Printed Circuit Design & Fab - February 2009 - (Page 26) HS SiMulation Simulation: The Need for Speed Establishing selection criteria can help determine the best simulation model for a specific task. by TIMoTHy CoyLE The jitter specifications for SerDes (Serializer/Deserializer) interfaces keep getting smaller, and the timing margins for memory interfaces, like DDR3, keep shrinking until they are almost gone. As design margins shrink, PCB designers need to be able to predict how designs are going to behave in order to avoid costly re-spins and rework. The goal of any signal integrity simulation is to validate that the interfaces on the PCB design will meet timing and noise margin specifications. By using simulations at the right times in a PCB design flow, costly board spins and rework can be avoided, as illustrated in FiGurE 1. Simulations give the designer a window into what is happening in a system. A typical process flow involves pre-layout and post-layout simulations. At the pre-layout phase, major or minor simulation work can be performed. For new designs, simulations can be used to find the best topology for an interface bus and validate IO buffer characteristics such as drive strength and edge rate. For interfaces, like DDR3 that require a detailed timing analysis to ensure that setup and hold times are met under various conditions, simulations are the only way to achieve that goal. The results of the pre-layout simulations can be used to develop layout rules so the PCB will meet specifications. These layout rules can often be used in a CAD constraint manager tool to help automate the process. For post-layout simulations, the actual board topology and routing are extracted from the CAD database to verify that the interface will work as designed. This phase can be used to validate the layout rules developed in the pre-layout phase. channel loss seen at 5 Gbps, designers are using advanced circuit techniques, like equalization and clock recovery, to open the eye back up at the receiver. Traditional SPICE (Simulation Program with Integrated Circuit Emphasis)-based models do not easily model these advanced techniques, and tools such as Matlab are often used to develop the algorithms to describe these implementations, as shown in FiGurE 2. Modeling formats such as IBIS-AMI (Input/Output Buffer Information Specification - Algorithmic Modeling Interface) have been developed to provide a universal standard to describe these algorithms so that they can be used across EDA tools. Using traditional time-domain SPICE simulations for these SerDes interfaces is FiGurE 1. Signal quality of a signal (1) overshoot (2) ringback (3) settling time (4) non-monotonic edges. New Challenges in SerDes Design Implementing high speed SerDes devices can be complicated and time consuming– especially with new technology standards like PCI Express Generation 2.0 that have frequencies above 5 Gbps. This new wave of SerDes devices presents challenges to simulating and measuring a design. To compensate for the 26 FiGurE 2. SerDes Channel Diagram. FEBRUARY 2009 printEd CirCuit dESign & fAB
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - February 2009 Printed Circuit Design & Fab - February 2009 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar BGA Bulletin Interconnect Strategies Final Finsh Forum Defects Database Embedded Active Components In Multilayer LCP Packages Simulation: The Need for Speed Advanced Registration Systems The DC Design Squeeze Ad Index Do You Really Want a Better Autorouter? Designing With Conductive Materials, Part 1 Off th eShelf Marketplace On the Forefront Printed Circuit Design & Fab - February 2009 Printed Circuit Design & Fab - February 2009 - (Page Intro) Printed Circuit Design & Fab - February 2009 - Printed Circuit Design & Fab - February 2009 (Page Cover1) Printed Circuit Design & Fab - February 2009 - Printed Circuit Design & Fab - February 2009 (Page Cover2) Printed Circuit Design & Fab - February 2009 - Printed Circuit Design & Fab - February 2009 (Page 1) Printed Circuit Design & Fab - February 2009 - Contents (Page 2) Printed Circuit Design & Fab - February 2009 - Contents (Page 3) Printed Circuit Design & Fab - February 2009 - Our Line (Page 4) Printed Circuit Design & Fab - February 2009 - Our Line (Page 5) Printed Circuit Design & Fab - February 2009 - Market Watch (Page 6) Printed Circuit Design & Fab - February 2009 - Market Watch (Page 7) Printed Circuit Design & Fab - February 2009 - Around the World (Page 8) Printed Circuit Design & Fab - February 2009 - Around the World (Page 9) Printed Circuit Design & Fab - February 2009 - Around the World (Page 10) Printed Circuit Design & Fab - February 2009 - Around the World (Page 11) Printed Circuit Design & Fab - February 2009 - Happenings (Page 12) Printed Circuit Design & Fab - February 2009 - Happenings (Page 13) Printed Circuit Design & Fab - February 2009 - ROI (Page 14) Printed Circuit Design & Fab - February 2009 - Tip Jar (Page 15) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page 16) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page P1) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page P2) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page P3) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page P4) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page 17) Printed Circuit Design & Fab - February 2009 - Interconnect Strategies (Page 18) Printed Circuit Design & Fab - February 2009 - Interconnect Strategies (Page 19) Printed Circuit Design & Fab - February 2009 - Final Finsh Forum (Page 20) Printed Circuit Design & Fab - February 2009 - Defects Database (Page 21) Printed Circuit Design & Fab - February 2009 - Embedded Active Components In Multilayer LCP Packages (Page 22) Printed Circuit Design & Fab - February 2009 - Embedded Active Components In Multilayer LCP Packages (Page 23) Printed Circuit Design & Fab - February 2009 - Embedded Active Components In Multilayer LCP Packages (Page 24) Printed Circuit Design & Fab - February 2009 - Embedded Active Components In Multilayer LCP Packages (Page 25) Printed Circuit Design & Fab - February 2009 - Simulation: The Need for Speed (Page 26) Printed Circuit Design & Fab - February 2009 - Simulation: The Need for Speed (Page 27) Printed Circuit Design & Fab - February 2009 - Simulation: The Need for Speed (Page 28) Printed Circuit Design & Fab - February 2009 - Simulation: The Need for Speed (Page 29) Printed Circuit Design & Fab - February 2009 - Advanced Registration Systems (Page 30) Printed Circuit Design & Fab - February 2009 - Advanced Registration Systems (Page 31) Printed Circuit Design & Fab - February 2009 - Advanced Registration Systems (Page 32) Printed Circuit Design & Fab - February 2009 - Advanced Registration Systems (Page 33) Printed Circuit Design & Fab - February 2009 - The DC Design Squeeze (Page 34) Printed Circuit Design & Fab - February 2009 - The DC Design Squeeze (Page 35) Printed Circuit Design & Fab - February 2009 - The DC Design Squeeze (Page 36) Printed Circuit Design & Fab - February 2009 - Ad Index (Page 37) Printed Circuit Design & Fab - February 2009 - Do You Really Want a Better Autorouter? (Page 38) Printed Circuit Design & Fab - February 2009 - Do You Really Want a Better Autorouter? (Page 39) Printed Circuit Design & Fab - February 2009 - Designing With Conductive Materials, Part 1 (Page 40) Printed Circuit Design & Fab - February 2009 - Designing With Conductive Materials, Part 1 (Page 41) Printed Circuit Design & Fab - February 2009 - Designing With Conductive Materials, Part 1 (Page 42) Printed Circuit Design & Fab - February 2009 - Off th eShelf (Page 43) Printed Circuit Design & Fab - February 2009 - Marketplace (Page 44) Printed Circuit Design & Fab - February 2009 - Marketplace (Page 45) Printed Circuit Design & Fab - February 2009 - Marketplace (Page 46) Printed Circuit Design & Fab - February 2009 - Marketplace (Page 47) Printed Circuit Design & Fab - February 2009 - On the Forefront (Page 48) Printed Circuit Design & Fab - February 2009 - On the Forefront (Page Cover3) Printed Circuit Design & Fab - February 2009 - On the Forefront (Page Cover4)
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