Printed Circuit Design & Fab - August 2008 - (Page 12)

haPPEninGS FACES Rogers Corp. has appointed Michael D. Bessette to head its Advanced Circuit Materials Division (ACMD) effective July 10, 2008. A 33-year veteran of Rogers Corp., Bessette previously worked at Rogers’ R&D department in Connecticut and also in Japan where he headed up Rogers’ joint venture with INoAC Corp., manufacturing elastomer materials. Bessette has been responsible for the Durel Division’s global electroluminescent backlighting business for the past five years. CADParts & Consulting llC announced that victor Tejeda will head up its ATe Design Services Division. Plans for the ATe Division include onshore ATe and DUT design at off-shore prices. Tejeda brings a wealth of knowledge and expertise to the ATe design division. Tejeda is an IPC certified designer with a long history of designing probe cards, load boards, DUT boards and tester boards for Agilent, Fairchild, Credence, Teradyne and TI interfaces. Endicott Interconnect Technologies Inc. President and Ceo James J. Mcnamara Jr. has been named a recipient of the 2008 ernst & young entrepreneur of the year award in the advanced technology solutions category for the Upstate New york, Western Pennsylvania and West virginia region. The award recognizes outstanding entrepreneurs who are building and leading dynamic, growing businesses. CCMP Inc. has announced the addition of Mike winship to its management staff. Winship brings a wealth of PCB manufacturing and executive management experience to the company that spans more than 25 years. Based in central Florida, Winship will provide direct sales support and act as main liaison to headquarters and manufacturing locations of the company. Machine vision Products appoints Paul Groome, sales and marketing manager for Western North American and corporate accounts. Groome has extensive industry experience that will aid him in proactively addressing customer requirements. EVENTS 17-21 SMTAI 2008 Disney's Coronado Springs Resort Lake Buena Vista, FL Contact: smta.org; joann@smta.org 18-22 IEEE EMC 2008 Cobo Center Detroit, MI Contact: scott@emcsociety.org auGuSt SEPtEMbEr 2-5 ElectronicIndia 2008 Bangalore, India Contact: info@electronicindia.net 30th Annual EoS/ESD Symposium Westin La Paloma Resort Tucson, AZ Contact: esda.org/symposia.html 7-12 9 - 12 GlobalTRonICS 2008/IMEX Suntec Singapore Contact: www.globaltronics.com.sg 14-19 PCB wEST 2008 MARRIoTT SAnTA ClARA SAnTA ClARA, CA Contact: Frances Stewart, fstewart@upmediagroup.com 20-25 IPC Midwest Conference & Exhibition Renaissance Schaumburg Hotel & Convention Center Schaumburg, IL Contact: Maria Labriola, marialabriola@ipc.org octobEr 21-23 Mexitronica Guadalajara, Mexico Contact: www.mexitronica.com 22-24 TPCA Show Hosted by TPCA Taipei, Taiwan Contact: www.tpca.org.tw 3-5 2008 International Printed Circuit and Electronics Assembly Fair Sponsored by HKPCA Shenzhen, China Contact: info@e21mm.com Dow Chemical will buy Rohm and haas for $78 per share in cash, over $15 billion. Rohm and haas will retain its Philadelphia headquarters location, and continue to do business under the Rohm and haas name. Further, Dow will contribute a number of specialty chemicals business segments to the Rohm and haas portfolio that have greater synergy with the Philadelphia Company’s established strengths. R&D Circuits and Anestel announce a merger. Terms of the agreement were not disclosed. R&D Circuits was founded in 1969 and focuses on PCBs for the ATe industry offering PCB design, engineering, fabrication and assembly manufacturing services. Anestel, 12 founded in 2005, manufactures and markets test sockets and interposers for testing ICs, including high-frequency computer chips. Molex Inc. has completed its previously announced acquisition of Taipeibased AFlextech Inc. No financial terms were disclosed. AFlextech designs and manufactures flexible circuits and assemblies. The company will operate as a subsidiary of Molex and will be part of the company’s Global Integrated Products Division. RuwEl Gmbh has announced the acquisition of naavinya CAD Soft ltd. (NCS) in Bangalore. This facility will be used to supply small and medium dEcEMbEr IT’S A dEAL production for industrial electronics, medical technology and mechanical engineering. The company has also announced that manufacturing of its existing products will be transferred and consolidated in specific locations. CADParts & Consulting has entered into a vAR agreement with CAD Design Software to sell and support CAD Design Software’s line of design and layout tools, with a focus on PCB, radio frequency/microwave, flex, and hybrid/ MCM (LTCC) technologies. Additionally, CADParts & Consulting is integrating several seats of CAD Design Software’s ePD (electronics Packaging Designer) into its development flow to further support its design customers. AUGUST 2008 printEd circuit dEsign & faB http://smta.org http://esda.org/symposia.html http://www.globaltronics.com.sg http://www.mexitronica.com http://www.tpca.org.tw

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - August 2008

Printed Circuit Design & Fab - July 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Software Performance Interconnect Strategies Final Finish Forum Product Development Challenges in a Global Market Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2 Low-Loss Fluoropolymer Copper Clad Laminate Qualifying PCBs Outsourced in Asia Copper Plating and Microvia Fill for Advanced PCBs Off the Shelf Marketplace Ad Index BGA Bulletin

Printed Circuit Design & Fab - August 2008

For optimal viewing of this digital publication, please enable JavaScript and then refresh the page. If you would like to try to load the digital publication without using Flash Player detection, please click here.