Printed Circuit Design & Fab - November 2008 - (Page S2) pcdandf.com Editorial Editor: Kathy Nargi-Toth, 678-589-8866, knargitoth@upmediagroup.com aSSoCiatE Editor: Margo Lakin, 678-5898853, mlakin@upmediagroup.com kathy nargi-toth Editorial offiCE: 2400 Lake Park Drive, Suite 440, Smyrna, GA 30080 678-589-8800; fax 678-589-8850 Editorial adviSory Board: Dr. Eric Bogatin, Be The Signal; Michael Carano, OM Group; George Dudnikov, Sanmina-SCI; Jack Fisher, Interconnect Technology Analysis; Happy Holden, Mentor Graphics; Istvan Novak, Sun Microsystems ColumniStS: Bruce Archambeault, Peter Bigelow, Michael Carano, Dominique Numakura, Charles Pfeil, Dr. Abe Riazi, Susy Webb Production art dirECtor: Katherine Haddox, khaddox@upmediagroup.com produCtion managEr: Javier Longoria, jlongoria@upmediagroup.com SalES SalES aSSoCiatE: Kamden Robb, 678-589-8843, krobb@upmediagroup.com EXhiBit SalES: Kamden Robb, 678-589-8843, krobb@upmediagroup.com; Frances Stewart, 678-589-8818, fstewart@upmediagroup.com korEa SalES: Young Media Inc., +82 2 2273 4818, fax +82 2 2273 4866, ymedia@ymedia.co.kr print rEprintS: Edward Kane, FosteReprints, 866-879-9144 ext. 131, fax 219-561-2009, ekane@fostereprints.com ElECtroniC rEprintS: pcdf_reprints@upmediagroup.com liSt rEntal: Jennifer Schuler, 918-496-1476, fax 918-496-9465 WEBinarS: Frances Stewart, 678-589-8818, fstewart@upmediagroup.com, pcbshows.com/webinars circulation dirECtor of audiEnCE dEvElopmEnt: Jennifer Schuler CirCulation and SuBSCription inquiriES/ addrESS ChangES: fax 918-496-9465, jschuler@upmediagroup.com uP MEdia GrouP, inc. prESidEnt: Pete Waddell viCE prESidEnt, SalES and markEting: Frances Stewart, fstewart@upmediagroup.com viCE prESidEnt, Editorial and produCtion: Mike Buetow, mbuetow@upmediagroup.com SpECial projECtS managEr: Ronda Faries, 678-589-8827, rfaries@upmediagroup.com Printed Circuit Design & Fab is distributed without charge to qualified subscribers. For others, annual Subscription Rates in U.S. funds are: $80 (U.S. and Canada), $145 (all other countries). Single copy price is $8.50. All subscription and single copy orders or inquiries should be directed to Printed Circuit Design & Fab, P.O. Box 35621, Tulsa, OK 74153-0621, jschuler@upmediagroup. com, fax 918-496-9465. Photocopies and issues on Microfilm/Microfiche (16mm, 33mm or 105mm) are available from University Microfilms International, 300 N. Zeeb Rd., Ann Arbor, MI 48106, Telephone 313-761-4600. Printed Circuit Design & Fab is published monthly by UP Media Group Inc., 2400 Lake Park Drive, Suite 440, Smyrna, GA 30080. ISSN 1543-6527. GST 124513185/ Agreement #1419617. Periodicals postage paid at Smyrna, GA, and additional mailing offices. © 2008, UP Media Group, Inc. All rights reserved. Reproduction of material appearing in Printed Circuit Design & Fab is forbidden without written permission. http://www.pcdandf.com http://www.pcbshows.com/webinars http://www.upmediagroup.com http://www.virtual-pcb.com http://www.virtual-pcb.com
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - November 2008 Printed Circuit Design & Fab - November 2008 Contents Our Line Market Watch Around the World Happenings ROI Positive Plating Ten Tips to Improve Manufacturability 3D Chip-Package-Board Modeling Improving Circuit Simulation With The Addition Of Real Measurements Ad Index PCB West: Interview with NBS Design Inc. The Influence of Final Finish on Lead-Free Assembly Reliability The Lead-free Soldering Challenges for Peelable Resists Off the Shelf Marketplace BGA Bulletin Printed Circuit Design & Fab - November 2008 Printed Circuit Design & Fab - November 2008 - (Page Intro) Printed Circuit Design & Fab - November 2008 - Printed Circuit Design & Fab - November 2008 (Page Cover1) Printed Circuit Design & Fab - November 2008 - Printed Circuit Design & Fab - November 2008 (Page Cover2) Printed Circuit Design & Fab - November 2008 - Printed Circuit Design & Fab - November 2008 (Page 1) Printed Circuit Design & Fab - November 2008 - Contents (Page 2) Printed Circuit Design & Fab - November 2008 - Contents (Page 3) Printed Circuit Design & Fab - November 2008 - Our Line (Page 4) Printed Circuit Design & Fab - November 2008 - Our Line (Page 5) Printed Circuit Design & Fab - November 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - November 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - November 2008 - Around the World (Page 8) Printed Circuit Design & Fab - November 2008 - Around the World (Page 9) Printed Circuit Design & Fab - November 2008 - Around the World (Page 10) Printed Circuit Design & Fab - November 2008 - Around the World (Page 11) Printed Circuit Design & Fab - November 2008 - Happenings (Page 12) Printed Circuit Design & Fab - November 2008 - Happenings (Page 13) Printed Circuit Design & Fab - November 2008 - ROI (Page 14) Printed Circuit Design & Fab - November 2008 - ROI (Page 15) Printed Circuit Design & Fab - November 2008 - Positive Plating (Page 16) Printed Circuit Design & Fab - November 2008 - Positive Plating (Page 17) Printed Circuit Design & Fab - November 2008 - Ten Tips to Improve Manufacturability (Page 18) Printed Circuit Design & Fab - November 2008 - Ten Tips to Improve Manufacturability (Page 19) Printed Circuit Design & Fab - November 2008 - Ten Tips to Improve Manufacturability (Page 20) Printed Circuit Design & Fab - November 2008 - Ten Tips to Improve Manufacturability (Page 21) Printed Circuit Design & Fab - November 2008 - Ten Tips to Improve Manufacturability (Page 22) Printed Circuit Design & Fab - November 2008 - Ten Tips to Improve Manufacturability (Page 23) Printed Circuit Design & Fab - November 2008 - 3D Chip-Package-Board Modeling (Page 24) Printed Circuit Design & Fab - November 2008 - 3D Chip-Package-Board Modeling (Page 25) Printed Circuit Design & Fab - November 2008 - 3D Chip-Package-Board Modeling (Page 26) Printed Circuit Design & Fab - November 2008 - 3D Chip-Package-Board Modeling (Page 27) Printed Circuit Design & Fab - November 2008 - 3D Chip-Package-Board Modeling (Page 28) Printed Circuit Design & Fab - November 2008 - 3D Chip-Package-Board Modeling (Page 29) Printed Circuit Design & Fab - November 2008 - Improving Circuit Simulation With The Addition Of Real Measurements (Page 30) Printed Circuit Design & Fab - November 2008 - Improving Circuit Simulation With The Addition Of Real Measurements (Page 31) Printed Circuit Design & Fab - November 2008 - Ad Index (Page 32) Printed Circuit Design & Fab - November 2008 - Ad Index (Page 33) Printed Circuit Design & Fab - November 2008 - PCB West: Interview with NBS Design Inc. (Page 34) Printed Circuit Design & Fab - November 2008 - PCB West: Interview with NBS Design Inc. (Page 35) Printed Circuit Design & Fab - November 2008 - The Influence of Final Finish on Lead-Free Assembly Reliability (Page 36) Printed Circuit Design & Fab - November 2008 - The Influence of Final Finish on Lead-Free Assembly Reliability (Page 37) Printed Circuit Design & Fab - November 2008 - The Influence of Final Finish on Lead-Free Assembly Reliability (Page 38) Printed Circuit Design & Fab - November 2008 - The Influence of Final Finish on Lead-Free Assembly Reliability (Page InsertA) Printed Circuit Design & Fab - November 2008 - The Influence of Final Finish on Lead-Free Assembly Reliability (Page InsertB) Printed Circuit Design & Fab - November 2008 - The Influence of Final Finish on Lead-Free Assembly Reliability (Page 39) Printed Circuit Design & Fab - November 2008 - The Lead-free Soldering Challenges for Peelable Resists (Page 40) Printed Circuit Design & Fab - November 2008 - The Lead-free Soldering Challenges for Peelable Resists (Page 41) Printed Circuit Design & Fab - November 2008 - The Lead-free Soldering Challenges for Peelable Resists (Page 42) Printed Circuit Design & Fab - November 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - November 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - November 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - November 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - November 2008 - Marketplace (Page 47) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page Cover4) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S1) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S2) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S3) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S4) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S5) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S6) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S7) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S8) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S9) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S10) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S11) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S12) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S13) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S14) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S15) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S16) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S17) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S18) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S19) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S20) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S21) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S22) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S23) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S24) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S25) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S26) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S27) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S28) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S29) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S30) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S31) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S32) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S33) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S34) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S35) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S36) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S37) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S38) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S39) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S40) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S41) Printed Circuit Design & Fab - November 2008 - BGA Bulletin (Page S42)
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