Printed Circuit Design & Fab - November 2008 - (Page 35)

FROM THE FIELD associated tasks that go along with manufacturing such as rework, process engineering, PCB layout, AOI inspection, Xray inspection, etc. We decided that we wanted to not just do those things but to be the absolute best in the industry in each area. Take that decision, the top of the line equipment selection that we’ve chosen, add the best people in each area of production and combine it with an around-the-clock, never-say-uncle service mentality and passion for quality and you get NBS. All of those things together wrapped up in one company turn out to be one heck of a combination. And again, I feel silly saying it, but it is just incredibly difficult to find an organization with all that in one company. PCD&F extends a thank you to NBS Design, Arcuri and the entire NBS Staff for sharing your time and vision with us and the PCB West attendees. pCd&f Ed. note: Based in Santa Clara, California, NBS Design was founded in 1999 as a PCB layout specialist. Over the past 10 years, a team of highly skilled technicians has come together to provide not only PCB layout but turnkey manufacturing solutions including NPI to Pilot Production, manufacturing test, and rework. According to Craig Arcuri, president and CeO of NBS Design, “We created NBS to overcome the limitations that traditionally govern the eMS industry. Rejecting the example set by legacy manufacturers, we brought together a team with decades of experience in contract manufacturing and electronics assembly. We set out to re-write the rules, and this is exactly what we have done. ” Continued from p. 48 The total number of signal layers required to breakout this device was three. Applying NSEW breakouts with good fanout patterns enables breakouts on large BGAs in 3 signal layers. If you have a lot of differential pairs, it probably could be done on six signal layers. The any-layer-via eliminates via stubs. Using smaller feature sizes makes a significant difference in route density. When trying to route over 2000 pins and 0.8mm pitch, ALIVH is a great solution if you want absolute minimum layer count. Although 0.8mm pin-pitch BGAs are clearly more difficult to route, using micro-vias, and specifically any-layer-vias, makes the task quite reasonable. When 0.8mm BGAs with over 2000 pins are commonplace, I am hopeful that the any-layer-via method will have been adopted worldwide. pCd&f charlES PFEil is an engineering director for Mentor Graphics, Systems Design Division. email: charles_pfeil@mentor.com. Contract Plating & Circuit Board Processing Providing Surface Finishes & Adding Value to the Electronics Industry Reliable | Fast Turn | Same Day Service We process flexible circuits and rigid PCBs, piece parts and panels with lot sizes from one up. Have unique panels or piece sizes? We can handle it! Top quality, fast-turn, and cost effective PCB service solutions including: | Immersion Tin – RoHS Compliant | Electroless Nickel / Immersion Gold – RoHS Compliant | Immersion Silver – RoHS Compliant | Hot Air Solder Leveling – Utilizing Florida Cirtech’s Sn-100CL – RoHS Compliant – Standard 6337 Tin Lead Horizontal Hot Air Solder Leveling | Soldermask & Nomenclature Screening | Organic Solderability Preservative (OSP) Adding Value to Every Service We Offer | Contact Us For a Quote ISO 9001:2000 Certified | www.addedvaluetech.com | info@addedvaluetech.com 9401 James Avenue South, Suite 100, Bloomington MN 55431 | Toll Free: (888) 881-3365 | Local: (952) 881-3365 | Fax: (952) 881-6235 NOVEMBER 2008 printEd CirCuit dESign & fAB 35 http://www.addedvaluetech.com http://www.addedvaluetech.com

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - November 2008

Printed Circuit Design & Fab - November 2008 Contents Our Line Market Watch Around the World Happenings ROI Positive Plating Ten Tips to Improve Manufacturability 3D Chip-Package-Board Modeling Improving Circuit Simulation With The Addition Of Real Measurements Ad Index PCB West: Interview with NBS Design Inc. The Influence of Final Finish on Lead-Free Assembly Reliability The Lead-free Soldering Challenges for Peelable Resists Off the Shelf Marketplace BGA Bulletin

Printed Circuit Design & Fab - November 2008

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