Printed Circuit Design & Fab - June 2008 - (Page 4)

OUR LINE The Partnership Paradox RF, mixed digital and analog signals, and ultra high-speed circuitry that, when designed in tandem, can effectively deliver seamless connectivity across all our coveted consumer electronics. Indeed, the complexity of these devices increases exponentially to the number of features we desire and space reductions we crave (let’s call this KAtHy Kathy’s First Postulate). Product differentiation has become the critical nArgi-totH component of the design, often trumping function. It adds another layer of constraint: the form factor equation. And then there’s getting to market faster, the key driver on the product development express, imposing its own relentless pressures throughout the entire supply chain which just so happens to also demand improved productivity, better quality, lower cost and reduced risk. That’s not all. The world is becoming environmentally fussy, and while all the do-goodedness doesn’t always add up to a cleaner and safer world, it does pile on a set of “green” constraints. The latest considerations to address the Energy Using Products Directive (EuP) objectives for reducing power consumption call for the elimination of standby power options in all consumer electronics. Finding ways to “cut the power” would then become an immediate goal across the whole of the electronics design supply chain in the coming year. It seems at times, designing a PCB is mission impossible. A few weeks ago at PCB East, key design tool vendors joined to talk to designers about the current challenges and programs underway for next-generation design tools. They also explained emerging technologies that might be forthcoming and how we might as an industry integrate these opportunities into the electronics supply chain with minimal disruption. Representatives from Agilent EEsof EDA, Cadence, Mentor Graphics and Zuken participated. Unlike on the fab side, this type of dialog has been missing for some time in design circles. It has been years since the major EDA tools vendors and their customers – aka the designers – have had access to a cross-platform, interactive forum at a PCB focused function. Certainly there are valuable conversations between design tool users and their vendors in user group forums, but this is not the same as the type of dialog that cuts across tools vendors into the realm of true supply-chain communication. Integration and product complexity, not to mention business drivers, are pushing rapid evolution on the design process. Co-design of the electronic platform, from IC-to-package-toPCB, is beginning to appear in high-end applications. Tools are advancing to facilitate these co-design scenarios. In the near future, product differentiation will be determined by system innovation and company-specific customization involving the entire interconnection platform, not just in the PCB. It is a critical time for designers to talk to each other and keep current in all the technology disciplines. Recently, we’ve seen a number of enabling technologies brought to market through the collaboration of companies – some even competitors – to the benefit of the industry. It’s a paradox: differentiation through partnerships. Yet this business model is becoming increasingly popular in light of the tremendous challenges and expense companies face bringing a product to market. Moving forward, a critical aspect of design will be verification and simulation. A recent collaboration between Cadence and Mentor in the IC design space created an open-source verification methodology. Similar bridges are being laid between the design spheres, through co-design tools, and to address conflicts found in mixed technology designs that contain RF and high-speed analog/digital signals. The faster things move, the more important it is to keep open the lines of communication. Communication makes or breaks any partnership. Based on the success of the designer/tool vendor forum at PCB East, we will offer a number of dialog-provoking opportunities at PCB West in September (more on that next month). In the meantime, if you’ve identified a weak link in the chain that needs attention, let us know. We are here to facilitate the discussion. This month marks the debut of Final Finish Forum, a column featuring experts in the area of final finishes. This topic forms a natural bridge from PCB fab to assembly and involves the designer because the OEM or ODM often choose the finish. Look for more new and familiar faces as we expand our list of regular columnists and contributing authors over the coming months. 4 pcdandf.com Editorial Editor: Kathy Nargi-Toth, 678-589-8866, knargitoth@upmediagroup.com ASSociAtE Editor: Phil Buonpastore, 678-5898853, pbuonpastore@upmediagroup.com W e see, in the pursuit of performance, greater use of advanced EditoriAl officE: 2400 Lake Park Drive, Suite 440, Smyrna, GA 30080 678-589-8800; fax 678-589-8850 EditoriAl AdviSory BoArd: Dr. Eric Bogatin, Be The Signal; Michael Carano, OM Group; George Dudnikov, Sanmina-SCI; Jack Fisher, Interconnect Technology Analysis; Happy Holden, Mentor Graphics; Istvan Novak, Sun Microsystems contriButing Editor: Dr. Hayao Nakahara columniStS: Bruce Archambeault, Peter Bigelow, Michael Carano, Dominique Numakura, Charles Pfeil, Dr. Abe Riazi, Susy Webb Production mAnAging Editor: Katherine Haddox, khaddox@upmediagroup.com production mAnAgEr: Javier Longoria, jlongoria@upmediagroup.com SalES SAlES ASSociAtE: Kamden Robb, 678-589-8843, krobb@upmediagroup.com EXHiBit SAlES: Kamden Robb, 678-589-8843, krobb@upmediagroup.com; Frances Stewart, 678-817-1286, fstewart@upmediagroup.com KorEA SAlES: Young Media Inc., +82 2 2273 4818, fax +82 2 2273 4866, ymedia@ymedia.co.kr print rEprintS: Edward Kane, FosteReprints, 866-879-9144 ext. 131, fax 219-561-2009, ekane@fostereprints.com ElEctronic rEprintS: pcdf_reprints@upmediagroup.com liSt rEntAl: Jennifer Schuler, 918-496-1476, fax 918-496-9465 WEBinArS: Frances Stewart, 678-817-1286, fstewart@upmediagroup.com, pcbshows.com/webinars circulation dirEctor of AudiEncE dEvElopmEnt: Jennifer Schuler circulAtion And SuBScription inquiriES/ AddrESS cHAngES: fax 918-496-9465, jschuler@upmediagroup.com uP MEdia GrouP, inc. prESidEnt: Pete Waddell vicE prESidEnt, SAlES And mArKEting: Frances Stewart, fstewart@upmediagroup.com vicE prESidEnt, EditoriAl And production: Mike Buetow, mbuetow@upmediagroup.com SpEciAl projEctS mAnAgEr: Ronda Faries, 678-589-8827, rfaries@upmediagroup.com Printed Circuit Design & Fab is distributed without charge to qualified subscribers. For others, annual Subscription Rates in U.S. funds are: $80 (U.S. and Canada), $145 (all other countries). Single copy price is $8.50. All subscription and single copy orders or inquiries should be directed to Printed Circuit Design & Fab, P.O. Box 35646, Tulsa, OK 74153-0646, jschuler@upmediagroup. com, fax 918-496-9465. Photocopies and issues on Microfilm/Microfiche (16mm, 33mm or 105mm) are available from University Microfilms International, 300 N. Zeeb Rd., Ann Arbor, MI 48106, Telephone 313-761-4600. Printed Circuit Design & Fab is published monthly by UP Media Group Inc., 2400 Lake Park Drive, Suite 440, Smyrna, GA 30080. ISSN 1543-6527. GST 124513185/ Agreement #1419617. Periodicals postage paid at Smyrna, GA, and additional mailing offices. © 2008, UP Media Group, Inc. All rights reserved. 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Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - June 2008

Printed Circuit Design & Fab - June 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Interconnect Strategies Final Finish Forum DFA/DFT Signal Integrity From the Field DFA Fab Basics Drill Off the Shelf Marketplace Ad Index BGA Bulletin

Printed Circuit Design & Fab - June 2008

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