Printed Circuit Design & Fab - September 2008 - (Page 31) PCB Fab MarkEtS tablE 2. Regional Breakdown of NTI 98 Country Japan Taiwan USA S. Korea Hong Kong Germany China Singapore Austria Thailand France Totals no. entries 31 29 10 9 7 4 3 2 1 1 1 98 Share* 32% 29% 10% 9% 7% 4% 3% 2% 1% 1% 1% 101% one of the largest makers of silver-through-hole boards. Also, Jiangsu Suhang Electronics and Shennan Circuits of China had sales over $100 million in 2007. Regional Breakdown Of the 98 fabricators with revenue of $100 million or more in 2007, 31 are from Japan, 27 are from Taiwan, 10 are from the US and nine are from South Korea (tablE 2). This reflects each fabricator’s global output, although some companies may not be identified with specific nationalities. Again, the readers are the final judges. Of the 98 fabricators, 82 are Asian companies. It is no coincidence to consider that of the $51 billion in PCBs produced in 2007, 83.7% were made in Asia. Another interesting observation is that 32% were made by Japanese manufacturers either in Japan or overseas. Likewise, 25% were made by Taiwanese, 13% by US-based fabricators and 11% by South Koreans. These percentages are almost identical to the percentage of entries shown in Table 2 (in blue). FiGurE 1 shows the distribution. Although North America’s “domestic” production was only $4.45 billion (8.7%), North American-based companies produced about $2.23 billion worth of PWBs overseas. *Percentages do not add up to 100 because of rounding. Korean flex maker Sanyang Electro-Mechanics’ revenue dropped 59% to $44 million. In their place are several new members. Some fabricators should have already made the list, but the author missed them. DAP of South Korea and Brain Power of Taiwan (its manufacturing plants are only in China) are among those in this category. Legitimate new members of the over $100 million club are Sun Wei Circuit Industry of Taiwan (with plants only in China). Sun Wei Circuits is probably The Great 98 Ibiden has been on the top spot for the last three years and is likely to maintain its position for the foreseeable future. It is now building a microvia board plant in Penang, Malaysia, with a total investment “Ventec laminate has been a tremendous asset in Titan PCB East’s ability to provide a high quality, high reliability lead free product to today’s time critical, cost sensitive market. Ventec VT-47 provides superior peel strength, high Td, Z-axis stability, thermal reliability, surface quality and inventory selection all in the same package. The fact that this is provided in a cost competitive manner is icing on the cake. Ventec is not just a player in the game, they are a top performer. The addition of VT-90 polyimide materials to the FR-4 offerings make Ventec a force to be reckoned with in the future.” Mike Berg, President and CEO, Titan PCB East – Amesbury, MA “When using the VT-47 and VT-481 materials, we have found above average drill and scoring characteristics without experiencing the fracturing and haloing associated with other well-known lead free comparable phenolic resin systems.” John Gratton Engineering Manager Century Circuits – Toronto, ON “We have been very pleased with the quality, service, performance, and consistency of the Ventec materials for almost two years now. I would not hesitate to recommend Ventec VT-47 to our customers as a reasonably priced alternative for lead free assembly.” Robert E. Welch Process Engineering Manager Waytec Electronics Corp. – Lynchburg, VA “The family of Ventec laminates has made an improvement in our processing of multilayer circuits. The materials exhibit very good consistency. Our quality with the performance of these laminates.” department is very satisfied Jim King Process Engineer Philway Products – Ashland, OH 16 Hunt Rd. South • Amesbury, MA 01913 • (978) 388-9610 • (978) 388-5339 fax • www.globallaminates.com Sales reps and distributors wanted: email Bruce at bhurley@globallaminates.com SEPTEMBER 2008 Global Laminates Inc. printEd CirCuit dESign & fAB 31 http://www.globallaminates.com http://www.globallaminates.com
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - September 2008 Printed Circuit Design & Fab - August 2008 Contents Our Line Market Watch Around the World Happenings ROI Positive Plating Off the Shelf Marketplace Ad Index EMC for the Real World Final Finish Forum Design for Green: Laminates A Systematic Approach to Increasing Layer Count The NTI $100 Million Club Printable Nanocomposites BGA Bulletin Printed Circuit Design & Fab - September 2008 Printed Circuit Design & Fab - September 2008 - (Page Bellyband1) Printed Circuit Design & Fab - September 2008 - (Page Bellyband2) Printed Circuit Design & Fab - September 2008 - Printed Circuit Design & Fab - August 2008 (Page Cover1) Printed Circuit Design & Fab - September 2008 - Printed Circuit Design & Fab - August 2008 (Page Cover2) Printed Circuit Design & Fab - September 2008 - Printed Circuit Design & Fab - August 2008 (Page 1) Printed Circuit Design & Fab - September 2008 - Contents (Page 2) Printed Circuit Design & Fab - September 2008 - Contents (Page 3) Printed Circuit Design & Fab - September 2008 - Our Line (Page 4) Printed Circuit Design & Fab - September 2008 - Our Line (Page 5) Printed Circuit Design & Fab - September 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - September 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - September 2008 - Market Watch (Page 8) Printed Circuit Design & Fab - September 2008 - Market Watch (Page 9) Printed Circuit Design & Fab - September 2008 - Around the World (Page 10) Printed Circuit Design & Fab - September 2008 - Around the World (Page 11) Printed Circuit Design & Fab - September 2008 - Around the World (Page 12) Printed Circuit Design & Fab - September 2008 - Around the World (Page 13) Printed Circuit Design & Fab - September 2008 - Happenings (Page 14) Printed Circuit Design & Fab - September 2008 - Happenings (Page 15) Printed Circuit Design & Fab - September 2008 - ROI (Page 16) Printed Circuit Design & Fab - September 2008 - ROI (Page 17) Printed Circuit Design & Fab - September 2008 - Positive Plating (Page 18) Printed Circuit Design & Fab - September 2008 - Positive Plating (Page 19) Printed Circuit Design & Fab - September 2008 - EMC for the Real World (Page 20) Printed Circuit Design & Fab - September 2008 - Final Finish Forum (Page 21) Printed Circuit Design & Fab - September 2008 - Design for Green: Laminates (Page 22) Printed Circuit Design & Fab - September 2008 - Design for Green: Laminates (Page 23) Printed Circuit Design & Fab - September 2008 - Design for Green: Laminates (Page 24) Printed Circuit Design & Fab - September 2008 - Design for Green: Laminates (Page 25) Printed Circuit Design & Fab - September 2008 - A Systematic Approach to Increasing Layer Count (Page 26) Printed Circuit Design & Fab - September 2008 - A Systematic Approach to Increasing Layer Count (Page 27) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 28) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 29) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 30) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 31) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 32) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 33) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 34) Printed Circuit Design & Fab - September 2008 - The NTI $100 Million Club (Page 35) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 36) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 37) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 38) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 39) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 40) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 41) Printed Circuit Design & Fab - September 2008 - Printable Nanocomposites (Page 42) Printed Circuit Design & Fab - September 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - September 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - September 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - September 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - September 2008 - Ad Index (Page 47) Printed Circuit Design & Fab - September 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - September 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - September 2008 - BGA Bulletin (Page Cover4)
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