Printed Circuit Design & Fab - January 2009 - (Page 2)

JANUARY 2009 • VOL. 26 • NO. 1 FEATURES The 2009 Buyers Guide is a comprehensive listing of industry suppliers covering the supply chain from PCB design through fabrication. Handshake image ©iStockPhoto.com/Oleg Prikhodko Circuitry image ©iStockPhoto.com/Arpad Benedek Design by Katherine Haddox 20 LAMINATE MATERIALS Making Sense of Laminate Dielectric Properties Understanding material properties reduces the design cycle, facilitates stack up and provides a cost-to-performance advantage. by RICHARD PANGIER and MICHAEL J. GAY 28 SOLDER MASK DFA POINT OF VIEW 4 Design and Fab Tips for Improving Solder Mask Registration Early design decisions can improve solder mask registration on fine-pitch products, resulting in significantly higher assembly yields. by HIEN LY 31 POWER INTEGRITY OUR LINE Yielding to change. Kathy Nargi-Toth 14 ROI The best way to survive 2009 is to have a solid and realistic business plan. Automating the DDRx Interface Verification Process Today’s standard interfaces are more complex so that both timing and signal integrity need to be a part of the verification process. by DAVE KOHLMEIER 34 PRINTED CIRCUIT DESIGN & FAB ANNUAL BUYERS GUIDE: SPECIAL SUPPLIERS SECTION A selection of design and fabrication vendors. PRINTED CIRCUIT DESIGN & FAB ANNUAL BUYERS GUIDE: GUIDE TO PRODUCTS AND SERVICES A comprehensive listing of design and fabrication suppliers. Peter Bigelow 15 THE SIGNAL DOCTOR Coupling in differential pairs. Dr. Eric Bogatin 18 36 POSITIVE PLATING Organic addition agents influence secondary current distribution and control the physical properties of the copper deposit. DEPARTMENTS 6 8 Michael Carano 19 MARKET WATCH AROUND THE WORLD 12 43 HAPPENINGS OFF THE SHELF 44 46 MARKETPLACE AD INDEX FINAL FINISH FORUM Taking a smaller perspective with surface finishes helps to understand the benefits of each type of metal coating. Don Cullen 48 Circuits Assembly Online circuitsassembly.com Eliminating Muda: One Company’s Journey BGA BULLETIN PCB footprints for mobile chipsets. Charles Pfeil When the Milwaukee Electronics Companies decided to implement Lean manufacturing principles in 2003, its implementation team thought the major benefit would be increased throughput on the manufacturing floor. While those goals were achieved, the most significant lesson learned was the true bottleneck lay in supply-chain management. by DON SIVILOTTI ONLINE EXCLUSIVES pcdandf.com Visit our Web site for news, products, extra features and columns, and more. Search for products and services in the 2009 Online Buyers Guide: pcdandf.com/bg Selective Wave Soldering DoE to Develop DfM Guidelines for Lead and Pb-Free Assemblies The reduced pallet opening size on a selective wave solder pallet hampers the ability to successfully fill PTH barrels, a problem amplified when using Pb-free alloy due to differences in fluid properties. An intensive DoE finds several ways to quantify the impact of design, component spacing and holefill criteria in terms of DPMO. by MAKRAM BOULOS, CRAIG HAMILTON, MARIO MORENO, RAMON MENDEZ, GERMAN SOTO and JESSICA HERRERA POSTMASTER: Send address changes to PRINTED CIRCUIT DESIGN & FAB, P.O. Box 35646, Tulsa, OK 74153-0646 http://www.iStockPhoto.com/Oleg http://www.iStockPhoto.com/Arpad http://www.circuitsassembly.com http://www.pcdandf.com http://www.pcdandf.com/bg

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - January 2009

Printed Circuit Design & Fab - January 2009 Contents Our Line Market Watch Around the World Happenings ROI The Signal Doctor Positive Plating Final Finish Forum Making Sense of Laminate Dielectric Properties Design and Fab Tips for Improving Solder Mask Registration Automating the DDRx Interface Verification Process Printed Circuit Design & Fab Annual Buyers Guide: Special Suppliers Section Printed Circuit Design & Fab Annual Buyers Guide: Guide to Products and Services Off the Shelf Marketplace Ad Index BGA Bulletin

Printed Circuit Design & Fab - January 2009

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