Printed Circuit Design & Fab - December 2008 - (Page 33)

SALARy SurvEy 2007 Double-sided PCBs 4 to 6 layer PCBs Mixed-technology PCBs 7 to 10 layer PCBs BGAs Single-sided PCBs 12+ layer PCBs Microvias/HDI Flex/Rigid Flex FPGAs/PLDs RF/microwave Circuitry ASICs/ICs 18.5% 7.8% 10.4% 9.1% 7.8% 45.7% 41.1% 40.1% 33.8% 11.7% 34.2% 61.3% 59.9% 58.9% 41.1% 39.4% 36.8% 69.2% 52.4% 57.1% 51.1% 79.1% 62.8% 2008 86.8% 85.1% 75.8% 84.4% 85.7% Embedded Systems 14.9% Packaging 13.2% MCMs 12.3% Hybrids 11.6% SoCs 9.3% 9.1% SiPs 8.6% 7.4% FiGurE 6. Technology usage in 2008 designs. 6 to 10 (27.5%) 1 to 5 (20.2%) 51 and over (5%) 31 to 50 (6%) 16 to 20 (11.6%) 11 to 15 (15.2%) 21 to 30 (14.6%) FiGurE 7. Number of new designer per year completed by designers. CAD Software Fabrication Services Design Services CAM Software Connectors and Cables CAE Software Prototyping Services Active/passive Components Assembly Services Computers and Peripherals Solder/Solder Mask Substrate Materials Final Finishes Consulting Services Test/measurement Services FPGAs/PLDs ASICs/ICs 17.5% 10.9% 10.6% 9.3% 50.7% 44% 42.7% 38.4% 37.7% 35.4% 33.8% 33.4% 29.1% 28.1% 27.5% 19.9% 78.8% nificant increased usage. Embedded systems were up 91% to a usage rate of 14.9% and had the highest technology usage gain for the year. Designers were busy in 2008. Over 25% of them worked on six to 10 designs during the course of the year. Another 15.2% worked on 11 to 15 designs, and 37.2% worked on over 15 designs. Twenty percent (FiGurE 7) worked on only one to five designs over the course of the year. When asked about the products and services they directly specify, 78.8% included CAD software (FiGurE 8). Roughly 50% of the designers specified PCB fabrication services and half of these further specified the substrate materials, solder mask and final finish on these products. Over 30% specified components, assembly services, connectors and cables. It seems that PCB designers control a sizable portion of the electronic supply chain. The decisions made in the design seat determine not only the size and shape of the PCB and what components will be needed in the BOM, but often determines what fabrication and assembly company will be selected to build the board, as well as what processes and materials will be use. Designers control technology introduction as well, by either embracing new techniques or holding off on technology integration in their products. A careful review of the types of technologies that designers are activity incorporating into their designs can provide useful information on the requirements for next generation products and processes throughout the supply chain. pCd&f kathy narGi-toth is editor for Printed Circuit Design and Fab magazine and can be reached at knargitoth@ upmediagroup.com. FiGurE 8. What does the designer specify? DECEMBER 2008 printEd CirCuit dESign & fAB 33

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - December 2008

Printed Circuit Design & Fab - December 2008 Contents Our Line Market Watch Around the World Happenings ROI Global Sourcing EMC for the Real World Interconnect Strategies On the Forefront Final Finish Forum Test and Inspection Electronic System Design Data Management 101 Designers Take on Technology Challenges in 2008 PCB Signal Integrity, Power Integrity and EMC Challenges What’s in a Name? Ad Index PCB Dielectric Materials for High-Speed Applications Off the Shelf Marketplace BGA Bulletin

Printed Circuit Design & Fab - December 2008

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