Printed Circuit Design & Fab - February 2009 - (Page 43) MACHINES MATERIALS TOOLS SYSTEMS SOFTWARE INNOVATIVE CABLE ASSEMBLIES The Shielded Controlled Impedance (SCI) Cable Assembly Development Kit, 2mm, enables users to assess, test and design high-performance, 2mm SCI cable-to-board solutions. engineers can attain multi-gigahertz performance from 2 mm printed circuit board connectors using 2mm shielded controlled impedance cable assemblies. Assess, test and design with application notes, test instructions and technical sheets. WHo: 3M WHERE: www.3m.com X-BERT PARALLEX TESTING ANd VERIFICATION PLATFORM The x-BERT Parallex is a parallel 10 Gb/s test platform. The cost per test port is reduced because users are able to perform several BeR tests at once using a single clock and pattern source. The platform is scalable, therefore, users can begin with a single channel and add modules if needed. In addition, it aids in the design and development of 8 Gb/s to 11.3 Gb/s optical and electrical transceivers. WHo: Luceo Technologies Gmbh WHERE: www.luceotec.com CHANNEL dESIGNER FOR HIGH SPEEd SERIAL dESIGN The Sigrity Channel Designer enables system designers to model the behavior of serial links running at 10 gigabits a second and beyond. Traditional analysis is not effective in providing a realistic view of these high speed channels. Sigrity’s Channel Designer includes graphic entry, IBIS-AMI models and channel templates to support early feasibility studies. 2D / 3D eye diagrams and bathtub curves support bit error rate (BeR) prediction. WHo: Sigrity, Inc. WHERE: www.sigrity.com OTHERS OF NOTE BLACK ENGINEERING POLYMER Ticona Engineering Polymers introduces Forton SKx-534 Black, engineering polymer. The product reduces total halogen concentrations to less than 900 parts per million, helping to meet environmental standards. The polyphenylene sulfide (PPS) is inherently flame resistant. It is also UL94 V-O rated and can withstand high-temperature soldering to temperatures of 270° C. WHo: Ticona engineering Polymers WHERE: www.ticona.com CSP/BALLNEST HYBRId SOCKET Aries Electronics introduces the CSP/ BallNest Hybrid Socket for test or burnin of chip scale package, ball grid array, microBGA, land grid array and prototyping. Features include a lid that nests each ball termination into the socket for a reliable connection and a fourpoint crown providing scrub on solder oxides. estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings. WHo: Aries electronics WHERE: www.arieselec.com 100 POSITION MICRO CONNECTOR The MDM PCB connector is a micro miniature connector can provide 100 signals in a lightweight and compact package. With a contact pitch spacing of 0.050 inch, it supplies maximum signal density when board space is limited. The connector is designed for electronic instrument packages, avionics applications, oil field exploration and satellite systems. It is housed in an aluminum shell with W/LCP dielectric and features a twist pin contact system and crimped gold plated contacts. Multiple plating options are available. WHo: ITT Interconnect Solutions WHERE: www.ittcannon.com REAL-TIME OSCILLOSCOPE The WaveMaster 8 Zi Series is a digital oscilloscope with X-Stream II architecture to increase speed. Users are able to upgrade bandwidth, up to 30 Ghz, staying current with emerging high-speed technologies and serial data standards. Features include 80 GS/s of sample rate for 20 Ghz to 30 Ghz bandwidths, up to 512 Mpts of analysis memory and greater than 15 Ghz edge triggering. Added functions include the Eye Doctor and SDA 8 Zi Serial Data Analyzers. WHo: LeCroy Corp. WHERE: www.lecroy.com ENHANCEd CAM dATA PRESENTATION Ucamco introduces UCAM v8.3.1, PCB CAM software for enhanced data presentation. engineers can generate feedback layers that highlight electrical test point generation issues. The PDF output can create high-quality files with unlimited zooming, and users are able to email the files to test departments and customers. Features include a magnifier window that provides a zoomed data image for tracking the cursor. WHo: Ucamco WHERE: www.ucamco.com FLUKE APPLICATION NOTES Fluke Corp. Application Notes Are available through the company’s website, the notes assist users with troubleshooting and illustrate the features and techniques of the Fluke test tools. Features include a dual impedance capability that provides safe and accurate testing of industrial, electrical and electronic systems. Technicians are able to safely troubleshoot sensitive circuits, including ones that might contain ghost voltages. WHo: Fluke Corp. WHERE: www.fluke.com FEBRUARY 2009 printEd CirCuit dESign & fAB 43 http://www.3m.com http://www.luceotec.com http://www.sigrity.com http://www.ticona.com http://www.arieselec.com http://www.ittcannon.com http://www.lecroy.com http://www.ucamco.com http://www.fluke.com
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - February 2009 Printed Circuit Design & Fab - February 2009 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar BGA Bulletin Interconnect Strategies Final Finsh Forum Defects Database Embedded Active Components In Multilayer LCP Packages Simulation: The Need for Speed Advanced Registration Systems The DC Design Squeeze Ad Index Do You Really Want a Better Autorouter? Designing With Conductive Materials, Part 1 Off th eShelf Marketplace On the Forefront Printed Circuit Design & Fab - February 2009 Printed Circuit Design & Fab - February 2009 - (Page Intro) Printed Circuit Design & Fab - February 2009 - Printed Circuit Design & Fab - February 2009 (Page Cover1) Printed Circuit Design & Fab - February 2009 - Printed Circuit Design & Fab - February 2009 (Page Cover2) Printed Circuit Design & Fab - February 2009 - Printed Circuit Design & Fab - February 2009 (Page 1) Printed Circuit Design & Fab - February 2009 - Contents (Page 2) Printed Circuit Design & Fab - February 2009 - Contents (Page 3) Printed Circuit Design & Fab - February 2009 - Our Line (Page 4) Printed Circuit Design & Fab - February 2009 - Our Line (Page 5) Printed Circuit Design & Fab - February 2009 - Market Watch (Page 6) Printed Circuit Design & Fab - February 2009 - Market Watch (Page 7) Printed Circuit Design & Fab - February 2009 - Around the World (Page 8) Printed Circuit Design & Fab - February 2009 - Around the World (Page 9) Printed Circuit Design & Fab - February 2009 - Around the World (Page 10) Printed Circuit Design & Fab - February 2009 - Around the World (Page 11) Printed Circuit Design & Fab - February 2009 - Happenings (Page 12) Printed Circuit Design & Fab - February 2009 - Happenings (Page 13) Printed Circuit Design & Fab - February 2009 - ROI (Page 14) Printed Circuit Design & Fab - February 2009 - Tip Jar (Page 15) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page 16) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page P1) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page P2) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page P3) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page P4) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page 17) Printed Circuit Design & Fab - February 2009 - Interconnect Strategies (Page 18) Printed Circuit Design & Fab - February 2009 - Interconnect Strategies (Page 19) Printed Circuit Design & Fab - February 2009 - Final Finsh Forum (Page 20) Printed Circuit Design & Fab - February 2009 - Defects Database (Page 21) Printed Circuit Design & Fab - February 2009 - Embedded Active Components In Multilayer LCP Packages (Page 22) Printed Circuit Design & Fab - February 2009 - Embedded Active Components In Multilayer LCP Packages (Page 23) Printed Circuit Design & Fab - February 2009 - Embedded Active Components In Multilayer LCP Packages (Page 24) Printed Circuit Design & Fab - February 2009 - Embedded Active Components In Multilayer LCP Packages (Page 25) Printed Circuit Design & Fab - February 2009 - Simulation: The Need for Speed (Page 26) Printed Circuit Design & Fab - February 2009 - Simulation: The Need for Speed (Page 27) Printed Circuit Design & Fab - February 2009 - Simulation: The Need for Speed (Page 28) Printed Circuit Design & Fab - February 2009 - Simulation: The Need for Speed (Page 29) Printed Circuit Design & Fab - February 2009 - Advanced Registration Systems (Page 30) Printed Circuit Design & Fab - February 2009 - Advanced Registration Systems (Page 31) Printed Circuit Design & Fab - February 2009 - Advanced Registration Systems (Page 32) Printed Circuit Design & Fab - February 2009 - Advanced Registration Systems (Page 33) Printed Circuit Design & Fab - February 2009 - The DC Design Squeeze (Page 34) Printed Circuit Design & Fab - February 2009 - The DC Design Squeeze (Page 35) Printed Circuit Design & Fab - February 2009 - The DC Design Squeeze (Page 36) Printed Circuit Design & Fab - February 2009 - Ad Index (Page 37) Printed Circuit Design & Fab - February 2009 - Do You Really Want a Better Autorouter? (Page 38) Printed Circuit Design & Fab - February 2009 - Do You Really Want a Better Autorouter? (Page 39) Printed Circuit Design & Fab - February 2009 - Designing With Conductive Materials, Part 1 (Page 40) Printed Circuit Design & Fab - February 2009 - Designing With Conductive Materials, Part 1 (Page 41) Printed Circuit Design & Fab - February 2009 - Designing With Conductive Materials, Part 1 (Page 42) Printed Circuit Design & Fab - February 2009 - Off th eShelf (Page 43) Printed Circuit Design & Fab - February 2009 - Marketplace (Page 44) Printed Circuit Design & Fab - February 2009 - Marketplace (Page 45) Printed Circuit Design & Fab - February 2009 - Marketplace (Page 46) Printed Circuit Design & Fab - February 2009 - Marketplace (Page 47) Printed Circuit Design & Fab - February 2009 - On the Forefront (Page 48) Printed Circuit Design & Fab - February 2009 - On the Forefront (Page Cover3) Printed Circuit Design & Fab - February 2009 - On the Forefront (Page Cover4)
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