Printed Circuit Design & Fab - November 2008 - (Page 12)

haPPEninGS FACES Taray Inc. has appointed Joe Gianelli as vice president of marketing and business development for the company’s recently opened US headquarters. Gianelli will assist in the global expansion of taray’s 7Circuit product to flexible printed circuit board (FPGA) and printed circuit board (PCB) design teams. He will be responsible for marketing and sales activities, including direct and indirect sales. photoMachining, Inc. has hired Dr. Francis Burns as its applications scientist. Working with customers, he will help to develop laser-based manufacturing processes. Prior to joining PhotoMachining, Burns worked for such companies as IBM, Hewlett-Packard and eSI. Burns holds numerous patents. J. Mike Sapienti has joined Sanmina-SCI as PCB senior business development manager for the company’s defense and aerospace market. Sapienti brings over 25 years of manufacturing and defense and aerospace experience, having worked with numerous companies, including Zycon, Parlex Corporation and teledyen. Endicott Interconnect Technologies, Inc. (EI) has promoted Jennifer de Souza to vice president of supply chain management. Her responsibilities will include developing and executing direct and indirect materials procurement strategies using lean principles such as JIt and Consignment. de Souza has 10 years of experience in global materials management and strategic sources. Ellen J. kullman has been elected president and director of Dupont, effective October 1, as well as CeO, effective January 2009. Kullman will implement the company’s market-driven strategy and define the 2009 execution plans. Prior to joining DuPont, Kullman worked at General electric. EVENTS 4-6 China SMT Forum Business Media China Shanghai International Exhibition Center Contact: chinasmtforum.com noV 10-11 SMTA China North Tianjin International Exhibition Center Tianjin, China Contact: peggy@smta.org 11-12 Symposium on Environmentally Friendly Materials Hosted by iNEMI and Intel Corp. InterContinental Hotel Shanghai, China Contact:www.inemi.org/cms/calendar/Intel_ Environmental_Materials.html 10-12 IpC International Test and Inspection Technology Conference: Reducing Time to Market Santa Clara, CA Contact: www.ipc.org/test 11-14 Electronica Automotive Conference 2008 Messe Munchen New Munich Trade Fair Center Munich, Germany Contact: www.electronica.de 2-4 pCB ORLANDO HOLIDAy INN INTERNATIONAL DRIVE RESORT ORLANDO, FLORIDA CONTACT: www.pCBSHOwS.COM 2008 International printed Circuit and Electronics Assembly Fair Sponsored by HKPCA Shenzhen, China Contact: info@e21mm.com dEc 3-5 10-12 pCB phoenix Hilton Phoenix East/Mesa Phoenix, AZ Contact:www.pcbshows.com/phoenix AwR has introduced AWR Connected for Mentor Graphics eliminating the need for file translation between the expedition enterprise design environment and AWR’s Microwave Office microwave and RF design environment. It facilitates the integration of analog, digital and RF or microwave circuits on the same PCB. “the PCB and RF/microwave design worlds have been merging for some time, but the first-generation design flows built around file translation have proven not to be flows at all, accord” ing to Mike Heimlich, Microwave Office Product Marketing Director at AWR. “this solution truly creates a useful flow in which libraries are no longer an issue and co-design is a reality. We are committed to continuing this avenue of cooperation with Mentor Graphics as 12 it delivers real benefits to the design community. ” Imbera Electronics Ltd. has entered a 5-year deal with Ibiden to license its integrated module board (IMB) technology. the agreement allows Ibiden to offer a cost-effective miniaturization solution with the capabilities to support numerous product applications. Imbera released the next generation of IMB technology that allows OeMs/ ODMs to produce smaller boards, in less time and at lower costs, through simple adaptations to current manufacturing processes. through this latest technology, numerous types of components can be embedded inside the core layer of a PCB, such as discrete FEB IT’S A DEAL passive components, wafer level CSPs and bare die. M-wave announced an asset purchase agreement with its management team under which the company will transfer substantially all of its operating assets and certain liabilities in exchange for $500,000. M-Wave chairman and CeO Joe turek and divisional president Robert Duke will acquire the operating assets of M-Wave Inc. for $500,000 plus a short-term loan. M-Wave International LLC, the company formed by the two execs, will also assume all operating liabilities, and will extend a $500,000 operating term loan with an effective interest rate of 12% due Dec. 31, 2008. NOVEMBER 2008 printEd CirCuit dESign & fAB http://www.chinasmtforum.com http://www.inemi.org/cms/calendar/Intel_Environmental_Materials.html http://www.inemi.org/cms/calendar/Intel_Environmental_Materials.html http://www.ipc.org/test http://www.electronica.de http://www.pCBSHOwS.COM http://www.pcbshows.com

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - November 2008

Printed Circuit Design & Fab - November 2008 Contents Our Line Market Watch Around the World Happenings ROI Positive Plating Ten Tips to Improve Manufacturability 3D Chip-Package-Board Modeling Improving Circuit Simulation With The Addition Of Real Measurements Ad Index PCB West: Interview with NBS Design Inc. The Influence of Final Finish on Lead-Free Assembly Reliability The Lead-free Soldering Challenges for Peelable Resists Off the Shelf Marketplace BGA Bulletin

Printed Circuit Design & Fab - November 2008

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