Printed Circuit Design & Fab - June 2008 - (Page 8) AROUND thE world EDITED By KAThy NARGI-TOTh Tin hits record high london – Tin prices are at record U.S. Conductive Polymer Industry Set for Growth San JoSE, ca – Resurgence in demand for high performance, low cost materials for electrical and electronics product components and devices are likely to spur the use of conductive polymers in the electronics industry. As stated in a recent report published by Global Industry Analysts, the electrically conducting polymers market in the U.S. is forecasted to reach 230.7 thousand metric tons by the year 2010. Lightweight, easy fabrication, low cost and high resistance to heat are prime factors driving growth in the marketplace. The growth of conductive polymers market in the United States is forecast to grow at a CAGR of 6.08% from the years 2011 through 2015. highs. Some experts say the prices may curb demand by the electronic industry, discouraging the use of the metal in emerging technology areas. Tin has become a big component in electronic products in the wake of RoHS and hit $24,600 a metric ton last week, up 45% in 2008. Electronic solders account for around 50% of global tin consumption, estimated at approximately 365,000 metric tons last year. High prices could curtail usage, as well as causing a slowdown in the transition to high tin content lead-free solders, creating problems in the electronics sector. The move to lead-free solders has been the strongest growing market for tin in recent years. Currently, lead free solder accounts for 60% of the market, and higher tin costs is just adding to the cost of RoHS compliance. 3M to Expand Production in Singapore St. Paul, Mn and SinGaPorE – 3M has announced plans to build a new facility in Singapore. According to a company spokesperson, the new film coatings plant in Singapore is intended to augment, but not replace, the company’s coatings production capacity. The plant will make coatings for 3M’s optical LCD film products, window films and automotive product applications. 3M had previously stated that it could reduce up to $1 billion in freight, supply and tax costs by moving specific operations overseas. Last month, the company said that it would move its LCD filmmaking optical systems headquarters to a location in Asia. The company already manufactures flex circuits and electronic adhesives in the region. 3M, has reportedly also selected Brazil, Russia, India, China and Poland as locations to build factories. epa to reduce airborne Lead Limits WASHINGTON – The EPA is proposing a Billion Dollar Squeeze The Real Cost of RoHS arlinGton, Va – A survey of electronics industry stakeholders finds that costs major reduction in allowable airborne lead. The new proposal is expected to come into affect in mid-September. The new EPA proposal lowers allowable concentrations of lead in the air to a range 0.10 to 0.30 micrograms per cubic meter, compared to the current human health standard of 1.5 micrograms per cubic meter. The current lead health standard remains unchanged since it was originally enacted 30 years ago. While lead contamination in the environment has been on the decline, lead emissions largely from industrial sources remain an air quality issue. The new proposal would reduce allowable airborne lead by up to 93% from current standards. 1,300 tons of lead is released annually in the U.S. associated with compliance to RoHS to date tops $32 billion. More than 200 companies were surveyed by the Technology Forecasters of the Consumer Electronics Association (CEA). The study reported the average cost per company to achieve initial compliance was $2.64 million, with an additional $482,000 to maintain annual maintenance. Total compliance costs for the industry total 1.1% of industry revenue, according to the study. The survey also found that RoHS regulations resulted in higher inventory and product costs. According to the study, 57% of the companies surveyed reported a rise in inventory. Of that group, the average increase in inventory was 21% and the average cost for carrying the inventory was reported at $688,000. According to 77% of the companies surveyed, RoHS regulations increased component, module and manufacturing costs, with average cost increase at 11.6%, and that five to ten full-time employees were assigned to assure compliance with the new regulations. Most of that manpower was drawn from an existing employee base, rather than hiring additional employees for RoHS regulation compliance, says the survey. About 29% of companies surveyed reported lost sales due to RoHS regulations, averaging $1.84 million, due to delays in new product sales and lost business in the EU. However, some companies surveyed did report some advantages to RoHS, with almost 25% saying that the company had improved its supply chain process, 20% reporting an advantage in that it reduced the number of products offered, and about 15% saying that their company gained market share as a result of RoHS. 8 printEd circuit dESign & fAB JUNE 2008
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - June 2008 Printed Circuit Design & Fab - June 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Interconnect Strategies Final Finish Forum DFA/DFT Signal Integrity From the Field DFA Fab Basics Drill Off the Shelf Marketplace Ad Index BGA Bulletin Printed Circuit Design & Fab - June 2008 Printed Circuit Design & Fab - June 2008 - Printed Circuit Design & Fab - June 2008 (Page Cover1) Printed Circuit Design & Fab - June 2008 - Printed Circuit Design & Fab - June 2008 (Page Cover2) Printed Circuit Design & Fab - June 2008 - Printed Circuit Design & Fab - June 2008 (Page 1) Printed Circuit Design & Fab - June 2008 - Contents (Page 2) Printed Circuit Design & Fab - June 2008 - Contents (Page 3) Printed Circuit Design & Fab - June 2008 - Our Line (Page 4) Printed Circuit Design & Fab - June 2008 - Our Line (Page 5) Printed Circuit Design & Fab - June 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - June 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - June 2008 - Around the World (Page 8) Printed Circuit Design & Fab - June 2008 - Around the World (Page 9) Printed Circuit Design & Fab - June 2008 - Around the World (Page 10) Printed Circuit Design & Fab - June 2008 - Around the World (Page 11) Printed Circuit Design & Fab - June 2008 - Happenings (Page 12) Printed Circuit Design & Fab - June 2008 - Happenings (Page 13) Printed Circuit Design & Fab - June 2008 - ROI (Page 14) Printed Circuit Design & Fab - June 2008 - ROI (Page 15) Printed Circuit Design & Fab - June 2008 - Tip Jar (Page 16) Printed Circuit Design & Fab - June 2008 - Tip Jar (Page 17) Printed Circuit Design & Fab - June 2008 - Interconnect Strategies (Page 18) Printed Circuit Design & Fab - June 2008 - Interconnect Strategies (Page 19) Printed Circuit Design & Fab - June 2008 - Final Finish Forum (Page 20) Printed Circuit Design & Fab - June 2008 - Final Finish Forum (Page 21) Printed Circuit Design & Fab - June 2008 - DFA/DFT (Page 22) Printed Circuit Design & Fab - June 2008 - DFA/DFT (Page 23) Printed Circuit Design & Fab - June 2008 - DFA/DFT (Page 24) Printed Circuit Design & Fab - June 2008 - DFA/DFT (Page 25) Printed Circuit Design & Fab - June 2008 - Signal Integrity (Page 26) Printed Circuit Design & Fab - June 2008 - Signal Integrity (Page 27) Printed Circuit Design & Fab - June 2008 - Signal Integrity (Page 28) Printed Circuit Design & Fab - June 2008 - Signal Integrity (Page 29) Printed Circuit Design & Fab - June 2008 - From the Field (Page 30) Printed Circuit Design & Fab - June 2008 - From the Field (Page 31) Printed Circuit Design & Fab - June 2008 - From the Field (Page 32) Printed Circuit Design & Fab - June 2008 - From the Field (Page 33) Printed Circuit Design & Fab - June 2008 - DFA (Page 34) Printed Circuit Design & Fab - June 2008 - DFA (Page 35) Printed Circuit Design & Fab - June 2008 - DFA (Page 36) Printed Circuit Design & Fab - June 2008 - DFA (Page 37) Printed Circuit Design & Fab - June 2008 - Fab Basics (Page 38) Printed Circuit Design & Fab - June 2008 - Fab Basics (Page 39) Printed Circuit Design & Fab - June 2008 - Drill (Page 40) Printed Circuit Design & Fab - June 2008 - Drill (Page 41) Printed Circuit Design & Fab - June 2008 - Drill (Page 42) Printed Circuit Design & Fab - June 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - June 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - June 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - June 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - June 2008 - Ad Index (Page 47) Printed Circuit Design & Fab - June 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - June 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - June 2008 - BGA Bulletin (Page Cover4)
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