Printed Circuit Design & Fab - July 2008 - (Page 2)

JULY 2008 • VOL. 25 • NO. 7 FEATURES Thermal issues effect electronic equipment performance. Thermal modeling, innovative materials and the use of a systems design approach can take the heat out. Images © iStockPhoto.com/Evgeny Kuklev (water); Jakub Semeniuk (circuits). Design by Katherine Haddox 20 SYSTEM DESIGN The Cost of Advancing Technology New collaborative systems connect designers and extend their reach beyond the PCB to other disciplines, enhancing the product development cycle. by HENRY POTTS 24 THERMAL MANAGEMENT POINT OF VIEW 4 SOLVING SYSTEM LEVEL THERMAL MANAGEMENT CHALLENGES Thermal management is critical to overall system performance so mechanical designers need to consider thermal issues from the earliest stages of the design. by DR. JOHN PARRY 28 CO-DESIGN OUR LINE What keeps you up at night? Kathy Nargi-Toth 14 ROI Luck is good planning, carefully executed, with a "just do it" attitude. Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 1 New software tools ease problems associated with power delivery design in large computer systems. by DAVID QUINT and CHARLES KEEN 32 EMERGING TECHNOLOGIES Peter Bigelow 15 FINAL FINISH FORUM Why is immersion silver the preferred finish in ballistic missile nosecones? ‘WARM’ MANUFACTURING HEATS UP Nanotechnology poses an attractive solution for lower-temp soldering. by DR. ALAN RAE, DR. ANDREW SKIPOR and MARC CHASON 36 ENVIRONMENT Don Cullen 16 ON THE FOREFRONT Electronics companies across markets are hopping on PoP . Greener PCB Coatings Balance cost, performance and environmental impact when selecting a conformal coating. by KENT LARSON 40 SOLDER MASK E. Jan Vardaman 18 POSITIVE PLATING Advanced PCBs require electrolytic copper capable of excellent throwing power and leveling. Environmentally Friendly Digital Inkjet Solder Mask Printing The advantages of inkjet processing provide the PCB fabricator with a new tool to improve product quality and reduce waste. by YEHUDA DAVID and DR. YIFAT BAREKET Michael Carano 48 BGA BULLETIN Maximize high pin count BGA routing by using regional application of blind and buried vias. DEPARTMENTS 6 8 Charles Pfeil MARKET WATCH AROUND THE WORLD 12 43 HAPPENINGS OFF THE SHELF 44 47 MARKETPLACE AD INDEX Circuits Assembly Online ‘Web Circuits’ A major OEM has five boards with OSP finish requiring four additional components and the boards. Most companies would re-spin the design. But there’s a less expensive, more elegant solution. by MIKE BUETOW circuitsassembly.com A Novel Non-VOC Conformal Coating Moisture-cure coatings tend to be fast-reacting and could block machines. New chemistries, however, have led to a polyurethane pre-polymer, 100% solids material that performs well in SIR and thermal shock tests. by JADE BRIDGES POSTMASTER: Send address changes to PRINTED CIRCUIT DESIGN & FAB, P.O. Box 35646, Tulsa, OK 74153-0646 http://iStockPhoto.com/Evgeny http://circuitsassembly.com

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Printed Circuit Design & Fab - July 2008

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