Printed Circuit Design & Fab - July 2008 - (Page W9)

SCH ED UL E -AT-A -GL A NCE 4 pm – 5 pm 1:30 pm – 3:30 pm 1:30 pm – 3:30 pm FREE TECHNICAL SESSION NEW! F6 – Lead-Free Cost Reductions Speaker: Yash Sutariya, Saturn Electronics Corp. 3-DAY TECHNICAL CONFERENCE COURSES NEW! W9 – Panel Session: Halogen-Free Update Speakers: TBD 3-DAY TECHNICAL CONFERENCE COURSES W12 – Materials for High Speed, High Frequency and Lead Free PCBs Speaker: Rick Hartley, L-3 Communications, Avionics Systems 5 pm – 7 pm RECEPTION ON EXHIBIT FLOOR 5:30 pm – 6:30 pm 1:30 pm – 5 pm NEW! DD – DESIGNER DECISION 2008 3-DAY TECHNICAL CONFERENCE COURSES NEW! S7 – Power System Design on High-Speed PCBs Speaker: Rick Hartley, L-3 Communication, Avionics Systems NEW! W13 – BGA Fanout Patterns Speaker: Charles Pfeil, Mentor Graphics 1:30 pm – 5 pm 3-DAY TECHNICAL CONFERENCE COURSES NEW! S13 – A PCB Designer’s Guide to IBIS Models Speaker: Tim Coyle, Signal Consulting Group WEDNESDAY, SEPT. 17 8 am – 4 pm REGISTRATION OPEN 9 am – 5 pm S8 – Vias and Their Effects on HighSpeed Signals Speaker: Robert Hanson, Americom Seminars PROFESSIONAL DEVELOPMENT CERTIFICATE COURSE NEW! DEC 5 – High-Speed Design, Including Simulation Tool Use Speaker: Lee Ritchey, Speeding Edge NEW! S9 – Making the Most of Your Design Time Speaker: Susy Webb, Fairﬁeld Industries S14 – New Test Methods For High-Speed, High-Density PCBs Speaker: Robert Hanson, Americom Seminars S15 – The Fabrication Process: A HandsOn Experience for Designers Speaker: Gary Ferrari, FTG Circuits THURSDAY, SEPT. 18 8 am – 2:30 pm 9 am – 11 am 3-DAY TECHNICAL CONFERENCE COURSES NEW! W5 – Breaking New Ground in PCB RF Design Speakers: Per Viklund and Loy D’Souza, Mentor Graphics REGISTRATION OPEN 9 am – 5 pm FRIDAY, SEPT. 19 8 am – 10 am PROFESSIONAL DEVELOPMENT CERTIFICATE COURSE DEC 5 continued 9 am – 11 am REGISTRATION OPEN 9 am – 5 pm W6 – Designing for Asian Fabrication Speaker: Happy Holden, Mentor Graphics PROFESSIONAL DEVELOPMENT CERTIFICATE COURSES DEC 5 continued T3 – Placement and Routing of Complex PCBs Speaker: Rick Hartley, L-3 Communication, Avionics Systems; and Susy Webb, Fairﬁeld Industries NEW! W7 – Panel Session: IC-PackagePCB Co-Design Strategies Panelists: TBD 3-DAY TECHNICAL CONFERENCE COURSES NEW! W10 – Signal Integrity Simulation Crash Course Speaker: Tim Coyle, Signal Consulting Group 9 am – 12:30 pm 3-DAY TECHNICAL CONFERENCE COURSES S6 – Microelectronics Design, Chipon-Board, Flip Chip and 3D Package Technologies Speaker: Vern Solberg, STC NEW! W11 – Bringing Order to the FPGA I/O Planning Madness Speaker: Bruce Riggins, Taray Inc. T4 – All You Need to Know About Bypassing Including BGAs Speaker: Robert Hanson, Americom Seminars 9 am – 12:30 pm 3-DAY TECHNICAL CONFERENCE COURSES NEW! S10 – Global Environmental Regulations: Updates on RoHS and WEEE, and an Intro to REACH Speaker: Michael Kirschner, Design Chain Associates T5 – Basics of DFM Speaker: Gary Ferrari, FTG Circuits 10 am - 3 pm 12 pm – 1 pm EXHIBITS OPEN 11 am – 1 pm PROFESSIONAL DEVELOPMENT ATTENDEE LUNCH 3-DAY TECHNICAL CONFERENCE COURSES NEW! W8 – Probing Signal Integrity – Measuring High-Speed Circuits Speaker: Robert Easson, Analytical Edge S11 – PCB Layout Guidelines for Signal Integrity, EMI and High Speed Speaker: Susy Webb, Fairﬁeld Industries S12 – Predictive Analysis for ThroughHole to HDI Conversion Speaker: Gary Ferrari, FTG Circuits Early Bird Discount Deadline | Re g i ste r b y Au g u st 1 9 a n d sa v e u p to $ 1 0 0 ! 9

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Printed Circuit Design & Fab - July 2008

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