Printed Circuit Design & Fab - November 2008 - (Page 8) AROUND thE world Designers Identify Key Topics for 2009 SANTA CLARA, CA – At PCB West this year, Designer Decision 2008 sought to identify the hot design topics for 2009. Designers were asked to submit topics as part of a reader survey, and the top rated topics were voted on during the PCB West conference. The top six topics were added to the 2009 editorial calendar for Printed Circuit Design & Fab magazine. The most popular topics included: • RF Design • Designing with Multiple Differential Pairs • Power and Signal Integrity in Memory Module Design • Design Tool Integration • HDI Specifications and Design Standards • Long-term Lead-free Reliability REACH ExPANDS REACH Puts 300 Chemicals on SIN List BRUSSELS – The EU environmental NGOs, via The International Chemical Sec- PCB Design tools Lead Q2 Revenues San JoSE, ca – The EDA Con- retariat, introduced a list of some 300 chemical substances considered of “very high concern” and suitable for disclosing, says Design Chain Associates. NGOs believe these 300 chemical substances should be considered candidates for Substances of Very High Concern in REACH legislation, according to DCA. And DCA says this list should be taken seriously, as “serious scientists” compiled it. Previously, the European Chemicals Agency published a proposed list of 16 substances. If all goes according to plan, they expect the first candidate list to be approved on Oct. 22. According to article 33 of REACH, after that date, a manufacturer must disclose to customers if any of these 16 substances are contained in a product in an amount over 0.1% weight-by-weight, also providing safe use information. The largest overseas markets for U.S. high-tech exports are the European Union ($46.6 billion), Canada ($29.4 billion), Mexico ($26 billion), China ($14.5 billion), Japan ($11.9 billion) and Singapore ($9.2 billion), says the association. The U.S. imported the most high-tech products from China ($112.3 billion), Mexico ($51.3 billion), the EU ($33.4 billion), Japan ($29.2 billion) and Malaysia ($25.1 billion). High tech was the second largest import sector, just behind energy products. The largest high-tech import subsectors in 2007 were computers and peripheral equipment ($103.2 billion), communications equipment ($74.0 billion) and consumer electronics ($54.4 billion). sortium (EDAC) has announced second-quarter revenues for the electronic design automation (EDA) industry. Despite an overall decline of 3.7%, Printed Circuit Board and Multi-Chip Module (PCB & MCM) revenue increased 19.3% over 2007 figures to $141.6 million. The fourquarter moving average growth rate showed a 1% decrease. The largest category, Computer Aided Engineering (CAE), created revenue of $524.7 million, a 2.6% decrease over last year’s figures. The four-quarter moving average was positive at 6.8%. Semiconductor Intellectual Property (SIP) revenue totaled $264.9 million, a 1.6% decrease over Q2 2007. Four-quarter moving average growth was down at 0.8%. IC Physical Design & Verification revenue dropped to $317.1 million, a 20.2% decrease from 2007 figures. The four-quarter moving average growth rate declined 2.6%. R&D Tax Credit Extended Two Years WASHINGTON, d.c. – The R&D Tax Credit gets new life as part of the Emergency Economic Stabilization Act of 2008. The Federal Research & Development Tax Credit has been extended from December 31, 2007, through December 31, 2009. The federal R&D Tax Credit gives companies an opportunity to claim an income tax credit for activities centered on the development or improvement of products, processes, software, techniques or formulas. The R&D credit covers standard research activities including the development of new technology or new products/processes. It also covers development activities like improving existing products or creating a more reliable product. The credit will cover developing a prototype or design tools. It can be used for the cost associated with applying for patents or testing new concepts. Included is the cost of improving a manufacturing process and those costs associated with employing outside consultants and/or contractors to do any of these research, development or improvement activities. The credit covers up to 20% of qualified research and development spending. The credit generates significant tax savings for U.S. companies in the manufacturing, technology, software, engineering and aerospace/defense industries. It is key to continued innovation. The Information Technology Association of America (ITAA) has estimated that the lapse of the R&D Tax Credit for the first nine months of 2008 placed over 10,000 jobs and $13 billion at risk. NOVEMBER 2008 8 printEd CirCuit dESign & fAB
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - November 2008 Printed Circuit Design & Fab - November 2008 Contents Our Line Market Watch Around the World Happenings ROI Positive Plating Ten Tips to Improve Manufacturability 3D Chip-Package-Board Modeling Improving Circuit Simulation With The Addition Of Real Measurements Ad Index PCB West: Interview with NBS Design Inc. The Influence of Final Finish on Lead-Free Assembly Reliability The Lead-free Soldering Challenges for Peelable Resists Off the Shelf Marketplace BGA Bulletin Printed Circuit Design & Fab - November 2008 Printed Circuit Design & Fab - November 2008 - (Page Intro) Printed Circuit Design & Fab - November 2008 - Printed Circuit Design & Fab - November 2008 (Page Cover1) Printed Circuit Design & Fab - November 2008 - Printed Circuit Design & Fab - November 2008 (Page Cover2) Printed Circuit Design & Fab - November 2008 - Printed Circuit Design & Fab - November 2008 (Page 1) Printed Circuit Design & Fab - November 2008 - Contents (Page 2) Printed Circuit Design & Fab - November 2008 - Contents (Page 3) Printed Circuit Design & Fab - November 2008 - Our Line (Page 4) Printed Circuit Design & Fab - November 2008 - Our Line (Page 5) Printed Circuit Design & Fab - November 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - November 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - November 2008 - Around the World (Page 8) Printed Circuit Design & Fab - November 2008 - Around the World (Page 9) Printed Circuit Design & Fab - November 2008 - Around the World (Page 10) Printed Circuit Design & Fab - November 2008 - Around the World (Page 11) Printed Circuit Design & Fab - November 2008 - Happenings (Page 12) Printed Circuit Design & Fab - November 2008 - Happenings (Page 13) Printed Circuit Design & Fab - November 2008 - ROI (Page 14) Printed Circuit Design & Fab - November 2008 - ROI (Page 15) Printed Circuit Design & Fab - November 2008 - Positive Plating (Page 16) Printed Circuit Design & Fab - November 2008 - Positive Plating (Page 17) Printed Circuit Design & Fab - November 2008 - Ten Tips to Improve Manufacturability (Page 18) Printed Circuit Design & Fab - November 2008 - Ten Tips to Improve Manufacturability (Page 19) Printed Circuit Design & Fab - November 2008 - Ten Tips to Improve Manufacturability (Page 20) Printed Circuit Design & Fab - November 2008 - Ten Tips to Improve Manufacturability (Page 21) Printed Circuit Design & Fab - November 2008 - Ten Tips to Improve Manufacturability (Page 22) Printed Circuit Design & Fab - November 2008 - Ten Tips to Improve Manufacturability (Page 23) Printed Circuit Design & Fab - November 2008 - 3D Chip-Package-Board Modeling (Page 24) Printed Circuit Design & Fab - November 2008 - 3D Chip-Package-Board Modeling (Page 25) Printed Circuit Design & Fab - November 2008 - 3D Chip-Package-Board Modeling (Page 26) Printed Circuit Design & Fab - November 2008 - 3D Chip-Package-Board Modeling (Page 27) Printed Circuit Design & Fab - November 2008 - 3D Chip-Package-Board Modeling (Page 28) Printed Circuit Design & Fab - November 2008 - 3D Chip-Package-Board Modeling (Page 29) Printed Circuit Design & Fab - November 2008 - Improving Circuit Simulation With The Addition Of Real Measurements (Page 30) Printed Circuit Design & Fab - November 2008 - Improving Circuit Simulation With The Addition Of Real Measurements (Page 31) Printed Circuit Design & Fab - November 2008 - Ad Index (Page 32) Printed Circuit Design & Fab - November 2008 - Ad Index (Page 33) Printed Circuit Design & Fab - November 2008 - PCB West: Interview with NBS Design Inc. (Page 34) Printed Circuit Design & Fab - November 2008 - PCB West: Interview with NBS Design Inc. (Page 35) Printed Circuit Design & Fab - November 2008 - The Influence of Final Finish on Lead-Free Assembly Reliability (Page 36) Printed Circuit Design & Fab - November 2008 - The Influence of Final Finish on Lead-Free Assembly Reliability (Page 37) Printed Circuit Design & Fab - November 2008 - The Influence of Final Finish on Lead-Free Assembly Reliability (Page 38) Printed Circuit Design & Fab - November 2008 - The Influence of Final Finish on Lead-Free Assembly Reliability (Page InsertA) Printed Circuit Design & Fab - November 2008 - The Influence of Final Finish on Lead-Free Assembly Reliability (Page InsertB) Printed Circuit Design & Fab - November 2008 - The Influence of Final Finish on Lead-Free Assembly Reliability (Page 39) Printed Circuit Design & Fab - November 2008 - The Lead-free Soldering Challenges for Peelable Resists (Page 40) Printed Circuit Design & Fab - November 2008 - The Lead-free Soldering Challenges for Peelable Resists (Page 41) Printed Circuit Design & Fab - November 2008 - The Lead-free Soldering Challenges for Peelable Resists (Page 42) Printed Circuit Design & Fab - November 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - November 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - November 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - November 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - November 2008 - Marketplace (Page 47) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page Cover4) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S1) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S2) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S3) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S4) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S5) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S6) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S7) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S8) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S9) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S10) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S11) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S12) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S13) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S14) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S15) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S16) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S17) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S18) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S19) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S20) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S21) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S22) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S23) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S24) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S25) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S26) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S27) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S28) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S29) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S30) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S31) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S32) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S33) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S34) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S35) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S36) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S37) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S38) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S39) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S40) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S41) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S42)
For optimal viewing of this digital publication, please enable JavaScript and then refresh the page. If you would like to try to load the digital publication without using Flash Player detection, please click here.