Printed Circuit Design & Fab - January 2009 - (Page 12) haPPEninGS FACES The European Institute of Printed Circuits (EIPC) has appointed Ivan Ho as director of Asian Pacific activities. He will act as a liaison between European and Asian printed circuit board (PCB) fabricators, ensuring long-term reliability within the supply chain. Prior to his appointment, Ho worked for several companies, including Ciba-Geigy, Photocircuits and Shipley. He is also the founder of topNotch Partners consulting company. Plastic Logic has named Martin Jackson as its vice president of technology. He will oversee the company’s Cambridge R&D center and will serve as a key strategist for the company’s plastic electronics display technology. He will also take part in the evolution of eReader, working with the productengineering group in Mountain View and the manufacturing team in Dresden, Germany. Jackson brings over 20 years of experience in leading corporate and technical strategies in consumer electronics, semiconductor and communications industries. Sunstone Circuits has hired Diane Economaki as director of marketing. Her position will consist of overseeing the company’s global marketing and eCommerce, as well as managing media relations and expanding Sunstone’s presence in the global market. She brings nearly 20 years of experience in marketing. Prior to her appointment, she held a similar position with Wacom technology Corporation. “Diane’s considerable marketing expertise and high standards are just what we need to establish an even higher level of marketing intelligence and planning in the vital market of printed circuit boards, explained terry Heilman, CEO. ” UCAMCO has appointed Rik Vandekerckhove as sales director for Asia. He will be responsible for sales of the company’s full range of software and plotter products in Japan, Korea, China, taiwan, South-East Asia and India. He brings more than 20 years of experience in the printed circuit board (PCB) industry. Prior to joining UCAMCO, Vandekerckhove was a product support and development engineer for a major European PCB fabricator. EVENTS 2-5 DesignCon 2009 Santa Clara Convention Center Santa Clara, CA Contact: designcon.com/2009/register It's Not Easy Being Green: Compliance with Legislation and Customer Requirements IPC Wyndham San Jose San Jose, CA Contact: www.ipc.org/NotEasyBeingGreen PCB PHOENIx HILTON PHOENIx EAST/MESA PHOENIx, AZ CONTACT: WWW.PCBSHOWS.COM/PHOENIx FEB 4-5 11 24-25 VIRTUAL PCB HOSTED By UP MEDIA GROUP CONTACT: WWW.VIRTUAL-PCB.COM 17-19 CPCA Show Hosted by CPCA Shanghai, China Contact: www.global--electronics.net/link/en/16545154 17-19 electronica & Productronica China Hosted by Munich Trade Fairs International Shanghai New International Expo Centre Contact: www.global-electronics.net/en/ge/ electronicaproductronicachina/Home 31-2 IPC Printed Circuits Expo, APEx and the Designers Summit Conference & Exhibition Mandalay Bay Hotel and Convention Center Las Vegas Contact: www.goipcshows.org/html/main/default.htm March Mar/aPril aPril 21-24 Nepcon China Everbright Convention and Exhibition Center Shanghai Contact: www.nepconchina.com 27-1 PCB EAST WESTIN WALTHAM-BOSTON WALTHAM, MA CONTACT: WWW.PCBEAST.COM aPril/May IT’S A DEAL Isola Group, SARL, has entered into a licensing agreement with Park Electrochemical Corporation. Under the agreement, Park is allowed to practice under U.S. Patent Nos. 5,464,658 and 5,350,621 for the terms of the patents. the patents concern laminates and printed circuit boars (PCBs) that incorporate square weave fabric materials. Financial terms of the agreement are undisclosed. AWR has entered into a partnership with Rohde & Schwarz Japan K.K., the Japanese subsidiary of Rohde & Schwarz. the partnership took effect December 1, 2008. 12 Under the agreement, AWR highfrequency design software and Rohde & Schwarz test and measurement equipment will join to provide solutions ranging from component characterization to sub-system and system verification. AWR will maintain its primary direct sales channel in Japan, as well as post-sales customer support. the partnership will expand the scope of hardware/software platforms available in Japan. As part of its plan to expand into China, Uniflex Technology Inc. is set to acquire Boardtek Electronics Corporation’s plant in Yangzhou for Nt$180 million (US$5.38 million). the plant supplies flexible printed circuit boards (FPCBs) to subsidiaries of its parent company YFY Group. In addition, Boardtek will take a 10% stake, nearly Nt$130 million (US$3.89 million), in Uniflex through private placement. the deal is expected to close by early 2009. Saki Corporation, a Japan-based provider of automatic optical inspection machines, has signed a Sale and Purchase (S&P) Agreement with Schmidt Electronics Group Ltd. In the agreement, Saki will acquire an undisclosed percentage of Schmidt’s subsidiary, MacroScience Technology Limited (MSTL). JANUARY 2009 PRINTED CIRCUIT DESIGN & FAB http://www.designcon.com/2009/register http://www.ipc.org/NotEasyBeingGreen http://www.pcbshows.com/phoenix http://www.virtual-pcb.com http://www.global-electronics.net/link/en/16545154 http://www.global-electronics.net/en/ge/electronicaproductronicachina/Home http://www.global-electronics.net/en/ge/electronicaproductronicachina/Home http://www.goipcshows.org/html/main/default.htm http://www.nepconchina.com http://www.pcbeast.com
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - January 2009 Printed Circuit Design & Fab - January 2009 Contents Our Line Market Watch Around the World Happenings ROI The Signal Doctor Positive Plating Final Finish Forum Making Sense of Laminate Dielectric Properties Design and Fab Tips for Improving Solder Mask Registration Automating the DDRx Interface Verification Process Printed Circuit Design & Fab Annual Buyers Guide: Special Suppliers Section Printed Circuit Design & Fab Annual Buyers Guide: Guide to Products and Services Off the Shelf Marketplace Ad Index BGA Bulletin Printed Circuit Design & Fab - January 2009 Printed Circuit Design & Fab - January 2009 - (Page Intro) Printed Circuit Design & Fab - January 2009 - Printed Circuit Design & Fab - January 2009 (Page Cover1) Printed Circuit Design & Fab - January 2009 - Printed Circuit Design & Fab - January 2009 (Page Cover2) Printed Circuit Design & Fab - January 2009 - Printed Circuit Design & Fab - January 2009 (Page 1) Printed Circuit Design & Fab - January 2009 - Contents (Page 2) Printed Circuit Design & Fab - January 2009 - Contents (Page 3) Printed Circuit Design & Fab - January 2009 - Our Line (Page 4) Printed Circuit Design & Fab - January 2009 - Our Line (Page 5) Printed Circuit Design & Fab - January 2009 - Market Watch (Page 6) Printed Circuit Design & Fab - January 2009 - Market Watch (Page 7) Printed Circuit Design & Fab - January 2009 - Around the World (Page 8) Printed Circuit Design & Fab - January 2009 - Around the World (Page 9) Printed Circuit Design & Fab - January 2009 - Around the World (Page 10) Printed Circuit Design & Fab - January 2009 - Around the World (Page 11) Printed Circuit Design & Fab - January 2009 - Happenings (Page 12) Printed Circuit Design & Fab - January 2009 - Happenings (Page 13) Printed Circuit Design & Fab - January 2009 - ROI (Page 14) Printed Circuit Design & Fab - January 2009 - The Signal Doctor (Page 15) Printed Circuit Design & Fab - January 2009 - The Signal Doctor (Page 16) Printed Circuit Design & Fab - January 2009 - The Signal Doctor (Page 17) Printed Circuit Design & Fab - January 2009 - Positive Plating (Page 18) Printed Circuit Design & Fab - January 2009 - Final Finish Forum (Page 19) Printed Circuit Design & Fab - January 2009 - Making Sense of Laminate Dielectric Properties (Page 20) Printed Circuit Design & Fab - January 2009 - Making Sense of Laminate Dielectric Properties (Page 21) Printed Circuit Design & Fab - January 2009 - Making Sense of Laminate Dielectric Properties (Page 22) Printed Circuit Design & Fab - January 2009 - Making Sense of Laminate Dielectric Properties (Page 23) Printed Circuit Design & Fab - January 2009 - Making Sense of Laminate Dielectric Properties (Page 24) Printed Circuit Design & Fab - January 2009 - Making Sense of Laminate Dielectric Properties (Page 25) Printed Circuit Design & Fab - January 2009 - Making Sense of Laminate Dielectric Properties (Page 26) Printed Circuit Design & Fab - January 2009 - Making Sense of Laminate Dielectric Properties (Page 27) Printed Circuit Design & Fab - January 2009 - Design and Fab Tips for Improving Solder Mask Registration (Page 28) Printed Circuit Design & Fab - January 2009 - Design and Fab Tips for Improving Solder Mask Registration (Page 29) Printed Circuit Design & Fab - January 2009 - Design and Fab Tips for Improving Solder Mask Registration (Page 30) Printed Circuit Design & Fab - January 2009 - Automating the DDRx Interface Verification Process (Page 31) Printed Circuit Design & Fab - January 2009 - Automating the DDRx Interface Verification Process (Page 32) Printed Circuit Design & Fab - January 2009 - Automating the DDRx Interface Verification Process (Page 33) Printed Circuit Design & Fab - January 2009 - Printed Circuit Design & Fab Annual Buyers Guide: Special Suppliers Section (Page 34) Printed Circuit Design & Fab - January 2009 - Printed Circuit Design & Fab Annual Buyers Guide: Special Suppliers Section (Page 35) Printed Circuit Design & Fab - January 2009 - Printed Circuit Design & Fab Annual Buyers Guide: Guide to Products and Services (Page 36) Printed Circuit Design & Fab - January 2009 - Printed Circuit Design & Fab Annual Buyers Guide: Guide to Products and Services (Page 37) Printed Circuit Design & Fab - January 2009 - Printed Circuit Design & Fab Annual Buyers Guide: Guide to Products and Services (Page 38) Printed Circuit Design & Fab - January 2009 - Printed Circuit Design & Fab Annual Buyers Guide: Guide to Products and Services (Page 39) Printed Circuit Design & Fab - January 2009 - Printed Circuit Design & Fab Annual Buyers Guide: Guide to Products and Services (Page 40) Printed Circuit Design & Fab - January 2009 - Printed Circuit Design & Fab Annual Buyers Guide: Guide to Products and Services (Page 41) Printed Circuit Design & Fab - January 2009 - Printed Circuit Design & Fab Annual Buyers Guide: Guide to Products and Services (Page 42) Printed Circuit Design & Fab - January 2009 - Off the Shelf (Page 43) Printed Circuit Design & Fab - January 2009 - Marketplace (Page 44) Printed Circuit Design & Fab - January 2009 - Marketplace (Page 45) Printed Circuit Design & Fab - January 2009 - Ad Index (Page 46) Printed Circuit Design & Fab - January 2009 - Ad Index (Page 47) Printed Circuit Design & Fab - January 2009 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - January 2009 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - January 2009 - BGA Bulletin (Page Cover4)
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