Printed Circuit Design & Fab - August 2008 - (Page 47) Your source for final finishes on circuit boards “We are your finish!” One-stop PCB Fab & Assembly Electroplating of printed wiring boards – Nickel, Hard Gold and Soft Wire Bondable Gold – Accommodating panels up to 54”x36” Need PCBs or Assembly? We make it simple. Standard PCBs Custom Quotes 2 Layers 4 Layers 6 Layers for complex PCBs Electroless Nickel and Immersion Gold – Accommodating panels up to 21”x26” Assembly Services Immersion Silver – Accommodating panels up to 24”x36” Gold, Nickel and Copper Plating on ceramic based thin and thick film circuits – Now including Electroless Gold Up to 22 Layers Special Materials Blind/Buried vias ISO 9001:2000 Certified 15 Kane Industrial Drive, Hudson, MA 01862 (978) 567-9205 • Fax (978) 567-8742 All Technologies Small to medium quantity Turnkey or Consigned www.alternatefinishing.com WWW.PCBFABEXPRESS.COM (408)522-1500 support@pcbfabexpress.com Reach your target customers! To advertise in Marketplace, please contact: KAMDEN ROBB 678-589-8843 krobb@upmediagroup.com ADVERTISER INDEX PRINTED CIRCUIT BOARD STIFFENER Large PCB’s require a mechanical stiffener to eliminate warp and bow, also to prevent copper trace damage due to bending, vibration and rough handling. A must for guidance of a PCB into its connector, and for reliable operation afterwards. • Unique aluminum bar shape accepts a screw or rivet anywhere along its length. • Same bar will install on PCB’s with different hole locations. • Eliminates close tolerance requirement between mounting holes. • Can be installed on spacers to clear components, copper traces or wire adds. • Can also function as a Heat Sink or Power/Ground bus. • Visit our web site for dimensions and specifications. COMPUFAB INC. P.O. Box 68, Woodstown, N.J. 08098-0068 ph: (856) 769-9050 • fax: (856) 769-9058 • www.compufab.com To learn more about the advertisers in this issue, go to pcdandf.com and select “Advertiser Index” in the home page menu. This will provide you with a direct link to the Web site of each advertiser in this index. Accutrace Advanced Circuits Alternate Finishing Bare Board Group Cam Expert Chemcut Circuitronix Compufab DownStream Technologies eFabPCB EMA Design Automation EzPCB Fine Circuits 45 45, 46 47 46 44 37 46 47 5 46 10, 11 45 44 Front Panel Express Garrett Film Services Global Laminates Imagineering Innovative Circuits Intercept Technology IPC Midwest 2008 JetPCB Korea PCB International MacDermid Mentor Graphics Midwest Accurate Grinding National Instruments/ Electronics Workbench Group 46 41 25 44 46 7 39 44 45 3 Cover 4 46 Cover 2 Online Electronics PCB Fab Express PCB Orlando 2008 PCB UPdate PCB West 2008 PCB-Pool Precision Images Precision Technologies Sierra Proto Express Sunstone Circuits Superior Processing Virtual PCB Wise Software 44 47 21 35 13 27 33 46 Cover 3 1 45 15 19 The advertising index is published as an additional service. The publisher does not assume any liability for errors or omissions. AUGUST 2008 printEd circuit dEsign & faB 47 http://www.pcbfabexpress.com http://www.alternatefinishing.com http://www.compufab.com http://pcdandf.com http://www.pcborder.com http://www.PCB4U.com http://www.frontpanelexpress.com http://www.pcbfabexpress.com http://www.OneStopAssembly.com http://www.photoplot.com http://www.alternatefinishing.com http://www.globallaminates.com http://www.pcbshows.com/orlando http://www.bareboard.com http://www.pcbnet.com http://www.pcbupdate.com http://www.innovative-circuits.com http://www.pcbwest.com http://www.cam-expert.com http://www.pcb-pool.com http://www.chemcut.net http://www.intercept.com http://www.ipcmidwestshow.org http://www.circuitronix.com http://www.precision-images.biz http://www.compufab.com http://www.jetpcb.com http://www.eprotos.com http://www.koreapcb.com http://www.downstreamtech.com http://www.protoexpress.com http://www.efabpcb.com http://www.sunstone.com http://www.macdermid.com/electronics/ http://www.ema-eda.com http://www.mentor.com/pcb http://www.superior-processing.com http://www.virtual-pcb.com http://www.midwestaccurate.com http://www.ezpcb.com http://www.finecircuits.com http://www.ni.com/multisim http://www.wssi.com
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - August 2008 Printed Circuit Design & Fab - July 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Software Performance Interconnect Strategies Final Finish Forum Product Development Challenges in a Global Market Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2 Low-Loss Fluoropolymer Copper Clad Laminate Qualifying PCBs Outsourced in Asia Copper Plating and Microvia Fill for Advanced PCBs Off the Shelf Marketplace Ad Index BGA Bulletin Printed Circuit Design & Fab - August 2008 Printed Circuit Design & Fab - August 2008 - Printed Circuit Design & Fab - July 2008 (Page Cover1) Printed Circuit Design & Fab - August 2008 - Printed Circuit Design & Fab - July 2008 (Page Cover2) Printed Circuit Design & Fab - August 2008 - Printed Circuit Design & Fab - July 2008 (Page 1) Printed Circuit Design & Fab - August 2008 - Contents (Page 2) Printed Circuit Design & Fab - August 2008 - Contents (Page 3) Printed Circuit Design & Fab - August 2008 - Our Line (Page 4) Printed Circuit Design & Fab - August 2008 - Our Line (Page 5) Printed Circuit Design & Fab - August 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - August 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - August 2008 - Around the World (Page 8) Printed Circuit Design & Fab - August 2008 - Around the World (Page 9) Printed Circuit Design & Fab - August 2008 - Around the World (Page 10) Printed Circuit Design & Fab - August 2008 - Around the World (Page 11) Printed Circuit Design & Fab - August 2008 - Happenings (Page 12) Printed Circuit Design & Fab - August 2008 - Happenings (Page 13) Printed Circuit Design & Fab - August 2008 - ROI (Page 14) Printed Circuit Design & Fab - August 2008 - ROI (Page 15) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page 16) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W1) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W2) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W3) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W4) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W5) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W6) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W7) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W8) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W9) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W10) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W11) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W12) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W13) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W14) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W15) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W16) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page 17) Printed Circuit Design & Fab - August 2008 - Software Performance (Page 18) Printed Circuit Design & Fab - August 2008 - Software Performance (Page 19) Printed Circuit Design & Fab - August 2008 - Interconnect Strategies (Page 20) Printed Circuit Design & Fab - August 2008 - Interconnect Strategies (Page 21) Printed Circuit Design & Fab - August 2008 - Interconnect Strategies (Page 22) Printed Circuit Design & Fab - August 2008 - Final Finish Forum (Page 23) Printed Circuit Design & Fab - August 2008 - Product Development Challenges in a Global Market (Page 24) Printed Circuit Design & Fab - August 2008 - Product Development Challenges in a Global Market (Page 25) Printed Circuit Design & Fab - August 2008 - Product Development Challenges in a Global Market (Page 26) Printed Circuit Design & Fab - August 2008 - Product Development Challenges in a Global Market (Page 27) Printed Circuit Design & Fab - August 2008 - Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2 (Page 28) Printed Circuit Design & Fab - August 2008 - Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2 (Page 29) Printed Circuit Design & Fab - August 2008 - Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2 (Page 30) Printed Circuit Design & Fab - August 2008 - Low-Loss Fluoropolymer Copper Clad Laminate (Page 31) Printed Circuit Design & Fab - August 2008 - Low-Loss Fluoropolymer Copper Clad Laminate (Page 32) Printed Circuit Design & Fab - August 2008 - Low-Loss Fluoropolymer Copper Clad Laminate (Page 33) Printed Circuit Design & Fab - August 2008 - Low-Loss Fluoropolymer Copper Clad Laminate (Page 34) Printed Circuit Design & Fab - August 2008 - Low-Loss Fluoropolymer Copper Clad Laminate (Page 35) Printed Circuit Design & Fab - August 2008 - Qualifying PCBs Outsourced in Asia (Page 36) Printed Circuit Design & Fab - August 2008 - Qualifying PCBs Outsourced in Asia (Page 37) Printed Circuit Design & Fab - August 2008 - Qualifying PCBs Outsourced in Asia (Page 38) Printed Circuit Design & Fab - August 2008 - Qualifying PCBs Outsourced in Asia (Page 39) Printed Circuit Design & Fab - August 2008 - Copper Plating and Microvia Fill for Advanced PCBs (Page 40) Printed Circuit Design & Fab - August 2008 - Copper Plating and Microvia Fill for Advanced PCBs (Page 41) Printed Circuit Design & Fab - August 2008 - Copper Plating and Microvia Fill for Advanced PCBs (Page 42) Printed Circuit Design & Fab - August 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - August 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - August 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - August 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - August 2008 - Ad Index (Page 47) Printed Circuit Design & Fab - August 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - August 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - August 2008 - BGA Bulletin (Page Cover4)
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