Printed Circuit Design & Fab - July 2008 - (Page 17)

ON ThE FOREFRONT mm to 15 x 15 mm, with bottom-side ball counts ranging from 240 to more than 400, and package interconnect ball counts ranging from 104 to 160.3 To achieve small package bodies, an increasing number of companies use flip chip inside the package, especially for the bottom die in a package of a PoP. Flip chip reduces pitch for the top package of a PoP, and improves electrical performance for devices such as baseband processors by delivering power directly to the processor core, along with reduced IR drop and reduced EMI. TSv: The ultimate in 3-D. TSV technology permits devices to be placed and wired in the third dimension. 3-D TSV adoption promises higher clock rates, lower power dissipation and higher integration density. The technology will be adopted in many applications because it solves issues related to electrical performance, memory latency, power, and noise on and off the chip. For some applications, a high-bandwidth memory interface to the logic has been the main driver for the technology’s development. Both logic and memory device applications are expected to begin within a few years. The addition of DSP to image sensors is also anticipated in future camera module versions. There were more than three dozen papers on 3-D packaging at the Electronic Components and Technology Conference in May 27-30, and the sessions were packed. Even with 3-D ICs’ advantages, there are several challenges to the adoption of 3-D architectures. These challenges need to be overcome for the technology to see widespread adoption. Commercial availability of EDA tools and design methodologies. ■ Thermal concerns due to increased power densities. ■ Test, especially for repartitioned logic. The TSV market will be established when the benefits justify the cost, and on a case-by-case basis. While through vias are used in image sensors for camera modules today, other applications will take time. TSMC’s recent TSV announcements as part of its Open Innovation Platform will aid the adoption. TSMC is working with customers on design software and has introduced a SPIC tool design kit. The first technology is a post throughsilicon via technology capable of 140 µm pitch. By the end of 2009, TSMC will offer a post TSV technology with 60 µm pitch and, sometime in 2011, 17 µm pitch inline capability. Movement in the z-direction continues and a variety of solutions will remain. Stacked die CSPs will continue to see high growth. PoP adoption will expand as many system makers hop on the bandwagon. The ultimate silicon stacking, 3-D TSV, will see widespread adoption as some of today’s key issues are resolved. pcd&f ■ rEFErEncES 1.TechSearch International Inc., Advanced Packaging Update: Market and Technology Trends, March 2008. 2. B. Toleno Ph.D., and D. Maslyk, “Process and Assembly Methods for Increased yield of Package on Package Devices, IPC Apex Proceedings, ” April 2008. In Stock and ready to ship! ONLY $34.95 Order your copy of the fourth edition of Printed Circuit Board Basics: An Introduction to the PCB Industry today! plus shipping & handling Now there’s an easy-to-read handbook that explains the process and business of printed circuit board manufacturing in simple terms anyone can understand! A must-read for those who are new to the industry and a valuable resource for those who work in the industry, Printed Circuit Board Basics: An Introduction to the PCB Industry is the perfect book to help your customers and employees understand the services your company provides to the PCB industry. Authored by Dan Beaulieu, a 30-year industry veteran and a founding partner of D.B. Management Group, and edited by Mike Buetow, editor-in-chief of Printed Circuit Design & Manufacture magazine, the fourth edition contains: • An updated primer on single-sided, double-sided and multilayer PCB manufacturing processes; • A review of new technologies such as embedded components and microvias (HDI); • Updated PCB specifications; • A history of the industry; • Detailed, updated graphics—including over 45 color photos and illustrations; • An updated glossary of terms and definitions (twice the size of the glossary in previous editions); • And much more! Visit www.pcdandf.com/cms/basics to order your copy of Printed Circuit Board Basics today for only $34.95 plus shipping and handling! P.S. Is your company looking for the perfect customer premium or orientation tool? PCB Basics can be customized with your logo, products, services and more. Contact Frances Stewart (fstewart@upmediagroup.com) at 678-817-1286 for details and a quote. JULY 2008 printEd circuit dESign & fAB 17 http://www.pcdandf.com/cms/basics

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Printed Circuit Design & Fab - July 2008

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