Printed Circuit Design & Fab - August 2008 - (Page 36)

outSourcinG Qualifying PCbs outsourced in Asia Communication, documentation and teamwork between suppliers reduces the risk and increases the benefits of outsourcing. by MuMTAz y. BoRA The growth of portable wireless products and related consumer electronics is fueling a major outsourcing effort toward Asia. Most OEMs (original equipment manufacturers) are partnering with CMs (contract manufacturers) in Asia to outsource key operations such as board design, fabrication, surface-mount assembly and procurement to maintain profitability and a competitive edge. Outsourcing can offer OEMs significant advantages in maintaining a healthy bottom line, including reduced capital risks, increased access to current technologies and reduced time to market. Outsourcing also allows CMs and EMS (electronic manufacturing services) companies to subcontract the work that does not fit their core competencies, so that they can diversify their products. Outsourcing with strategic partners is more important for OEMs dealing with lead-free migration since this new requirement brings many challenges for the PCB fab and assembly industries. With new high Tg (glass transition temperature) laminates, new lead-free alloys, rework processes, moisture sensitivity and other issues, the entire manufacturing process requires careful evaluation of new laminate materials to balance component layout and optimization of reflow profiles to minimize damage to PCBs. This is especially critical for thin PCBs (less than 0.1 mm) used in cell phones and other portable products, and PCBs based on build-up microvia technologies. The handheld wireless product marketplace demands products that are small, thin, low-cost and lightweight with improved user interfaces. In addition, the convergence of handheld wireless phones with palmtop computers and Internet accessibility is accelerating the need for functional circuits designed with miniaturized, low-cost technology. Outsourced PCBs from Asia are becoming more of a viable option for OEMs involved in high-volume manufac36 turing. Proper evaluation and qualification of these facilities is critical for assembly reliability. There are critical aspects in the qualification of PCBs. Qualification efforts especially for HDI (high-density interconnect)1 and ALIVH (any layer inner via hole) PCBs2 procured from Asian fabricators in China, Taiwan, Korea and Japan need specific characterization. Quality systems audit results, PCB evaluation, acceptance criteria, DPPM (defective parts per million) review and reliability testing need to be evaluated. Additionally, strategies for overcoming cultural differences, communication, conflict resolution, and building supplier and customer relationships have a high level of importance. High-volume surface-mount assembly production requires careful evaluation since as assembly yields depend heavily on good quality PCBs, solder paste print processes and oven reflow profiles. This has become more critical in lead-free reflow due to higher peak temperatures and narrow process windows. Proper storage, handling control in the supply chain and production process control is necessary for good yield and reliability. DPPM reduction efforts must focus not only on the manufacturing processes but also on overcoming many cultural, communication and interpretation differences. Supplier Audit and Qualification The qualification effort required a factory and warehouse visit, and conducting a quality systems audit of the PCB manufacturing process. Critical items such as ISO 90012000 certification, a capabilities survey, staff training and certification, the eight discipline process, design management, and materials controls were reviewed. Based on this review, a ranking was provided for four major categories: customer satisfaction, manufacturing process, materials management AUGUST 2008 printEd circuit dEsign & faB

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Printed Circuit Design & Fab - July 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Software Performance Interconnect Strategies Final Finish Forum Product Development Challenges in a Global Market Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2 Low-Loss Fluoropolymer Copper Clad Laminate Qualifying PCBs Outsourced in Asia Copper Plating and Microvia Fill for Advanced PCBs Off the Shelf Marketplace Ad Index BGA Bulletin

Printed Circuit Design & Fab - August 2008

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