Printed Circuit Design & Fab - February 2009 - (Page P2) Schedule-at-a-Glance MONDAY, APRIL 27 8 am – 5 pm a Hands-On Experience for Designers Speaker: Gary Ferrari, FTG Circuits REGISTRATION OPEN 9 am – 5 pm S5: RF and Mixed-Signal PCB Design Speaker: Rick Hartley, L-3 Communications, Avionics Systems PROFESSIONAL DEVELOPMENT CERTIFICATE COURSES T1: Signal Integrity in High-Speed Circuits Speaker: Rick Hartley, L-3 Communications, Avionics Systems S6: EMC Software Tools for Real-World Engineering Problems Speaker: Dr. Bruce Archambeault, IBM S7: Designer’s Guide to Selecting Lead-Free Components and Materials Speaker: Vern Solberg 6 pm – 7:30 pm T2: Deal or No Deal: The Choices You Make Can Make or Break a Design Speaker: Gary Ferrari, FTG Circuits AN EVENING WITH INDUSTRY EXPERTS T3: EMC for Electrical Engineers Working in the RealWorld; (Electromagnetic Compatibility is NOT Magic!) Speaker: Dr. Bruce Archambeault, IBM WEDNESDAY, APRIL 29 Also see Free Wednesday Sessions and Events, facing page. 8 am – 7 pm T4: Design for SMT Manufacturability From an Assembly Point of View Speakers: Phil Zarrow and Jim Hall, ITM Consulting 12 pm – 1 pm REGISTRATION OPEN 9 am – 12:30 pm PROFESSIONAL DEVELOPMENT ATTENDEE LUNCH 3-DAY TECHNICAL CONFERENCE COURSES S8: Make the Most of your Design Time Speaker: Susy Webb, Fairfield Industries TUESDAY, APRIL 28 8 am – 6:30 pm S9: Designing Out Common Failure Mechanisms Speakers: Phil Zarrow and Jim Hall, ITM Consulting REGISTRATION OPEN 9 am – 11 am S10: Printed Circuit Design Utilizing Embedded Passives Speaker: Rick Hartley, L-3 Communications, Avionics Systems 3-DAY TECHNICAL CONFERENCE COURSES W1: Materials for High-Speed, High Frequency and Lead-Free PCBs Speaker: Rick Hartley, L-3 Communications, Avionics Systems 9 am – 12:30 pm S11: Designing with Flex in Mind Speakers: Mark A. Verbrugge and Mark Finstad, Minco Products 11 am – 7 pm EXHIBITS OPEN 12 noon – 2 pm 3-DAY TECHNICAL CONFERENCE COURSES S1: Making Industry Standards Work for You Speaker: Gary Ferrari, FTG Circuits LUNCH ON THE SHOW FLOOR 2 pm – 4 pm S2: Decoupling PCBs for EMC and Functionality in the Real-World Speaker: Dr. Bruce Archambeault, IBM 3-DAY TECHNICAL CONFERENCE COURSES W2: Library Creation and Maintenance Speaker: Susy Webb, Fairfield Industries S3: PCB Design Fundamentals for High-Density LeadFree Electronics Speaker: Vern Solberg 1:30 pm – 5 pm W3: PCB Design 101: A Primer for Getting Started Speaker: Gary Ferrari, FTG Circuits W4: Perfecting Prototype Surface-Mount Assembly Speaker: Robert Kondner, Advanced Assembly 3-DAY TECHNICAL CONFERENCE COURSES S4: Understanding the Board Fabrication Process, W5: HDI Stackups and Routing with Microvias Speaker: Steven Calder, Northrop Grumman 2
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - February 2009 Printed Circuit Design & Fab - February 2009 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar BGA Bulletin Interconnect Strategies Final Finsh Forum Defects Database Embedded Active Components In Multilayer LCP Packages Simulation: The Need for Speed Advanced Registration Systems The DC Design Squeeze Ad Index Do You Really Want a Better Autorouter? Designing With Conductive Materials, Part 1 Off th eShelf Marketplace On the Forefront Printed Circuit Design & Fab - February 2009 Printed Circuit Design & Fab - February 2009 - (Page Intro) Printed Circuit Design & Fab - February 2009 - Printed Circuit Design & Fab - February 2009 (Page Cover1) Printed Circuit Design & Fab - February 2009 - Printed Circuit Design & Fab - February 2009 (Page Cover2) Printed Circuit Design & Fab - February 2009 - Printed Circuit Design & Fab - February 2009 (Page 1) Printed Circuit Design & Fab - February 2009 - Contents (Page 2) Printed Circuit Design & Fab - February 2009 - Contents (Page 3) Printed Circuit Design & Fab - February 2009 - Our Line (Page 4) Printed Circuit Design & Fab - February 2009 - Our Line (Page 5) Printed Circuit Design & Fab - February 2009 - Market Watch (Page 6) Printed Circuit Design & Fab - February 2009 - Market Watch (Page 7) Printed Circuit Design & Fab - February 2009 - Around the World (Page 8) Printed Circuit Design & Fab - February 2009 - Around the World (Page 9) Printed Circuit Design & Fab - February 2009 - Around the World (Page 10) Printed Circuit Design & Fab - February 2009 - Around the World (Page 11) Printed Circuit Design & Fab - February 2009 - Happenings (Page 12) Printed Circuit Design & Fab - February 2009 - Happenings (Page 13) Printed Circuit Design & Fab - February 2009 - ROI (Page 14) Printed Circuit Design & Fab - February 2009 - Tip Jar (Page 15) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page 16) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page P1) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page P2) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page P3) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page P4) Printed Circuit Design & Fab - February 2009 - BGA Bulletin (Page 17) Printed Circuit Design & Fab - February 2009 - Interconnect Strategies (Page 18) Printed Circuit Design & Fab - February 2009 - Interconnect Strategies (Page 19) Printed Circuit Design & Fab - February 2009 - Final Finsh Forum (Page 20) Printed Circuit Design & Fab - February 2009 - Defects Database (Page 21) Printed Circuit Design & Fab - February 2009 - Embedded Active Components In Multilayer LCP Packages (Page 22) Printed Circuit Design & Fab - February 2009 - Embedded Active Components In Multilayer LCP Packages (Page 23) Printed Circuit Design & Fab - February 2009 - Embedded Active Components In Multilayer LCP Packages (Page 24) Printed Circuit Design & Fab - February 2009 - Embedded Active Components In Multilayer LCP Packages (Page 25) Printed Circuit Design & Fab - February 2009 - Simulation: The Need for Speed (Page 26) Printed Circuit Design & Fab - February 2009 - Simulation: The Need for Speed (Page 27) Printed Circuit Design & Fab - February 2009 - Simulation: The Need for Speed (Page 28) Printed Circuit Design & Fab - February 2009 - Simulation: The Need for Speed (Page 29) Printed Circuit Design & Fab - February 2009 - Advanced Registration Systems (Page 30) Printed Circuit Design & Fab - February 2009 - Advanced Registration Systems (Page 31) Printed Circuit Design & Fab - February 2009 - Advanced Registration Systems (Page 32) Printed Circuit Design & Fab - February 2009 - Advanced Registration Systems (Page 33) Printed Circuit Design & Fab - February 2009 - The DC Design Squeeze (Page 34) Printed Circuit Design & Fab - February 2009 - The DC Design Squeeze (Page 35) Printed Circuit Design & Fab - February 2009 - The DC Design Squeeze (Page 36) Printed Circuit Design & Fab - February 2009 - Ad Index (Page 37) Printed Circuit Design & Fab - February 2009 - Do You Really Want a Better Autorouter? (Page 38) Printed Circuit Design & Fab - February 2009 - Do You Really Want a Better Autorouter? (Page 39) Printed Circuit Design & Fab - February 2009 - Designing With Conductive Materials, Part 1 (Page 40) Printed Circuit Design & Fab - February 2009 - Designing With Conductive Materials, Part 1 (Page 41) Printed Circuit Design & Fab - February 2009 - Designing With Conductive Materials, Part 1 (Page 42) Printed Circuit Design & Fab - February 2009 - Off th eShelf (Page 43) Printed Circuit Design & Fab - February 2009 - Marketplace (Page 44) Printed Circuit Design & Fab - February 2009 - Marketplace (Page 45) Printed Circuit Design & Fab - February 2009 - Marketplace (Page 46) Printed Circuit Design & Fab - February 2009 - Marketplace (Page 47) Printed Circuit Design & Fab - February 2009 - On the Forefront (Page 48) Printed Circuit Design & Fab - February 2009 - On the Forefront (Page Cover3) Printed Circuit Design & Fab - February 2009 - On the Forefront (Page Cover4)
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