Printed Circuit Design & Fab - August 2008 - (Page W7) R EG I STR AT I ON INF ORMATION Register online at www.pcbwest.com with Priority Code #D08BD708 by August 19 and save up to $100 It couldn’t be easier to save up to $100 by taking advantage of our Early-Bird Discount! Simply register by August 19, and you’ll automatically receive the Early-Bird Discount prices listed below. Plus, check out the other discounts to find out if you’re eligible to save even more. This year’s Professional Development and 3-Day Technical Conference courses are detailed on pages 10-14. Review the course abstracts at www.pcbwest.com. After you’ve checked out the program, you’ll need to decide which Registration Package best fits your needs and budget. To help you make this decision, each package is described below. When you’re ready to register, go to www.pcbwest.com, and choose the registration option that applies to you (Conference or Exhibition.) Then, follow the registration system prompts. If you have questions, call the Registration Desk at 918-496-1476. DISCOUNTS PCB West 2008 is pleased to offer the following discounts to qualifying attendees, depending on the package purchased. Except for the Early-Bird Discount, all other discounts require a Discount Code. Call the Registration Desk at 918-496-1476 to verify your eligibilty and for the Discount Code prior to registering online. Early-Bird Discount – Anyone who registers by August 19, 2008, will automatically receive the Early-Bird Discounts shown on this page. Alumni and Association/User Group Discount – Alumni of a previous UPMG PCB Show or members of a recognized industry association or user group are eligible for a discount of $50 US on 3-Day Technical Conference, 4-Day or 5-Day Value Packages only. Group Discount – Companies registering 3 or more attendees at the same time for 4-Day or 5-Day Value Packages are eligible to receive a $100 discount per attendee, deducted from the applicable package pricing (Early-Bird or Regular). This discount may not be used in conjunction with the Alumni and Association/User Group discount. Please note: This discount is not available through online registration. Call 918-496-1476 for more information. REGISTRATION PACKAGES BUILD-A-CONFERENCE PACKAGE Choose any combination of courses even on non-sequential days. Prices are per course as shown below. This package includes your choice of courses during the entire 5-day conference, plus admission to the two-day exhibition and all of the “FREE Tuesday” and Special Events listed on page 4. Note: Alumni and Association/User Group, and Group Discounts cannot be applied to this package. Type of Course Early-Bird Price Through 8/19 Regular Price After 8/19 Technical Conference Two-Hour Workshops (W courses), each $175 $195 Technical Conference Half-Day Seminars (S courses), each $275 $295 Professional Development Full-Day Tutorials (T courses), each $455 $555 Professional Development Two-Day DECs (DEC courses), each $845 $945 Professional Development Three-Day DECs (DEC course), each $1,025 $1,125 (Note: Professional Development Tutorials and DEC courses include lunch.) 3-DAY TECHNICAL CONFERENCE PACKAGE Includes your choice of courses during the entire Monday, Wednesday and Thursday 3-Day Technical Conference, plus admission to the two-day exhibition, and all of the “FREE Tuesday” and Special Events listed on page 4. REGISTRATION POLICIES Registration – Complete one online registration for each registrant. Badge sharing is not allowed. Payment – Payment must be made by credit card, check or Purchase Order. Registrations without complete payment information will not be processed. Credit card payments will show a charge from UP Media Group. If paying by PO, please include a $25 US processing fee per PO in addition to the registration package fees. A signed and dated PO (with PO#) and/or full payment must be received prior to the conference in order for the attendee to be admitted into classes. For more information, call 918-496-1476. Refunds and Cancellations – All refund requests must be made in writing by fax or mail to PCB West no later than August 19, 2008. Mail refund requests to: PCB West, Attn. AS, 2400 Lake Park Drive, Suite 440, Smyrna, GA 30080. Fax to 678-589-8850 or e-mail your refund or cancellation request to askarbek@upmediagroup.com. “No shows” who have not made a written request by August 19, 2008, are fully liable for conference tuition/fees. Registrations made after August 19 are considered confirmed and no refund requests will be accepted; registrants will be fully liable for conference tuition/fees and will be invoiced accordingly. Program Changes – The technical program of PCB West 2008 is subject to change should unforeseeable circumstances arise with respect to individual speakers. Check the PCB West Web site for the latest updates on sessions and speakers. Early-Bird Price Through 8/19 Regular Price After 8/19 3-Day Technical Conference Package $845 $945 4-DAY AND 5-DAY VALUE PACKAGES 4-day Value Package: a terrific educational value! Includes any combination of Professional Development courses (Exception: only 1 DEC course may be taken) and 3-Day Technical Conference courses taken during four days (choose from Sun/Mon/Wed/Thu or Mon/Wed/Thu/Fri), plus admission to the two-day exhibition and all of the “FREE Tuesday” and Special Events listed on page 4. (Note: Professional Development Tutorials and DEC courses include lunch.) Early-Bird Price Through 8/19 Regular Price After 8/19 4-Day Value Package $1,195 $1,295 5-Day Value Package: the most bang for your buck! Includes any combination of Professional Development courses (Exception: only 1 DEC course may be taken) and 3-Day Technical Conference sessions (Sun/Mon/Wed/Thu/Fri)—you decide—plus admission to the two-day exhibition and all of the “FREE Tuesday” and Special Events listed on page 4. (Note: Professional Development Tutorials and DEC courses include lunch.) Early-Bird Price Through 8/19 Regular Price After 8/19 5-Day Value Package $1,395 $1,495 EXHIBITION ONLY PACKAGE Includes admission to the two-day exhibition and all of the “FREE Tuesday” and Special Events listed on page 4. Early-Bird Price Through 8/19 Regular Price After 8/19 Exhibition-Only Package FREE FREE Early Bird Discount Deadline | Re g i ste r b y Au g u st 1 9 a n d sa v e u p to $ 1 0 0 ! 7 http://www.pcbwest.com http://www.pcbwest.com http://www.pcbwest.com
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - August 2008 Printed Circuit Design & Fab - July 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Software Performance Interconnect Strategies Final Finish Forum Product Development Challenges in a Global Market Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2 Low-Loss Fluoropolymer Copper Clad Laminate Qualifying PCBs Outsourced in Asia Copper Plating and Microvia Fill for Advanced PCBs Off the Shelf Marketplace Ad Index BGA Bulletin Printed Circuit Design & Fab - August 2008 Printed Circuit Design & Fab - August 2008 - Printed Circuit Design & Fab - July 2008 (Page Cover1) Printed Circuit Design & Fab - August 2008 - Printed Circuit Design & Fab - July 2008 (Page Cover2) Printed Circuit Design & Fab - August 2008 - Printed Circuit Design & Fab - July 2008 (Page 1) Printed Circuit Design & Fab - August 2008 - Contents (Page 2) Printed Circuit Design & Fab - August 2008 - Contents (Page 3) Printed Circuit Design & Fab - August 2008 - Our Line (Page 4) Printed Circuit Design & Fab - August 2008 - Our Line (Page 5) Printed Circuit Design & Fab - August 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - August 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - August 2008 - Around the World (Page 8) Printed Circuit Design & Fab - August 2008 - Around the World (Page 9) Printed Circuit Design & Fab - August 2008 - Around the World (Page 10) Printed Circuit Design & Fab - August 2008 - Around the World (Page 11) Printed Circuit Design & Fab - August 2008 - Happenings (Page 12) Printed Circuit Design & Fab - August 2008 - Happenings (Page 13) Printed Circuit Design & Fab - August 2008 - ROI (Page 14) Printed Circuit Design & Fab - August 2008 - ROI (Page 15) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page 16) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W1) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W2) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W3) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W4) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W5) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W6) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W7) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W8) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W9) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W10) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W11) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W12) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W13) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W14) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W15) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page W16) Printed Circuit Design & Fab - August 2008 - Tip Jar (Page 17) Printed Circuit Design & Fab - August 2008 - Software Performance (Page 18) Printed Circuit Design & Fab - August 2008 - Software Performance (Page 19) Printed Circuit Design & Fab - August 2008 - Interconnect Strategies (Page 20) Printed Circuit Design & Fab - August 2008 - Interconnect Strategies (Page 21) Printed Circuit Design & Fab - August 2008 - Interconnect Strategies (Page 22) Printed Circuit Design & Fab - August 2008 - Final Finish Forum (Page 23) Printed Circuit Design & Fab - August 2008 - Product Development Challenges in a Global Market (Page 24) Printed Circuit Design & Fab - August 2008 - Product Development Challenges in a Global Market (Page 25) Printed Circuit Design & Fab - August 2008 - Product Development Challenges in a Global Market (Page 26) Printed Circuit Design & Fab - August 2008 - Product Development Challenges in a Global Market (Page 27) Printed Circuit Design & Fab - August 2008 - Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2 (Page 28) Printed Circuit Design & Fab - August 2008 - Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2 (Page 29) Printed Circuit Design & Fab - August 2008 - Innovative Modeling Supports Co-Design of the Power Supply Chain, Part 2 (Page 30) Printed Circuit Design & Fab - August 2008 - Low-Loss Fluoropolymer Copper Clad Laminate (Page 31) Printed Circuit Design & Fab - August 2008 - Low-Loss Fluoropolymer Copper Clad Laminate (Page 32) Printed Circuit Design & Fab - August 2008 - Low-Loss Fluoropolymer Copper Clad Laminate (Page 33) Printed Circuit Design & Fab - August 2008 - Low-Loss Fluoropolymer Copper Clad Laminate (Page 34) Printed Circuit Design & Fab - August 2008 - Low-Loss Fluoropolymer Copper Clad Laminate (Page 35) Printed Circuit Design & Fab - August 2008 - Qualifying PCBs Outsourced in Asia (Page 36) Printed Circuit Design & Fab - August 2008 - Qualifying PCBs Outsourced in Asia (Page 37) Printed Circuit Design & Fab - August 2008 - Qualifying PCBs Outsourced in Asia (Page 38) Printed Circuit Design & Fab - August 2008 - Qualifying PCBs Outsourced in Asia (Page 39) Printed Circuit Design & Fab - August 2008 - Copper Plating and Microvia Fill for Advanced PCBs (Page 40) Printed Circuit Design & Fab - August 2008 - Copper Plating and Microvia Fill for Advanced PCBs (Page 41) Printed Circuit Design & Fab - August 2008 - Copper Plating and Microvia Fill for Advanced PCBs (Page 42) Printed Circuit Design & Fab - August 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - August 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - August 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - August 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - August 2008 - Ad Index (Page 47) Printed Circuit Design & Fab - August 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - August 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - August 2008 - BGA Bulletin (Page Cover4)
For optimal viewing of this digital publication, please enable JavaScript and then refresh the page. If you would like to try to load the digital publication without using Flash Player detection, please click here.