Printed Circuit Design & Fab - December 2008 - (Page 21) The Future of r&D In the area of basic research, who will play? And who will pay? aS DeCISIONS are MaDe for the future of the historic Bell Labs building in Holmdel, NJ, one must ponder where the next major semiconductor R&D E. jAn breakthroughs will vArdAmAn be made. Does basic research matter? Who will step up and fill the gap? Universities? Consortia? Increasingly, basic research is being carried out in universities and national laboratories with federal grants. Will the current financial crisis impact future R&D spending? Played Out. Researchers at AT&T’s Bell Labs belonged to one of the world’s premier research institutes. Six researchers received the Nobel Prize in physics. Much of the early research in semiconductors traces its origins to Bell Labs, which opened in the late 1940s.1 But Alcatel-Lucent, its parent company, is pulling out of basic science, material physics and semiconductor research to focus on more immediately marketable areas such as networking, high-speed electronics, wireless, nanotechnology and software.2 While this may be a good short-term strategy, one has to wonder if whispered warnings from the ghosts of many a researcher of days gone by can be heard down the old hallways in Holmdel. The late Jack Kilbey shared the Nobel Prize for work toward the invention of the integrated circuit in 1958. In January 2007, his benefactor, Texas Instruments, dropped its internal semiconductor research, stopping at the 45-nm node in favor of foundrysupplied processes.3 TI will depend on Taiwan Semiconductor Manufacturing Co., United Microelectronics Corp. and Semiconductor Manufacturing International Corp., rather than constructing its own leading-edge fabs for digital technology, focusing only on analog R&D. DECEMBER 2008 Will these foundries be able to support critical semiconductor R&D needed for next-generation production? Can these organizations turn out Nobel-quality research to lead us to the next technology? TSMC’s R&D budget in 2007 was $554 million. Without question, TSMC continues to make major contributions in semiconductors, but can it make key contributions in areas of basic research? Does it matter? What about the other foundries? Do they have the pockets to make much of a contribution? According to analysts at Goldman Sachs, UMC’s financial performance is suffering “due to the recent stock market weakness and discouraging semiconductor demand outlook.” Who can fill the gap? Big Spenders? While some companies are on the decline in R&D spending, others appear to be able to step up to the plate. These companies include IBM, Intel and Samsung (taBlE 1). The danger is economic conditions could slow some of the R&D spending, as well as capital equipment purchases key to future semiconductor expansion. For years, IBM maintained a billion dollar R&D budget. While others have scaled back on research, IBM is said to taBlE 1. 2007 Worldwide Semiconductor r&D Spending leaders CO. Intel Samsung TI Toshiba AMD Renesas Broadcom NXP Qualcomm Source: IC Insights 2007 SaleS 35,021 19,951 13,309 11,850 6,013 8,001 3,754 6,026 5,619 2007 R&D 5,755 4,263 2,155 2,020 1,847 1,802 1,360 1,349 1,344 1,215 ($ MilliOnS) ($ MilliOnS) maintain large investments ($6 billion) in a variety of projects. IBM’s current research team includes five Nobel Prize recipients and more than a dozen National Medals of Science & Technology winners. The company is expected to maintain research projects of both short- and long-term (20 years).4 Intel’s third-quarter reports show R&D spending (plus MG&A) of approximately $2.9 billion. The annual R&D budget is close to $6 billion, nearly equal to the US Government’s budget for the National Science Foundation. This budget, however, must support not just semiconductor research, but also new PCs and future Internet products. Samsung is another R&D powerhouse. The company reported overall R&D spending in 2007 of approximately $5.58 billion. Samsung’s R&D budget supports everything from consumer electronics to semiconductors. Unfortunately, Samsung is trimming its investment plans in memory this year and has postponed capital spending on its US factory because of the worsening global memory chip market. The US financial crisis and potentially slowing global economy may hamper both corporate and government R&D spending. The most endangered expenditure likely is basic research. Will there be cuts to NSF? Universities? National labs? Does this make a difference? Maybe not in the short term, but definitely in the long run. pCd&f rEFErEncES 1. r. Colin Johnson, “Bell labs exits Chip research, EE Times, aug. 29, 2008. ” 2. P Ganapati, “Bell labs Kills Fundamental . Physics research, Wired Blog Network, ” aug. 27, 2008. 3. P Clarke, “Texas Instruments exits Process . Development race, Electronics Supply & ” Manufacturing, Jan. 24, 2007. 4. a. McConnon, “The Issue: Setting IBM’s r&D agenda, Business Week, april 16, ” 2008. STMicroelectronics 9,966 printEd CirCuit dESign & fAB 21
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - December 2008 Printed Circuit Design & Fab - December 2008 Contents Our Line Market Watch Around the World Happenings ROI Global Sourcing EMC for the Real World Interconnect Strategies On the Forefront Final Finish Forum Test and Inspection Electronic System Design Data Management 101 Designers Take on Technology Challenges in 2008 PCB Signal Integrity, Power Integrity and EMC Challenges What’s in a Name? Ad Index PCB Dielectric Materials for High-Speed Applications Off the Shelf Marketplace BGA Bulletin Printed Circuit Design & Fab - December 2008 Printed Circuit Design & Fab - December 2008 - (Page Intro) Printed Circuit Design & Fab - December 2008 - Printed Circuit Design & Fab - December 2008 (Page Cover1) Printed Circuit Design & Fab - December 2008 - Printed Circuit Design & Fab - December 2008 (Page Cover2) Printed Circuit Design & Fab - December 2008 - Printed Circuit Design & Fab - December 2008 (Page 1) Printed Circuit Design & Fab - December 2008 - Contents (Page 2) Printed Circuit Design & Fab - December 2008 - Contents (Page 3) Printed Circuit Design & Fab - December 2008 - Market Watch (Page 4) Printed Circuit Design & Fab - December 2008 - Market Watch (Page 5) Printed Circuit Design & Fab - December 2008 - Around the World (Page 6) Printed Circuit Design & Fab - December 2008 - Around the World (Page 7) Printed Circuit Design & Fab - December 2008 - Around the World (Page 8) Printed Circuit Design & Fab - December 2008 - Around the World (Page 9) Printed Circuit Design & Fab - December 2008 - Around the World (Page 10) Printed Circuit Design & Fab - December 2008 - Around the World (Page 11) Printed Circuit Design & Fab - December 2008 - Happenings (Page 12) Printed Circuit Design & Fab - December 2008 - Happenings (Page 13) Printed Circuit Design & Fab - December 2008 - ROI (Page 14) Printed Circuit Design & Fab - December 2008 - Global Sourcing (Page 15) Printed Circuit Design & Fab - December 2008 - EMC for the Real World (Page 16) Printed Circuit Design & Fab - December 2008 - EMC for the Real World (Page 16a) Printed Circuit Design & Fab - December 2008 - EMC for the Real World (Page 16b) Printed Circuit Design & Fab - December 2008 - EMC for the Real World (Page 17) Printed Circuit Design & Fab - December 2008 - Interconnect Strategies (Page 18) Printed Circuit Design & Fab - December 2008 - Interconnect Strategies (Page 19) Printed Circuit Design & Fab - December 2008 - Interconnect Strategies (Page 20) Printed Circuit Design & Fab - December 2008 - On the Forefront (Page 21) Printed Circuit Design & Fab - December 2008 - Final Finish Forum (Page 22) Printed Circuit Design & Fab - December 2008 - Test and Inspection (Page 23) Printed Circuit Design & Fab - December 2008 - Electronic System Design (Page 24) Printed Circuit Design & Fab - December 2008 - Electronic System Design (Page 25) Printed Circuit Design & Fab - December 2008 - Electronic System Design (Page 26) Printed Circuit Design & Fab - December 2008 - Electronic System Design (Page 27) Printed Circuit Design & Fab - December 2008 - Data Management 101 (Page 28) Printed Circuit Design & Fab - December 2008 - Data Management 101 (Page 29) Printed Circuit Design & Fab - December 2008 - Data Management 101 (Page 30) Printed Circuit Design & Fab - December 2008 - Designers Take on Technology Challenges in 2008 (Page 31) Printed Circuit Design & Fab - December 2008 - Designers Take on Technology Challenges in 2008 (Page 32) Printed Circuit Design & Fab - December 2008 - Designers Take on Technology Challenges in 2008 (Page 32a) Printed Circuit Design & Fab - December 2008 - Designers Take on Technology Challenges in 2008 (Page 32b) Printed Circuit Design & Fab - December 2008 - Designers Take on Technology Challenges in 2008 (Page 33) Printed Circuit Design & Fab - December 2008 - PCB Signal Integrity, Power Integrity and EMC Challenges (Page 34) Printed Circuit Design & Fab - December 2008 - PCB Signal Integrity, Power Integrity and EMC Challenges (Page 35) Printed Circuit Design & Fab - December 2008 - PCB Signal Integrity, Power Integrity and EMC Challenges (Page 36) Printed Circuit Design & Fab - December 2008 - PCB Signal Integrity, Power Integrity and EMC Challenges (Page 37) Printed Circuit Design & Fab - December 2008 - What’s in a Name? (Page 38) Printed Circuit Design & Fab - December 2008 - Ad Index (Page 39) Printed Circuit Design & Fab - December 2008 - PCB Dielectric Materials for High-Speed Applications (Page 40) Printed Circuit Design & Fab - December 2008 - PCB Dielectric Materials for High-Speed Applications (Page 41) Printed Circuit Design & Fab - December 2008 - PCB Dielectric Materials for High-Speed Applications (Page 42) Printed Circuit Design & Fab - December 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - December 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - December 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - December 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - December 2008 - Marketplace (Page 47) Printed Circuit Design & Fab - December 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - December 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - December 2008 - BGA Bulletin (Page Cover4)
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