Printed Circuit Design & Fab - March 2009 - (Page 44) MACHINES MATERIALS TOOLS SYSTEMS SOFTWARE HEAT RESISTANT EPOXY ADHESIVE The ep21AN is a two-part adhesive system that cures readily at ambient temperatures and quickly at elevated temperatures. It is reported to be an excellent electrical insulator with a dielectric strength of >400 volts/mil and a non-critical 1/1-mix ratio by weight or volume. It adheres to numerous substrates, such as metals, ceramics, glass and many plastics. It also has a low shrinkage upon cure with exceptional dimensional stability. Who: Master Bond Inc. WhERE: www.masterbond.com LOW PROFILE, HIGH-CURRENT INDUCTOR The IhLw-5050ce-01, IHLP inductor is a winged, low profile, high-current inductor designed to be placed on a cut-out PCB. It offers a high-current solution without exceeding a 1.2 mm profile on either side of the board. With a frequency range up to 5 MHz, the product is reported to handle high transient current spikes without hard saturation. It is specified for operating temperatures ranging from 55° C to +125° C. Who Vishay Intertechnology Inc. WhERE: www.vishay.com PI ANALYSIS TOOL hyperLynx pI is a power integrity analysis tool for accurate analysis of power plane structures. To address high-density/pin-count ICs, the HyperLynx PI analysis tool analyzes the design, ensuring clean, sufficient power is delivered to the ICs through multiple PCB power and ground structures. The product enables designers to select the best number, placement and values of de-coupling capacitors. Who: Mentor Graphics WhERE: www.mentor.com OTHERS OF NOTE HIGH-DENSITY INTERFACE The molex flexBeam tool-Less copper flex Interposer is a high-speed, copper flex assembly for high--density interface in flex-to-PCBA applications. The low profile, flex-to-board interface provides densities of 1.00 mm or less in numerous pin-matrix configurations. A z-axis is added to traditional 2D PCB processing through all-metal spring beams permanently embedded onto an FR-4 substrate. The integrated copper flex assembly enables signal speeds greater than 10 Gbps. Users achieve board-to-flex pin counts of 500 input/outputs. Who: Molex Inc. WhERE: www.molex.com COPPER CLAD RESISTOR LAMINATE Dupont pyralux ApR copper clad resistor laminate is a double-sided polyimide film bonded to copper foil for advanced multilayer flex, rigid flex and rigid PCBs. Available in a range of dielectric thicknesses and resistance levels, the laminate provides a variety of circuit constructions. It is compatible with printed wiring board processes and has a thermal resistance up to 180° C. The product is reported to have excellent dielectric thickness tolerance and electrical performance and is IPC 4204/11 certified. Who: DuPont WhERE: www.pyralux.dupont.com EMI SHIELDING GASKET The cho-Seal 1270 is a molded elastomer EMI shielding gasket. The product is suited for designs requiring superior mechanical performance, electrical conductivity and long-term stability. Having a Shore A durometer hardness of 35 +/- 5 and a 9% compression set figure, the gasket’s shielding effectiveness is greater than 70 dB between 100 MHz and 10 GHz. It is available in numerous product forms, including compression-molded sheets, die-cut parts and custom-molded shapes. Thicknesses range from 0.25 mm to 3.18 mm. Who: Chomerics Europe WhERE: www.chomerics.com SMT PLACEMENT PROGRAM gerbtool is automated scripts that run within GerbTool/VisualCAM software. Users can create off-line programming from data sets. The component Edit feature allows users to search, find and highlight components on screen. It can be configured to match existing format requirements and supports metric and imperial codes. VisualCAM users can use the scripts as an entrylevel alternative to powerful ARE modules that allow SMT/BOM capabilities. Who: JD Photo-Tools WhERE: www.jdphoto.co.uk DC/DC CONVERTER murata power Solutions, hpQ series, ultra-high power quarter brick isolated DC/DC converter with a voltage output range of 36 VDC to 75 VDC and basic insulation up to 2250 V. Fixed output voltage is regulated to within ±1% and can be trimmed within ±10% of nominal output. The module has a 3.3 VDC fixed output. With an output current of up to 50 A, it can provide up to 165 W of power. Designed for PCB mounting, the module is suitable for use across -40° C to 85° C. Who: Murata Power Solutions WhERE: www.murata-ps.com ENERGY-EFFICIENT HYDRAULIC PRESS The eco-Lab press hydraulic press uses less energy to cool platens during press temperature cycling. A multi-stage cooling process employs forced air to initially cool the platens. Sweating is eliminated and water usage reduced because water flows only to the cold press platens when needed.The press has a temperature control accuracy of ±0.25% and a platen temperature uniformity of ±2.5% of set point. Who: USA Technical Machine Products WhERE: www.techmach.com 44 PRINTED CIRCUIT DESIGN & FAB MARCH 2009 http://www.vishay.com http://www.masterbond.com http://www.mentor.com http://www.pyralux.dupont.com http://www.molex.com http://www.chomerics.com http://www.jdphoto.co.uk http://www.murata-ps.com http://www.techmach.com
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