Printed Circuit Design & Fab - December 2008 - (Page 2)

DECEMBER 2008 • VOL. 25 • NO. 12 FEATURES The highly anticipated 2008 PCB Designer Salary Survey results are in. How do you measure up? Screen capture courtesy of Mentor Graphics Corp. 24 CO-DESIGN Electronic System Design ECAD-MCAD collaboration supports bidirectional communication that can shorten design times, reduce errors and bring competitive products to market faster. by JOHN ISAAC 28 DESIGN BASICS POINT OF VIEW 4 OUR LINE Narrowing the gap. Data Management 101 When data management is an integral part of the design environment, it works with designers rather than against them. by ROB EVANS 31 SALARY SURVEY Kathy Nargi-Toth 14 ROI Providing great customer service can bring success in tough economic times. DESIGNERS TAKE ON TECHNOLOGY CHALLENGES IN 2008 The decisions made in the design seat determine not only the size and shape of the PCB, but also the technology and materials needed to build it. by KATHY NARGI-TOTH 34 SYSTEM DESIGN Peter Bigelow 15 GLOBAL SOURCING A proposed QMl will cost OEMs and suppliers more – and won’t solve the target problem. PCB Signal Integrity, Power Integrity and EMC Challenges System-level PCB emission analysis reduces re-spins and EMC issues when PCBs are incorporated into larger systems. by BRAD BRIM 38 REGULATION UPDATE Greg Papandrew 16 EMC FOR THE REAL WORLD Knowing the ins and outs of EMC software tools can save time and money. What’s in a Name? The roles WEEE, RoHS and REACH play in the environment. by MARGO LAKIN 40 HS LAMINATES Dr. Bruce Archambeault 18 INTERCONNECT STRATEGIES Stackup analysis can help to optimize layer count, trace width, spacing and electrical performance. PCB Dielectric Materials for High-Speed Applications The glass weave in a laminate can affect propagation velocity and loss profile, leading to signal loss and skew in differential pairs. by RAVINDRA GALI Dr. Abe (Abbas) Riazi 21 ON THE FOREFRONT In the area of basic research, who will play? And who will pay? DEPARTMENTS 4 6 E. Jan Vardaman 22 MARKET WATCH AROUND THE WORLD 12 39 HAPPENINGS AD INDEX 43 44 OFF THE SHELF MARKETPLACE FINAL FINISH FORUM ENEPIG is a unique surface finish that exhibits improved solder joint reliability when it is used with lead-free SAC alloys. Circuits Assembly Online LEAN MANUFACTURING circuitsassembly.com George Milad 23 TEST AND INSPECTION How a grassroots organization can help get managers on board. Processes and Outcomes If a task is performed different ways, the process – and therefore the result – is unpredictable. by ROBERT HEMMANT GLOBAL SOURCING Stacy Kalisz Johnson 48 BGA BULLETIN Fine-pitch BGAs dramatically increase in pin count and will drive adoption of HDI. Why Pride and Outsourcing Don’t Mix Root problems tend to be everyday business issues. So why do some parties give up? by JENNIFER READ Charles Pfeil POSTMASTER: Send address changes to PRINTED CIRCUIT DESIGN & FAB, P.O. Box 35646, Tulsa, OK 74153-0646 http://www.circuitsassembly.com

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - December 2008

Printed Circuit Design & Fab - December 2008 Contents Our Line Market Watch Around the World Happenings ROI Global Sourcing EMC for the Real World Interconnect Strategies On the Forefront Final Finish Forum Test and Inspection Electronic System Design Data Management 101 Designers Take on Technology Challenges in 2008 PCB Signal Integrity, Power Integrity and EMC Challenges What’s in a Name? Ad Index PCB Dielectric Materials for High-Speed Applications Off the Shelf Marketplace BGA Bulletin

Printed Circuit Design & Fab - December 2008

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