Printed Circuit Design & Fab - November 2008 - (Page 2)

NOVEMBER 2008 • VOL. 25 • NO. 11 FEATURES Surface finish selection requires a comprehensive understanding of end use applications. PCB designers and fabricators, together with the OEM, should select the finish that best meets the end product performance requirements. Image ©iStockPhoto/Paul Simpson Artwork by Katherine Haddox 18 DFM BASICS Ten Tips to Improve Manufacturability It’s as simple as doing it right the first time. by ARBEL NISSAN 24 SYSTEM MODELING 3D Chip-Package-Board Modeling POINT OF VIEW 4 OUR LINE Improving the bottom line. Advanced computing languages will help to develop flexible solver architectures and efficient simulation methods. by VIKRAM JANDHYALA, DIPANJAN GOPE, SWAGATO CHAKRABORTY, FENG LING, XIREN WANG, DEVAN WILLIAMS And JAMES PINGENOT Kathy Nargi-Toth 14 30 MEASUREMENT AND SIMULATION ROI Tough times call for cooperation across the supply chain. Improving Circuit Simulation With The Addition Of Real Measurements Real measurements allow the engineer to proactively improve the design, saving time and money. by BHAVESH MISTRY Peter Bigelow 16 POSITIVE PLATING Anode-cathode placement and secondary current distribution. 34 FROM THE FIELD PCB West: Interview with NBS Design Inc. Craig Arcuri talks about the company credo – passion, quality and speed – which translates into end product perfection. by KATHY NARGI-TOTH Michael Carano 48 BGA BULLETIN Any-layer vias can be stacked to span any set of layers. 36 LEAD-FREE RELIABILITY THE INFLUENCE OF FINAL FINISH ON LEAD-FREE ASSEMBLY RELIABILITY Understanding the end use application of a PCB is critical in the selection of right solderable final finish for Pb-free applications. by MOHAMMAD HOSSAIN, NIKHIL LAKHKAR, PULIGANDLA VISWANADHAM and DEREJE AGONAFER Charles Pfeil 40 SOLDER RESISTS Circuits Assembly Online circuitsassembly.com Nothing to Hide Shrink holes in Pb-free boards are effects, not defects. by URSULA MARQUEZ DE TINO The Lead-free Soldering Challenges for Peelable Resists The appeal of peelable resist technology. by IAN MCDONALD DEPARTMENTS 6 8 Comparisons of Methods for Testing Residues on Electronics This four-part series begins with FTIR (Fourier Transform Infrared Spectroscopy). by TERRY MUNSON MARKET WATCH AROUND THE WORLD 12 43 HAPPENINGS OFF THE SHELF 32 44 AD INDEX MARKETPLACE POSTMASTER: Send address changes to PRINTED CIRCUIT DESIGN & FAB, P.O. Box 35646, Tulsa, OK 74153-0646 http://www.circuitsassembly.com

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - November 2008

Printed Circuit Design & Fab - November 2008 Contents Our Line Market Watch Around the World Happenings ROI Positive Plating Ten Tips to Improve Manufacturability 3D Chip-Package-Board Modeling Improving Circuit Simulation With The Addition Of Real Measurements Ad Index PCB West: Interview with NBS Design Inc. The Influence of Final Finish on Lead-Free Assembly Reliability The Lead-free Soldering Challenges for Peelable Resists Off the Shelf Marketplace BGA Bulletin

Printed Circuit Design & Fab - November 2008

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