Printed Circuit Design & Fab - December 2008 - (Page 6) MarkEt watch StoraGE riSES Trends in the U.S. electronics equipment market (shipments only). JUly Computers/electronics products Computers Storage devices Other peripheral equipment Nondefense communications equipment Defense communications equipment A/V equipment Semiconductors Components1 Nondefense search and navigation equipment Defense search and navigation equipment Medical, measurement and control rRevised. Gartner: 2009 Semi Growth Just 1% StaMFord, ct – The economic crisis is having a signifi- % Change aUgr SepT* yTD -5.6 -4.9 -8.2 1.5 -7.5 -14.2 -7.7 -18.6 -0.9 0.5 1.7 -1.2 -2.3 -2.2 11.6 1.9 2.2 6.8 2.6 -13.6 -2.2 -1.3 0.8 -2.6 0.0 -6.9 -2.8 0.2 -1.3 24.6 -14.4 -8.4 -2.6 0.3 3.3 11.3 6.0 -2.5 -1.6 -11.2 -3.0 11.1 -3.2 38.9 -1.9 -5.4 -3.6 13.4 cant impact on the semiconductor industry, as worldwide semiconductor revenue growth in 2009 is expected to be 1%, down approximately seven points from previous estimates, says Gartner Inc. (gartner.com). The research firm lowered its previous 2009 estimate of $307.7 billion, up 7.8% from 2008, to $282 billion, up 1%. Semiconductor revenues grew 5% quarter-overquarter in the September period, but fourth-quarter guidance continues to drop. Gartner estimates worldwide semiconductor revenue in 2008 will total $279.4 billion, up 2%. *Preliminary. 1Includes semiconductors. Seasonally adjusted. Source: U.S. Department of Commerce Census Bureau, November 4, 2008 October Manufacturing Reaches New Low tEMPE, aZ – The manufacturing sector in October failed to grow for the third consecutive month, says the Institute for Supply Management (ism.ws), while the overall economy concluded 83 consecutive months of growth. The manufacturing PMI dropped to 38.9%, a 26-year low. A reading above 50% indicates expansion. It was the lowest level for the PMI since September 1982, when it registered 38.8%. New orders fell 6.6 points to 32.2%, while production plummeted to 34.1%, down 6.7 points. Export orders contracted for the first time in 71 months. Backlogs dropped to 29.5%, down 5.5 points. The prices index fell to 37%, the lowest since December 2001 when it registered 33.2%. JUne PMI New orders Production Inventories Backlogs 50.2 49.6 51.5 51.2 47.5 JUly 50.0 45.0 52.9 45.0 47.0 43.0 aUg. 49.9 48.3 52.1 49.3 54.5 43.5 SepT. 43.5 38.8 40.8 43.4 53.5 35.0 OCT. 38.9 32.2 34.1 44.3 55.0 29.5 nEw york – The financial turmoil will dampen worldwide technology spending in 2009, according to research firm IDC. However, the lack of a tech "bubble" will hasten the rebound, the firm predicts. The research firm revised its growth outlook for worldwide IT spending to 2.6%, down from an August forecast of 5.9%. The firm's US spending outlook was slashed to 0.9%, down from 4.2%, while Japan and Western Europe will grow around 1%. Despite the economic downturn, IDC continues to expect spending on technology products and services to continue to grow next year — just at a slower pace. "IT is in a better position than ever to resist the downward pull of a slowing economy," said IDC chief research officer John Gantz in a press release, because it "remains critical to achieving further efficiency and productivity gains." The firm expects Emerging markets in Central and Eastern Europe, Africa, Latin America and the Middle East to continue to do well. IDC growth rates approaching 6% in 2012. Even so, the research firm estimates that the industry will lose more than $300 billion in revenue due to slower spending over the next four years. IDC Sees Slower Tech Sales in 2009 Customer inventories 55.0 Source: Institute for Supply Management, Nov. 3, 2008 induStry MarkEt SnaPShot Book-to-bills of various components/equipment. May JUne JUly aUg. SepT. Semiconductor equipment1 Semiconductors2 Rigid PCBs3 (North America) Flexible PCBs3 (North America) Computers/electronic products4 0.78 0.95 1.01 5.07 0.81 0.94 1.02 5.21 0.83 0.94 1.01 5.08 0.81r 7.02%r 0.95 0.90 5.27r 0.76p 4.82%p 0.96 0.94 5.34p 4.18% 5.91% 7.11% MEtalS indEx DaTe Gold1 Silver2 Copper3 Tin4 12nd 11/12/07 $803.50 $215.79 $3.07 $7.64 8/4/08 $905.75 $253.83 $3.67 $9.84 9/8/08 $815.00 $184.48 $3.17 $8.68 10/6/08 $875.50 $160.20 $2.70 $7.69 11/3/08 $729.50 $144.40 $1.80 $6.35 London Fix price/tr.oz. 2Handy and Harman Silver (COMEX Silver) price/LB. 3LME Cash Seller and Settlement for Copper price/LB. 4LME Cash Seller and Settlement for Tin price/LB. Sources: 1SEMI, 2SIA (3-month moving average growth), 3IPC, 4Census Bureau, pPreliminary, rRevised 6 printEd CirCuit dESign & fAB DECEMBER 2008 http://www.gartner.com http://www.ism.ws
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - December 2008 Printed Circuit Design & Fab - December 2008 Contents Our Line Market Watch Around the World Happenings ROI Global Sourcing EMC for the Real World Interconnect Strategies On the Forefront Final Finish Forum Test and Inspection Electronic System Design Data Management 101 Designers Take on Technology Challenges in 2008 PCB Signal Integrity, Power Integrity and EMC Challenges What’s in a Name? Ad Index PCB Dielectric Materials for High-Speed Applications Off the Shelf Marketplace BGA Bulletin Printed Circuit Design & Fab - December 2008 Printed Circuit Design & Fab - December 2008 - (Page Intro) Printed Circuit Design & Fab - December 2008 - Printed Circuit Design & Fab - December 2008 (Page Cover1) Printed Circuit Design & Fab - December 2008 - Printed Circuit Design & Fab - December 2008 (Page Cover2) Printed Circuit Design & Fab - December 2008 - Printed Circuit Design & Fab - December 2008 (Page 1) Printed Circuit Design & Fab - December 2008 - Contents (Page 2) Printed Circuit Design & Fab - December 2008 - Contents (Page 3) Printed Circuit Design & Fab - December 2008 - Market Watch (Page 4) Printed Circuit Design & Fab - December 2008 - Market Watch (Page 5) Printed Circuit Design & Fab - December 2008 - Around the World (Page 6) Printed Circuit Design & Fab - December 2008 - Around the World (Page 7) Printed Circuit Design & Fab - December 2008 - Around the World (Page 8) Printed Circuit Design & Fab - December 2008 - Around the World (Page 9) Printed Circuit Design & Fab - December 2008 - Around the World (Page 10) Printed Circuit Design & Fab - December 2008 - Around the World (Page 11) Printed Circuit Design & Fab - December 2008 - Happenings (Page 12) Printed Circuit Design & Fab - December 2008 - Happenings (Page 13) Printed Circuit Design & Fab - December 2008 - ROI (Page 14) Printed Circuit Design & Fab - December 2008 - Global Sourcing (Page 15) Printed Circuit Design & Fab - December 2008 - EMC for the Real World (Page 16) Printed Circuit Design & Fab - December 2008 - EMC for the Real World (Page 16a) Printed Circuit Design & Fab - December 2008 - EMC for the Real World (Page 16b) Printed Circuit Design & Fab - December 2008 - EMC for the Real World (Page 17) Printed Circuit Design & Fab - December 2008 - Interconnect Strategies (Page 18) Printed Circuit Design & Fab - December 2008 - Interconnect Strategies (Page 19) Printed Circuit Design & Fab - December 2008 - Interconnect Strategies (Page 20) Printed Circuit Design & Fab - December 2008 - On the Forefront (Page 21) Printed Circuit Design & Fab - December 2008 - Final Finish Forum (Page 22) Printed Circuit Design & Fab - December 2008 - Test and Inspection (Page 23) Printed Circuit Design & Fab - December 2008 - Electronic System Design (Page 24) Printed Circuit Design & Fab - December 2008 - Electronic System Design (Page 25) Printed Circuit Design & Fab - December 2008 - Electronic System Design (Page 26) Printed Circuit Design & Fab - December 2008 - Electronic System Design (Page 27) Printed Circuit Design & Fab - December 2008 - Data Management 101 (Page 28) Printed Circuit Design & Fab - December 2008 - Data Management 101 (Page 29) Printed Circuit Design & Fab - December 2008 - Data Management 101 (Page 30) Printed Circuit Design & Fab - December 2008 - Designers Take on Technology Challenges in 2008 (Page 31) Printed Circuit Design & Fab - December 2008 - Designers Take on Technology Challenges in 2008 (Page 32) Printed Circuit Design & Fab - December 2008 - Designers Take on Technology Challenges in 2008 (Page 32a) Printed Circuit Design & Fab - December 2008 - Designers Take on Technology Challenges in 2008 (Page 32b) Printed Circuit Design & Fab - December 2008 - Designers Take on Technology Challenges in 2008 (Page 33) Printed Circuit Design & Fab - December 2008 - PCB Signal Integrity, Power Integrity and EMC Challenges (Page 34) Printed Circuit Design & Fab - December 2008 - PCB Signal Integrity, Power Integrity and EMC Challenges (Page 35) Printed Circuit Design & Fab - December 2008 - PCB Signal Integrity, Power Integrity and EMC Challenges (Page 36) Printed Circuit Design & Fab - December 2008 - PCB Signal Integrity, Power Integrity and EMC Challenges (Page 37) Printed Circuit Design & Fab - December 2008 - What’s in a Name? (Page 38) Printed Circuit Design & Fab - December 2008 - Ad Index (Page 39) Printed Circuit Design & Fab - December 2008 - PCB Dielectric Materials for High-Speed Applications (Page 40) Printed Circuit Design & Fab - December 2008 - PCB Dielectric Materials for High-Speed Applications (Page 41) Printed Circuit Design & Fab - December 2008 - PCB Dielectric Materials for High-Speed Applications (Page 42) Printed Circuit Design & Fab - December 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - December 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - December 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - December 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - December 2008 - Marketplace (Page 47) Printed Circuit Design & Fab - December 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - December 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - December 2008 - BGA Bulletin (Page Cover4)
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