Printed Circuit Design & Fab - November 2008 - (Page 4) OUR LINE Improving the Bottom Line way on belt-tightening strategies and other methods designed to help companies make it through today’s economic quagmire. At PCB West, a few U.S.-based PCB fabricators shared company visions with PCB designers during a roundtable discussion. The purpose was to open a dialogue that supports DfM and DfA initiatives. These collaborative KAtHy efforts will be even more critical for companies facing the current financial nArgi-totH squeeze. Higher yields, fewer re-spins and faster time-to-market will all be a part of winning strategies. Many of the points made during this discussion are worth repeating. IMI CEO Peter Bigelow talked about success built around a consistent focus on people and niche products. IMI is a fabricator of Teflon/Duroid and mixed dielectric multilayer boards for RF/microwave, military, industrial and telecommunications. But in Bigelow’s words, the company is much more: talented people cultivated by a management that supports education and strives to give every employee the tools they need to be successful and ensure the company’s success. Bigelow’s advice for designers: “Communicate like crazy with your suppliers.” One Source Group CEO Nilesh Naik focuses on helping customers accelerate products to market. By offering a turnkey solution from PCB layout through assembly, One Source provides a one-stop shop that cuts across the supply chain. Naik pointed out that OEMs have lost touch with the manufacturing process because of outsourcing and reduced R&D activities. PCB suppliers need to step up and offer manufacturing solutions that bridge the supply chain. The design process plays a critical role in prototype/quickturn products. Development time is money. Working with engineers and designers early and often is one way that One Source ensures a “win-win” across the supply chain. Sanmina-SCI senior vice president and CTO George Dudnikov addressed supply chain globalization, saying that customers want engineering support during the development process but many larger companies anticipate a quick move to volume production offshore. There is a unique set of challenges when working with this type of product that once prototyped will quickly become a technology transfer product and subject to offshore scaling. A key enabler in this business model is standardization, including tools, processes and materials. Dudnikov stressed fabricator and system designer collaboration, so that form factor and layout rules are co-developed. Both sides working together to optimize panels, HDI design rules and assembly processes has a positive effect on overall system costs. Nolan Johnson, marketing manager at Sunstone Circuits, talked about cooperation in a design-centric fabrication environment. Sunstone manages a very large number of customers and unique part numbers. Two-way communication between the designer and customer service is a key component of success in such conditions. Johnson quoted experts who calculated that the designer dictates 75% of the board cost based on design decisions made before product leaves the CAD station. The conclusion: Designers are a very important part of every company’s competitive position. Designers can make a significant impact by designing to the manufacturing process, thus enabling DfM. TTM’s principal field applications engineer, Andy Cameron, brought the discussion full circle. With his extensive background in new product introduction and understanding of design and fabrication, Cameron outlined cost drivers designers need to be aware of before they begin the design process. Cameron noted that speed and density drive cost and push technology. By working with fabricators before beginning routing, designers can establish interconnect padstacks and material stackups that optimize the design. Getting the fabricator involved in the design early in the process can reduce time and improve manufacturing yields. Fabricators and assemblers should help with laminate and component selection, making sure the materials selected meet performance goals and manufacturing realities such as lead-free reflow. There are many ways to improve your bottom line, even in tough economic times. Working collaboratively with your supply chain partners. Reducing time, removing unnecessary costs and improving yields through active DfM and DfA initiatives have never been more important than they are today. 4 pcdandf.com Editorial Editor: Kathy Nargi-Toth, 678-589-8866, knargitoth@upmediagroup.com ASSoCiAtE Editor: Margo Lakin, 678-5898853, mlakin@upmediagroup.com G et ready for the impending avalanche of editorials coming your EditoriAl offiCE: 2400 Lake Park Drive, Suite 440, Smyrna, GA 30080 678-589-8800; fax 678-589-8850 EditoriAl AdviSory BoArd: Dr. Eric Bogatin, Be The Signal; Michael Carano, OM Group; George Dudnikov, Sanmina-SCI; Jack Fisher, Interconnect Technology Analysis; Happy Holden, Mentor Graphics; Istvan Novak, Sun Microsystems ColumniStS: Bruce Archambeault, Peter Bigelow, Michael Carano, Dominique Numakura, Charles Pfeil, Dr. Abe Riazi, Susy Webb Production Art dirECtor: Katherine Haddox, khaddox@upmediagroup.com produCtion mAnAgEr: Javier Longoria, jlongoria@upmediagroup.com SalES SAlES ASSoCiAtE: Kamden Robb, 678-589-8843, krobb@upmediagroup.com EXHiBit SAlES: Kamden Robb, 678-589-8843, krobb@upmediagroup.com; Frances Stewart, 678-817-1286, fstewart@upmediagroup.com KorEA SAlES: Young Media Inc., +82 2 2273 4818, fax +82 2 2273 4866, ymedia@ymedia.co.kr print rEprintS: Edward Kane, FosteReprints, 866-879-9144 ext. 131, fax 219-561-2009, ekane@fostereprints.com ElECtroniC rEprintS: pcdf_reprints@upmediagroup.com liSt rEntAl: Jennifer Schuler, 918-496-1476, fax 918-496-9465 WEBinArS: Frances Stewart, 678-817-1286, fstewart@upmediagroup.com, pcbshows.com/webinars circulation dirECtor of AudiEnCE dEvElopmEnt: Jennifer Schuler CirCulAtion And SuBSCription inquiriES/ AddrESS CHAngES: fax 918-496-9465, jschuler@upmediagroup.com uP MEdia GrouP, inc. prESidEnt: Pete Waddell viCE prESidEnt, SAlES And mArKEting: Frances Stewart, fstewart@upmediagroup.com viCE prESidEnt, EditoriAl And produCtion: Mike Buetow, mbuetow@upmediagroup.com SpECiAl projECtS mAnAgEr: Ronda Faries, 678-589-8827, rfaries@upmediagroup.com Printed Circuit Design & Fab is distributed without charge to qualified subscribers. 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Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - November 2008 Printed Circuit Design & Fab - November 2008 Contents Our Line Market Watch Around the World Happenings ROI Positive Plating Ten Tips to Improve Manufacturability 3D Chip-Package-Board Modeling Improving Circuit Simulation With The Addition Of Real Measurements Ad Index PCB West: Interview with NBS Design Inc. The Influence of Final Finish on Lead-Free Assembly Reliability The Lead-free Soldering Challenges for Peelable Resists Off the Shelf Marketplace BGA Bulletin Printed Circuit Design & Fab - November 2008 Printed Circuit Design & Fab - November 2008 - (Page Intro) Printed Circuit Design & Fab - November 2008 - Printed Circuit Design & Fab - November 2008 (Page Cover1) Printed Circuit Design & Fab - November 2008 - Printed Circuit Design & Fab - November 2008 (Page Cover2) Printed Circuit Design & Fab - November 2008 - Printed Circuit Design & Fab - November 2008 (Page 1) Printed Circuit Design & Fab - November 2008 - Contents (Page 2) Printed Circuit Design & Fab - November 2008 - Contents (Page 3) Printed Circuit Design & Fab - November 2008 - Our Line (Page 4) Printed Circuit Design & Fab - November 2008 - Our Line (Page 5) Printed Circuit Design & Fab - November 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - November 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - November 2008 - Around the World (Page 8) Printed Circuit Design & Fab - November 2008 - Around the World (Page 9) Printed Circuit Design & Fab - November 2008 - Around the World (Page 10) Printed Circuit Design & Fab - November 2008 - Around the World (Page 11) Printed Circuit Design & Fab - November 2008 - Happenings (Page 12) Printed Circuit Design & Fab - November 2008 - Happenings (Page 13) Printed Circuit Design & Fab - November 2008 - ROI (Page 14) Printed Circuit Design & Fab - November 2008 - ROI (Page 15) Printed Circuit Design & Fab - November 2008 - Positive Plating (Page 16) Printed Circuit Design & Fab - November 2008 - Positive Plating (Page 17) Printed Circuit Design & Fab - November 2008 - Ten Tips to Improve Manufacturability (Page 18) Printed Circuit Design & Fab - November 2008 - Ten Tips to Improve Manufacturability (Page 19) Printed Circuit Design & Fab - November 2008 - Ten Tips to Improve Manufacturability (Page 20) Printed Circuit Design & Fab - November 2008 - Ten Tips to Improve Manufacturability (Page 21) Printed Circuit Design & Fab - November 2008 - Ten Tips to Improve Manufacturability (Page 22) Printed Circuit Design & Fab - November 2008 - Ten Tips to Improve Manufacturability (Page 23) Printed Circuit Design & Fab - November 2008 - 3D Chip-Package-Board Modeling (Page 24) Printed Circuit Design & Fab - November 2008 - 3D Chip-Package-Board Modeling (Page 25) Printed Circuit Design & Fab - November 2008 - 3D Chip-Package-Board Modeling (Page 26) Printed Circuit Design & Fab - November 2008 - 3D Chip-Package-Board Modeling (Page 27) Printed Circuit Design & Fab - November 2008 - 3D Chip-Package-Board Modeling (Page 28) Printed Circuit Design & Fab - November 2008 - 3D Chip-Package-Board Modeling (Page 29) Printed Circuit Design & Fab - November 2008 - Improving Circuit Simulation With The Addition Of Real Measurements (Page 30) Printed Circuit Design & Fab - November 2008 - Improving Circuit Simulation With The Addition Of Real Measurements (Page 31) Printed Circuit Design & Fab - November 2008 - Ad Index (Page 32) Printed Circuit Design & Fab - November 2008 - Ad Index (Page 33) Printed Circuit Design & Fab - November 2008 - PCB West: Interview with NBS Design Inc. (Page 34) Printed Circuit Design & Fab - November 2008 - PCB West: Interview with NBS Design Inc. (Page 35) Printed Circuit Design & Fab - November 2008 - The Influence of Final Finish on Lead-Free Assembly Reliability (Page 36) Printed Circuit Design & Fab - November 2008 - The Influence of Final Finish on Lead-Free Assembly Reliability (Page 37) Printed Circuit Design & Fab - November 2008 - The Influence of Final Finish on Lead-Free Assembly Reliability (Page 38) Printed Circuit Design & Fab - November 2008 - The Influence of Final Finish on Lead-Free Assembly Reliability (Page InsertA) Printed Circuit Design & Fab - November 2008 - The Influence of Final Finish on Lead-Free Assembly Reliability (Page InsertB) Printed Circuit Design & Fab - November 2008 - The Influence of Final Finish on Lead-Free Assembly Reliability (Page 39) Printed Circuit Design & Fab - November 2008 - The Lead-free Soldering Challenges for Peelable Resists (Page 40) Printed Circuit Design & Fab - November 2008 - The Lead-free Soldering Challenges for Peelable Resists (Page 41) Printed Circuit Design & Fab - November 2008 - The Lead-free Soldering Challenges for Peelable Resists (Page 42) Printed Circuit Design & Fab - November 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - November 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - November 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - November 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - November 2008 - Marketplace (Page 47) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page Cover4) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S1) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S2) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S3) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S4) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S5) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S6) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S7) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S8) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S9) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S10) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S11) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S12) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S13) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S14) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S15) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S16) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S17) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S18) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S19) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S20) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S21) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S22) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S23) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S24) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S25) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S26) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S27) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S28) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S29) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S30) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S31) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S32) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S33) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S34) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S35) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S36) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S37) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S38) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S39) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S40) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S41) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S42)
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