Printed Circuit Design & Fab - March 2009 - (Page 27) dfm Plane pours and simulation with power integrity constraints. ■ In-Circuit Testpoints, silkscreen, legend and solder-paste and any other manufacturing documentation and DfT analysis. ■ Final “sign-off” and before the package is sent out for fabrication. fIGure 5 and fIGure 6 provide a suggestion for when to run specific batch DFF analyses. Since the MCR can be saved and stored, this is not a difficult task. Any hazard discovered ■ can then be corrected, and this is “one less” that can result in missing critical schedules. Conclusion Implementing a concurrent approach to design, with manufacturing always in mind, will reduce errors, costs and timeto-volume-production. One of the keys to ensuring success is using manufacturing supplied compliance criteria in the design environment. The implementation of new Manufacturing Compliance software in the supply chain will increase effective communication between the OEM, fabricator and EMS. Additionally, it ensures the design processes match the needs of multiple manufacturing suppliers, which means that the manufacturing output is “correct by construction” before it leaves the layout engineer’s desktop. This in turn eliminates the downstream design iterations. PCD&F reference 1. Holden Happy, “Manufacturing Information, Documentation, and Transfer Including CAM Tooling for Fab and Assembly, Printed Cir” cuit Handbook-Sixth Edition, pgs. 20.1 -20.32, McGraw-Hill, 2008. happy hoLden is senior technologist with Mentor Graphics; happy_holden@mentor.com. danIeL smIth is technical instructor with Mentor Graphics; daniel_smith@mentor.com. fIGure 5. Suggestions for when to run the specific MCR analyses. fIGure 6. Suggestions for when to run the specific MCR analyses. MARCH 2009 PRINTED CIRCUIT DESIGN & FAB 27
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