Printed Circuit Design & Fab - August 2008 - (Page 2)

AUGUST 2008 • VOL. 25 • NO. 8 FEATURES Today, globalization means more than simply manufacturing globally. Global design teams can work together, seamlessly, around the clock and around the world, reducing the time-to-market for new products. Cover images © iStockPhoto.com/ Emrah Turudu; Ermin Gutenberger Design by Katherine Haddox 24 GLOBAL ENTERPRISE PRODUCT DEVELOPMENT CHALLENGES IN A GLOBAL MARKET Leveraging globalization allows electronics companies to meet business goals of improved time-to-market and lower development costs. by JOHN ISAAC 28 CO-DESIGN Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2 POINT OF VIEW 4 New software tools ease problems associated with power delivery design in large computer systems. by DAVID QUINT and CHARLES KEEN 31 MICROWAVE LAMINATE OUR LINE M&A: The ultimate partnership. Kathy Nargi-Toth 14 Low-Loss Fluoropolymer Copper Clad Laminate Improved evaluation methods clarify dielectric loss, including conductor loss and roughness loss on copper-clad laminate materials. by KAZUHIKO NIWANO, MANUEL REYES, MITSUFUMI ONO and KOJI IKAWA 36 OUTSOURCING ROI Choosing the right strategic partner can reduced your time-to-market and minimize costs. Peter Bigelow 16 Qualifying PCBs Outsourced in Asia Communication, documentation and teamwork between suppliers reduces the risk and increases the benefits of outsourcing. by MUMTAZ Y. BORA 40 PLATING TIP JAR Company design standards allow for the creation of schematics and boards in an efficient manner. Copper Plating and Microvia Fill for Advanced PCBs Vertical in-line plating systems are well-suited for high-volume PCB manufacturing that requires copper plated microvia fill. by BRUCE CHEN Susy Webb 18 SOFTWARE PERFORMANCE With software performing at peak levels, it’s the designer and hardware that need to pick up the pace. DEPARTMENTS 6 8 Abby Monaco 20 MARKET WATCH AROUND THE WORLD 12 43 HAPPENINGS OFF THE SHELF 44 47 MARKETPLACE AD INDEX INTERCONNECT STRATEGIES Mathcad allows Fourier transformation, convolution, SI modeling and simulation of PCB topologies. Dr. Abe (Abbas) Riazi 23 Circuits Assembly Online circuitsassembly.com FINAL FINISH FORUM HASL remains a widely used surface finish with lead and lead-free solder options. Faster Throughput Through Reliability Analysis Capitalizing on the benefits of Lean manufacturing requires a companywide focus on elimination of non-value added activity and enhanced throughput. Reliability analysis resources can be great tools in supporting this effort, as thorough reliability analysis helps minimize process variability. by RYAN WOOTEN Jim Kenny 48 BGA BULLETIN Effective fanout patterns increase route density and enable the fewest number of layers. PWB Procurement – Auditing a Fabricator Bare boards, be they prototype or production, involve distinctly different buying patterns and requirements, and with them, issues OEM purchasers should be aware of. What engineering and procurement should know. by ZULKI KHAN Charles Pfeil POSTMASTER: Send address changes to PRINTED CIRCUIT DESIGN & FAB, P.O. Box 35646, Tulsa, OK 74153-0646 http://iStockPhoto.com/ http://circuitsassembly.com

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - August 2008

Printed Circuit Design & Fab - July 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Software Performance Interconnect Strategies Final Finish Forum Product Development Challenges in a Global Market Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2 Low-Loss Fluoropolymer Copper Clad Laminate Qualifying PCBs Outsourced in Asia Copper Plating and Microvia Fill for Advanced PCBs Off the Shelf Marketplace Ad Index BGA Bulletin

Printed Circuit Design & Fab - August 2008

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