Printed Circuit Design & Fab - June 2008 - (Page 31) Emad Isaac, CTO of The Morey Group, presented the keynote, “Collaboration Across Technology,” to a standing room only crowd. for landing pads to support the housing attachment. They were not identified as having a special purpose. The layout designer saw them as non-functional pads and, following common industry practices, removed them. The result was an unusable PCB, a re-spin and a delay to market, all costly to the project and all avoidable with better communication along the supply chain. According to Isaac, the new product development pro- cess involves intellectual and practical components. Design is intellectual, and manufacturing, practical. The need to collaborate between these disciplines is critical to the success (or failure) of a program. The better the communication, the more it involves all aspects of the business, beginning with leadership, sales and the customer on the intellectual side and including practical components such as manufacturing, QA and procurement on the business side, the project will be. The presentation was illustrated by examples of DfM / DfT. According to Isaac, pushing these validation tools to the beginning of the design process reduces the number of respins and improves quality. Yet quality is not the same thing as reliability, Isaac was careful to point out. Quality focuses on the process, while reliability is related to the testing. For Morey, assembled board testing is critical. The use of HALT (Highly-Accelerated Life Test) provides detailed information on product long-term reliability. Systems supplied by Morey are designed for 20-year lives, in harsh environments, so knowing that the product will pass “the shake and bake test” associated with the HALT protocol is important. Identifying and then communicating the cause of a failure, providing appropriate feedback to the appropriate parties so that the design and PCB fab process can be adjusted, completes the loop. Creating an environment that encourages communication across different departments, technology areas and the supply chain is critical for integration of key enabling technologies. According to Isaac, “Any successful program starts with steady, honest, and timely information flowing http://www.wssi.com/pcdm http://www.wssi.com/pcdm
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - June 2008 Printed Circuit Design & Fab - June 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Interconnect Strategies Final Finish Forum DFA/DFT Signal Integrity From the Field DFA Fab Basics Drill Off the Shelf Marketplace Ad Index BGA Bulletin Printed Circuit Design & Fab - June 2008 Printed Circuit Design & Fab - June 2008 - Printed Circuit Design & Fab - June 2008 (Page Cover1) Printed Circuit Design & Fab - June 2008 - Printed Circuit Design & Fab - June 2008 (Page Cover2) Printed Circuit Design & Fab - June 2008 - Printed Circuit Design & Fab - June 2008 (Page 1) Printed Circuit Design & Fab - June 2008 - Contents (Page 2) Printed Circuit Design & Fab - June 2008 - Contents (Page 3) Printed Circuit Design & Fab - June 2008 - Our Line (Page 4) Printed Circuit Design & Fab - June 2008 - Our Line (Page 5) Printed Circuit Design & Fab - June 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - June 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - June 2008 - Around the World (Page 8) Printed Circuit Design & Fab - June 2008 - Around the World (Page 9) Printed Circuit Design & Fab - June 2008 - Around the World (Page 10) Printed Circuit Design & Fab - June 2008 - Around the World (Page 11) Printed Circuit Design & Fab - June 2008 - Happenings (Page 12) Printed Circuit Design & Fab - June 2008 - Happenings (Page 13) Printed Circuit Design & Fab - June 2008 - ROI (Page 14) Printed Circuit Design & Fab - June 2008 - ROI (Page 15) Printed Circuit Design & Fab - June 2008 - Tip Jar (Page 16) Printed Circuit Design & Fab - June 2008 - Tip Jar (Page 17) Printed Circuit Design & Fab - June 2008 - Interconnect Strategies (Page 18) Printed Circuit Design & Fab - June 2008 - Interconnect Strategies (Page 19) Printed Circuit Design & Fab - June 2008 - Final Finish Forum (Page 20) Printed Circuit Design & Fab - June 2008 - Final Finish Forum (Page 21) Printed Circuit Design & Fab - June 2008 - DFA/DFT (Page 22) Printed Circuit Design & Fab - June 2008 - DFA/DFT (Page 23) Printed Circuit Design & Fab - June 2008 - DFA/DFT (Page 24) Printed Circuit Design & Fab - June 2008 - DFA/DFT (Page 25) Printed Circuit Design & Fab - June 2008 - Signal Integrity (Page 26) Printed Circuit Design & Fab - June 2008 - Signal Integrity (Page 27) Printed Circuit Design & Fab - June 2008 - Signal Integrity (Page 28) Printed Circuit Design & Fab - June 2008 - Signal Integrity (Page 29) Printed Circuit Design & Fab - June 2008 - From the Field (Page 30) Printed Circuit Design & Fab - June 2008 - From the Field (Page 31) Printed Circuit Design & Fab - June 2008 - From the Field (Page 32) Printed Circuit Design & Fab - June 2008 - From the Field (Page 33) Printed Circuit Design & Fab - June 2008 - DFA (Page 34) Printed Circuit Design & Fab - June 2008 - DFA (Page 35) Printed Circuit Design & Fab - June 2008 - DFA (Page 36) Printed Circuit Design & Fab - June 2008 - DFA (Page 37) Printed Circuit Design & Fab - June 2008 - Fab Basics (Page 38) Printed Circuit Design & Fab - June 2008 - Fab Basics (Page 39) Printed Circuit Design & Fab - June 2008 - Drill (Page 40) Printed Circuit Design & Fab - June 2008 - Drill (Page 41) Printed Circuit Design & Fab - June 2008 - Drill (Page 42) Printed Circuit Design & Fab - June 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - June 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - June 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - June 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - June 2008 - Ad Index (Page 47) Printed Circuit Design & Fab - June 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - June 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - June 2008 - BGA Bulletin (Page Cover4)
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