Printed Circuit Design & Fab - September 2008 - (Page 39)

nanotEch FiGurES 2a-E represent the screen- ! FiGurE 2M. Ink-jet printing on flexible plastics. cp. Low viscosity helps to generate submicron thin structure. Screen and contact printing prefer higher viscosity (100,000 cp to 150,000 cp) thixotropes and generate 10 to 25 micron thick features. Conducting polymers/ composites favor ink-jet printing for transistors but can use screen/contact printing for making lasers, which is a surface phenomenon where surface ! for making screen printab le thin film embedded capacitors and resistors. FiGurE 3. Schematic presentation particles upon optical pumping show laser-like behavior. Embedded resistors, capacitors and conducting circuit lines can use ink-jet or screen-printing for different features. Dielectric features are typically large and can use any of the known print techniques. FiGurE 2 shows various printings. printing process. It can be seen that screen print methods can produce line features in the range of 100 microns. FiGurES 2F-J represent ink-jet printings showing minimum line feature size in the range of 75 to 100 microns and ~50 microns dot patterned. Space between two ink-jet printed lines can be reduced to 50 microns. FiGurE 2k represents micro-contact printing with minimum feature size around 100 microns. For the dispensing technique, feature sizes depend upon the material viscosity and corresponding needle used to dispense materials. It can dispense different shapes with a minimum dot of around 20 mils (500 microns) (FiGurE 2l). In addition, we are developing flexible packages for a variety of applications. Several classes of flexible materials can be used to form high-performance flexible packaging. We are investigating ink-jet printing for low-cost flexible packages. FiGurE 2M represents inkjet printing on flexible substrates. Contract Plating & Circuit Board Processing Providing Surface Finishes & Adding Value to the Electronics Industry Reliable | Fast Turn | Same Day Service We process flexible circuits and rigid PCBs, piece parts and panels with lot sizes from one up. Have unique panels or piece sizes? We can handle it! Top quality, fast-turn, and cost effective PCB service solutions including: | Immersion Tin – RoHS Compliant | Electroless Nickel / Immersion Gold – RoHS Compliant | Immersion Silver – RoHS Compliant | Hot Air Solder Leveling – Utilizing Florida Cirtech’s Sn-100CL – RoHS Compliant – Standard 6337 Tin Lead Horizontal Hot Air Solder Leveling | Soldermask & Nomenclature Screening | Organic Solderability Preservative (OSP) Adding Value to Every Service We Offer | Contact Us For a Quote ISO 9001:2000 Certified | www.addedvaluetech.com | info@addedvaluetech.com 9401 James Avenue South, Suite 100, Bloomington MN 55431 | Toll Free: (888) 881-3365 | Local: (952) 881-3365 | Fax: (952) 881-6235 SEPTEMBER 2008 printEd CirCuit dESign & fAB 39 http://www.addedvaluetech.com http://www.addedvaluetech.com

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - September 2008

Printed Circuit Design & Fab - August 2008 Contents Our Line Market Watch Around the World Happenings ROI Positive Plating Off the Shelf Marketplace Ad Index EMC for the Real World Final Finish Forum Design for Green: Laminates A Systematic Approach to Increasing Layer Count The NTI $100 Million Club Printable Nanocomposites BGA Bulletin

Printed Circuit Design & Fab - September 2008

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