Printed Circuit Design & Fab - July 2008 - (Page 23)

SYSTEM dESiGn designer, is a long, cumbersome, and error prone process. By implementing collaboration tools, when a change is proposed, the change can be communicated to the other disciplines who have the opportunity to view the proposal in a familiar environment (viewed in a typical PCB layout tool or mechanical 3-D tool respectively), comment, offer a counter proposal or approve the change, and then have that communicated back to the proposing party. All of this, in real time, represents a significant improvement over paper communication methods. Collaboration between ECAD and the rest of the enterprise throughout the design process can also significantly affect the product development process efficiency, and may even mean the difference between a profitable and non-profitable product. Prime examples include realtime collaboration between ECAD, manufacturing and procurement. For example, electronically communicating a proposed PCB design change (a different component) to procurement and manufacturing give them the opportunity to review the proposal for volume purchase, price, and manufacturability in real time. This is especially important when design and manufacturing may take place at different locations around the world. bilities are highly sophisticated. They are tightly integrated flows with IP management and integrated into corporate systems. They contain design capabilities for the most advanced technologies with easy-to-use human interfaces. They extend beyond PCB design and provide collaboration with other disciplines within ECAD, and on to other product development and manufacturing organizations. Collaboration connects the silos together, as illustrated in FiGurE 4. These sophisticated design flows require extensive R&D investment to develop, deliver to users, and support. These systems do not come cheap, but electronic companies are switching from commodity PCB design systems to ones that can provide this level of product development support are realizing that investing in these systems puts them at a competitive advantage. Companies are also investing in the infrastructure support and training required to operate these systems. We even see countries like China that previously survived on low-end design systems now switching to systems containing the most innovative technologies available. Be cautious, U.S., Japan and Europe! Competition will only get tougher. pcd&f The Cost of Being Competitive All of the trends and technology discussed lead to one conclusion: ECAD systems that provide this level of design capa- hEnry PottS is vice president and general manager, Mentor Graphics, System Design Division. He can be reached at henry_ potts@mentor.com Utilising a unique advanced resin technology developed by Sun Chemical, we are now able to offer a new SMART (SolderMask Advanced Resin Technology) product, which meets the industry needs of tomorrow, today. ImagecureSMART ® OFFERS: Halogen free Meets all current OEM specifications Lower temperature pre-dry window offering a significantly harder tack-free finish One product with increased photospeed allowing exposure by LDI or standard contact printingsystems One product for both Solvent and Aqueous developing Ability to hold fine lines and features Excellent resistance to all current final surface finishes including lead free solder Can be laser ablated for ease of traceability RoHs compliant IMAGECURE SMART® A UNIQUE ADVANCED RESIN TECHNOLOGY Sun Chemical Circuits Norton Hill Midsomer Norton Bath BA3 4RT United Kingdom Tel: +44 (0) 1761 414 471 Fax: +44 (0) 1761 416 609 www.sunchemicalcircuits.com JULY 2008 printEd circuit dESign & fAB 23 http://www.sunchemicalcircuits.com http://www.sunchemicalcircuits.com

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Printed Circuit Design & Fab - July 2008

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