Printed Circuit Design & Fab - August 2008 - (Page 27)

GLOBAL EntErPriSE constraints and intent, work-in-progress design data, design reuse data, best practices work flow, etc.) be easily created, protected and accessed by designers and manufacturing. This cannot be accomplished without sophisticated ECAD design flows supported with infrastructure capabilities on a worldwide basis. This type of infrastructure requires a significant investment by the company to build and maintain. Also, the question might be: “Can a company’s ERP, PLM or CIS systems suffice to provide the IP management capability for the electronic designer?” The answer is “maybe,” given a large investment in customization and interfaces. However, the most efficient way to provide the designer with speed and access is to have a system and data that “are a mouse click away” by storing all of the IP in the design tool’s native formats. What is required though is that the ECAD design management system (DMS) is bidirectionally integrated with the company’s ERP, PLM and CIS systems to accept and provide data. fiGurE 5. electronic collaboration between eCAD and MCAD can shorten design times and improve productivity and quality. or mechanical 3D tool) and can test the complete design (e.g. for enclosure interference). ■ To comment, offer a counter proposal or approve the change, and then have that communicated back to the proposing party. ■ If accepted, to have the change reflected into the databases of both the ECAD and MCAD engineers. It is important here to distinguish between true ECAD – MCAD collaboration and 3D viewing or data transfer. Database transfer via the older existing standard (IDF) has long been used to interface the entire PCB design or mechanical enclosure (initial board outline, holes, component placements, etc.) from the MCAD to ECAD (or vice versa) at the beginning and end of the design process, respectively. This method does not identify the incremental changes during the design process nor does it support a collaboration process of proposal and acceptance. Neither is collaboration merely 3D viewing of PCB design data in a mechanical enclosure. Subtle errors such as interference, thermal hot spots or stress can go undetected unless analyzed by a sophisticated mechanical design tool. True collaboration requires the ability for incremental proposals to be communicated. This allows each discipline the opportunity to view and experiment with the change in its own ECAD or MCAD environment. Each discipline can then accept, reject or counter propose the change. Database update follows. Globalization is a Challenge Globalization is not coming; it is here and here to stay. For an electronics company to meet its driving business goals of producing the most competitive product faster and at reduced development costs, it must learn to leverage globalization instead of fighting it. EDA vendors can provide design systems that support many of the capabilities needed to capitalize on these resources and compete on a global basis, but some changes must also come in the company’s organizational structures and product development processes. pcd&f John iSaac is director of market development for Montor Graphics Systems Design Division and can be reached at John_Isaac@mentor.com. Global Intellectual Property (IP) Management With a company’s design resources spread around the world, it is important that IP (component libraries, design AUGUST 2008 printEd circuit dEsign & faB 27 http://www.pcb-pool.com/ppus/info.html?PHPSESSID=7df48fa7c977776045ff8d4b24a70fc7 http://www.pcb-pool.com/ppus/info.html?PHPSESSID=7df48fa7c977776045ff8d4b24a70fc7

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - August 2008

Printed Circuit Design & Fab - July 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Software Performance Interconnect Strategies Final Finish Forum Product Development Challenges in a Global Market Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2 Low-Loss Fluoropolymer Copper Clad Laminate Qualifying PCBs Outsourced in Asia Copper Plating and Microvia Fill for Advanced PCBs Off the Shelf Marketplace Ad Index BGA Bulletin

Printed Circuit Design & Fab - August 2008

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