. by DR. SABRY SHAABAN and DR. SARAH HUDSON POSTMASTER: Send address changes to PRINTED CIRCUIT DESIGN & FAB, P.O. Box 35646, Tulsa, OK 74153-0646 http://circuitsassembly.com

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - June 2008

Printed Circuit Design & Fab - June 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Interconnect Strategies Final Finish Forum DFA/DFT Signal Integrity From the Field DFA Fab Basics Drill Off the Shelf Marketplace Ad Index BGA Bulletin

Printed Circuit Design & Fab - June 2008

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