Printed Circuit Design & Fab - July 2008 - (Page 43) MACHINES MATERIALS TOOLS SYSTEMS SOFTWARE ! ! ! CAM TOOLS DownStream’s CAM350 version 10 features integration with Blueprint’s document authoring software to create and distribute the files required for a PCB fabrication and assembly release package, resulting in a single file for PCB postprocessing. The product can be used in the verification of design data prior to PCB fabrication and allows users to distribute, view and extract documents, Gerber files, nC Drill/Mill data and panel designs for the manufacturing process. wHo: Downstream weB: downstreamtech.com LINk LAYOuT TO SCHEMATIC DesignAdvance Systems, Inc., releases CircuitProbe, which enables bi-directional communication, through IPC, between layout and a PDF of the schematic. The tool gives designers and engineers the ability to select design elements in either Cadence Allegro viewer environment in or a PDF of the schematic, with the corresponding design elements selected in the other application. PTFE MATERIAL rT/Duroid 6202 Pr, PTFe material produces resistor tolerances claimed to be as low as 5% for high reliability planar resistor applications. Additional embedded resistor products offered by the company include ro4003C and ro4350B laminates. The products are produced for use with thin film embedded resistor copper foil in high-speed electronic devices and enhanced copper bond technology for cost-effective performance and reduced PIM. wHo: rogers Corp. weB: rogerscorporation.com/acm wHo: DesignAdvance weB: ema-eda.com OTHERS OF NOTE BOuNDARY-SCAN TESTER JT 2147/AGP is for use with Aeroflex in-circuit testers (ICTs), allowing the 4200 Series systems to be interfaced with JTAG’s boundaryscan controller.The product allows boundaryscan test access port (TAP) signals within the ICT system for claimed improvement in signal integrity and a simplified design. The company claims that the product can be installed on the Aeroflex GPIo custom interface module to provide ground isolation plus a switching matrix to routeTAP signals to pins on the test fixture. Benefits include fixtureless test preparation and the re-use of standalone applications such as prototyping and field service, with increased cost-effectiveness through reduced test fixture complexity. wHo: JTAG Technologies weB: jtag.com MIxED SIgNAL TESTER ABI’s BoardMaster 8000 PluS diagnostic system is used in the testing and diagnosis of analog, digital or mixed signal PCBs.The system allows users to store instrument settings, test procedures, measurements and results for a known good PCB, then runs an automated test to compare test PCBs, highlighting any faults and their locations. The company states that the product is PC controlled, with five ABI instrument modules (standard), and features include digital and analog IC testing, digital oscilloscope, digital multimeter, function generator, frequency counter, variable power supply and universal I/o. wHo: aBi weB: abielectronics.co.uk FREE PCB LAYER STACk EDITOR lKSoft 2nd edition STeP-AP210 (ISo 10303-210) electronic Assembly Interconnect and Packing Design used to coordinate information regarding PCB procurement, design and fabrication and to standardize data exchange. The company claims that tools for converting, viewing and editing of CAD/CAM data in the areas of mechanics (2D/3D), electrical installation, printed circuit boards and assembly, and the connecting of this information with PDM and PlM systems is included with the product. The free 90 day license in June and July 2008, extended to a full year if you provide feedback. wHo: lKSoft weB: lksoft.com THERMAL IMAgINg FOR PCBS optoTherm’s new el thermal imaging system enclosure provides a claimed stable test environment from the ambient environment, blocking air currents generated by heating and air conditioning ducts that can influence the thermal patterns shown by its infrared camera inspection system. A motorized camera slide and controller position the camera for circuit board comparison and short circuit tests, and to verify PCB functionality. A platform with adjustable PCB locators enable repeatable positioning of board sizes up to 22” x 20” . wHo: optotherm weB: optotherm.com SENTINEL-PI DESIgN SOFTWARE Apache Design Solutions’ Sentinel-PI chippackage-system design and analysis software allows SoC-Aware modeling and analysis of power delivery network for IC package and PCB designers. The company claims that the product allows 3-D full-wave power network extraction and integrity analysis for package and PCB designs, as well as resistance check, static Ir-drop analysis (DC) and frequencydomain simulation, and impedance analysis of multi-port power delivery network of the chip, package and board (AC), and time-domain dynamic voltage drop analysis (transient). wHo: Apache Design Solutions weB: apache-da.com INkjET CONDuCTIvE SILvER INk Sunjet, has announced the development of silver nano-particles ink designed for conductive films. The company has partnered with manufacturer of nano-particle silver, to allow claimed dispersing of the silver particle products at near 20 and 40 weight percent silver content. The company claims that the inks can be sintered at very low temperatures, below 150C, which is critical for some printed electronics applications. wHo: Sunjet weB: sunjetink.com JULY 2008 printEd circuit dESign & fAB 43 http://www.ema-eda.com http://www.rogerscorporation.com/acm http://www.downstreamtech.com http://www.abielectronics.co.uk http://www.lksoft.com http://www.jtag.com http://www.sunjetink.com http://www.apache-da.com http://www.optotherm.com
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - July 2008 Printed Circuit Design & Fab - July 2008 Printed Circuit Design & Fab - July 2008 - (Page Cover1) Printed Circuit Design & Fab - July 2008 - (Page Cover2) Printed Circuit Design & Fab - July 2008 - (Page 1) Printed Circuit Design & Fab - July 2008 - (Page 2) Printed Circuit Design & Fab - July 2008 - (Page 3) Printed Circuit Design & Fab - July 2008 - (Page 4) Printed Circuit Design & Fab - July 2008 - (Page 5) Printed Circuit Design & Fab - July 2008 - (Page 6) Printed Circuit Design & Fab - July 2008 - (Page 7) Printed Circuit Design & Fab - July 2008 - (Page 8) Printed Circuit Design & Fab - July 2008 - (Page 9) Printed Circuit Design & Fab - July 2008 - (Page 10) Printed Circuit Design & Fab - July 2008 - (Page 11) Printed Circuit Design & Fab - July 2008 - (Page 12) Printed Circuit Design & Fab - July 2008 - (Page 13) Printed Circuit Design & Fab - July 2008 - (Page 14) Printed Circuit Design & Fab - July 2008 - (Page 15) Printed Circuit Design & Fab - July 2008 - (Page 16) Printed Circuit Design & Fab - July 2008 - (Page W1) Printed Circuit Design & Fab - July 2008 - (Page W2) Printed Circuit Design & Fab - July 2008 - (Page W3) Printed Circuit Design & Fab - July 2008 - (Page W4) Printed Circuit Design & Fab - July 2008 - (Page W5) Printed Circuit Design & Fab - July 2008 - (Page W6) Printed Circuit Design & Fab - July 2008 - (Page W7) Printed Circuit Design & Fab - July 2008 - (Page W8) Printed Circuit Design & Fab - July 2008 - (Page W9) Printed Circuit Design & Fab - July 2008 - (Page W10) Printed Circuit Design & Fab - July 2008 - (Page W11) Printed Circuit Design & Fab - July 2008 - (Page W12) Printed Circuit Design & Fab - July 2008 - (Page W13) Printed Circuit Design & Fab - July 2008 - (Page W14) Printed Circuit Design & Fab - July 2008 - (Page W15) Printed Circuit Design & Fab - July 2008 - (Page W16) Printed Circuit Design & Fab - July 2008 - (Page 17) Printed Circuit Design & Fab - July 2008 - (Page 18) Printed Circuit Design & Fab - July 2008 - (Page 19) Printed Circuit Design & Fab - July 2008 - (Page 20) Printed Circuit Design & Fab - July 2008 - (Page 21) Printed Circuit Design & Fab - July 2008 - (Page 22) Printed Circuit Design & Fab - July 2008 - (Page 23) Printed Circuit Design & Fab - July 2008 - (Page 24) Printed Circuit Design & Fab - July 2008 - (Page 25) Printed Circuit Design & Fab - July 2008 - (Page 26) Printed Circuit Design & Fab - July 2008 - (Page 27) Printed Circuit Design & Fab - July 2008 - (Page 28) Printed Circuit Design & Fab - July 2008 - (Page 29) Printed Circuit Design & Fab - July 2008 - (Page 30) Printed Circuit Design & Fab - July 2008 - (Page 31) Printed Circuit Design & Fab - July 2008 - (Page 32) Printed Circuit Design & Fab - July 2008 - (Page 33) Printed Circuit Design & Fab - July 2008 - (Page 34) Printed Circuit Design & Fab - July 2008 - (Page 35) Printed Circuit Design & Fab - July 2008 - (Page 36) Printed Circuit Design & Fab - July 2008 - (Page 37) Printed Circuit Design & Fab - July 2008 - (Page 38) Printed Circuit Design & Fab - July 2008 - (Page 39) Printed Circuit Design & Fab - July 2008 - (Page 40) Printed Circuit Design & Fab - July 2008 - (Page 41) Printed Circuit Design & Fab - July 2008 - (Page 42) Printed Circuit Design & Fab - July 2008 - (Page 43) Printed Circuit Design & Fab - July 2008 - (Page 44) Printed Circuit Design & Fab - July 2008 - (Page 45) Printed Circuit Design & Fab - July 2008 - (Page 46) Printed Circuit Design & Fab - July 2008 - (Page 47) Printed Circuit Design & Fab - July 2008 - (Page 48) Printed Circuit Design & Fab - July 2008 - (Page Cover3) Printed Circuit Design & Fab - July 2008 - (Page Cover4)
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