Printed Circuit Design & Fab - August 2008 - (Page 25)

GLOBAL EntErPriSE for the different regions. The variations are dependent on the combination of component(s) mounted and independent of the bare board. The bare boards can then be manufactured in high volumes and stockpiled. (The bare board is not nearly as expensive as the components that go on it.) Then depending on the specific volumes required for each region, have manufacturing assemble the boards with the correct set of components. The savings are significant and open up sales in global markets. You only have to do one design instead of multiple designs. The design software keeps track of the variants and enables manufacturing to assemble to the correct BOM (bill of materials) depending on the version (fiGurE 2). You can produce the common bare board in high volumes and stockpile them ready for assembly; then assemble the number of end products required for each region as needed, avoiding surplus stock and associated waste. fiGurE 2. variant design can be used to drive both regional and model BoMs. Build Anywhere A common practice to reduce product costs in today’s global environment is to outsource manufacturing to a lower-cost manufacturing center. A company may want to line up multiple manufacturers to meet high volume and flexible demands. Taking a product from design into a successful manufacturing process requires that decisions be made during the design process to result in a smooth transition of the design into the manufacturer(s) environment (new product introduction). First, let’s look at some decisions during design that could make the difference between a successful product and one that misses revenue goals. One of these involves choosing components early and throughout ECOs (engineering change orders) in the design process. The choice of the wrong component (even though functionally correct) could mean an increase in product cost (high reliability and an expensive part into a consumer product). Another example is a part that requires manual versus automatic assembly, again increasing the product cost (fiGurE 3). Yet another is the ability to obtain enough parts to support your production volume. The way to prevent these situations involves two areas requiring electronic design solution capabilities. First is the ability to produce work-in-progress BOMs and communicate those to the target procurement and manufacturing organizations. These should be produced as soon as “Ventec laminate has been a tremendous asset in Titan PCB East’s ability to provide a high quality, high reliability lead free product to today’s time critical, cost sensitive market. Ventec VT-47 provides superior peel strength, high Td, Z-axis stability, thermal reliability, surface quality and inventory selection all in the same package. The fact that this is provided in a cost competitive manner is icing on the cake. Ventec is not just a player in the game, they are a top performer. The addition of VT-90 polyimide materials to the FR-4 offerings make Ventec a force to be reckoned with in the future.” Mike Berg, President and CEO, Titan PCB East – Amesbury, MA “When using the VT-47 and VT-481 materials, we have found above average drill and scoring characteristics without experiencing the fracturing and haloing associated with other well-known lead free comparable phenolic resin systems.” John Gratton Engineering Manager Century Circuits – Toronto, ON “We have been very pleased with the quality, service, performance, and consistency of the Ventec materials for almost two years now. I would not hesitate to recommend Ventec VT-47 to our customers as a reasonably priced alternative for lead free assembly.” Robert E. Welch Process Engineering Manager Waytec Electronics Corp. – Lynchburg, VA “The family of Ventec laminates has made an improvement in our processing of multilayer circuits. The materials exhibit very good consistency. Our quality with the performance of these laminates.” department is very satisfied Jim King Process Engineer Philway Products – Ashland, OH 16 Hunt Rd. South • Amesbury, MA 01913 • (978) 388-9610 • (978) 388-5339 fax • www.globallaminates.com Sales reps and distributors wanted: email Bruce at bhurley@globallaminates.com AUGUST 2008 Global Laminates Inc. printEd circuit dEsign & faB 25 http://www.globallaminates.com http://www.globallaminates.com

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - August 2008

Printed Circuit Design & Fab - July 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Software Performance Interconnect Strategies Final Finish Forum Product Development Challenges in a Global Market Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2 Low-Loss Fluoropolymer Copper Clad Laminate Qualifying PCBs Outsourced in Asia Copper Plating and Microvia Fill for Advanced PCBs Off the Shelf Marketplace Ad Index BGA Bulletin

Printed Circuit Design & Fab - August 2008

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