Printed Circuit Design & Fab - September 2008 - (Page 2)

SEPTEMBER 2008 • VOL. 25 • NO. 9 FEATURES Seated, Ibiden CEO Hiroki Takenaka. Ibiden has been the number one ranked fabricator for the past four consecutive years. Photo courtesy of Ibiden and Dr. Nakahara 22 ENVIRONMENTAL UPDATE Design for Green: Laminates Taking the risk for a greener planet. by MICHAEL TAYLOR 26 DESIGN BASICS A Systematic Approach to Increasing Layer Count POINT OF VIEW 4 Increasing layer count requires an organized design approach to avoid re-spins and reduce time-to-market. by JOHN PELOSO 28 PCB FAB MARKETS OUR LINE The road to gold. Kathy Nargi-Toth 16 THE NTI $100 MILLION CLUB The record shows long-term growth is best achieved by continued aggressive investments. by DR. HAYAO NAKAHARA 36 NANOTECH ROI Consistency and commitment are the true reflections of integrity. Peter Bigelow 18 Printable Nanocomposites POSITIVE PLATING Plating cell design can minimize the effects of primary current distribution. Michael Carano 20 EMC FOR THE REAL WORLD At high frequencies the return current follows the path of least inductance, not the path of least resistance. Dr. Bruce Archambeault 21 FINAL FINISH FORUM Behind black pad: Process control is the only solution for consistent success. Advanced materials provide a low cost and highly versatile method for manufacturing flexible electronic circuits. by RABINDRA N. DAS, HOW LIN, JOHN M. LAUFFER, MICHAEL ROWLANDS, NORMAN CARD and VOYA R. MARKOVICH DEPARTMENTS 6 George Milad MARKET WATCH AROUND THE WORLD 14 43 HAPPENINGS OFF THE SHELF 44 47 MARKETPLACE AD INDEX 48 BGA BULLETIN Microvias reduce layer count when routing high pin count BGAs. 10 Charles Pfeil Circuits Assembly Online RF PRODUCTION circuitsassembly.com ONLINE EXCLUSIVES pcdandf.com Visit our Web site for news, products, extra features and columns, and more. Effectively Managing RF Design in Utility Metering Applications EMS companies can provide the missing link between meter expertise, good distribution channels and the ability to easily develop RF products. by ROGER ALLCORN INTERCONNECT STRATEGIES Chinese translation: Signal integrity applications of Mathcad, part 1. There’s Something About Copper Do identical PWB designs from different board shops really demonstrate vastly different erosion behaviors under the same soldering process? by CHRYS SHEA Abe Riazi pcdandf.com/cms/content/view/4785/95 POSTMASTER: Send address changes to PRINTED CIRCUIT DESIGN & FAB, P.O. Box 35646, Tulsa, OK 74153-0646 http://www.circuitsassembly.com http://pcdandf.com http://www.pcdandf.com/cms/content/view/4785/95

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - September 2008

Printed Circuit Design & Fab - August 2008 Contents Our Line Market Watch Around the World Happenings ROI Positive Plating Off the Shelf Marketplace Ad Index EMC for the Real World Final Finish Forum Design for Green: Laminates A Systematic Approach to Increasing Layer Count The NTI $100 Million Club Printable Nanocomposites BGA Bulletin

Printed Circuit Design & Fab - September 2008

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