Printed Circuit Design & Fab - June 2008 - (Page 12) haPPEninGS FACES Kevin S. Palatnik has been appointed CFO of Cadence Design systems. Palatnik is a 12-year veteran of Cadence, and has served as controller for the past two years, leading the company’s financial, audit and compliance functions. Simon Bloch has been promoted to VP and general manager of Mentor Graphics Corporation’s Design and synthesis Division. Bloch will be responsible for Mentor Graphics’ field programmable gate array (FPGA) and electronic system Level (esL) design and synthesis products. Zuken has appointed Aurang Rona as VP of international marketing for europe and the UsA. In this newly created position, he will lead the marketing team and business development to support the company’s western region. The company has also assigned Rona the task of coordinating the company’s Japan headquarters with the western region. George Dramowicz has joined the Merix Corporation as its VP of quality. Dramowicz, was most recently a director of corporate and global quality at Celestica International, and has held management positions at Honeywell/Allied signal, and Marconi and Pratt & Whitney of Canada. Triangle Circuits has named Patrick Higgins as plant manager. Higgins brings over 35 years experience in the PCB manufacturing industry to the company. Prior to joiningTriangle Circuits, Higgins held positions with Waytec electronics, Gultech of Raleigh, NC, Tyco electronics of Melbourne, FL and Advance Circuits of Mennetonka, MN. auGuSt Jeff Cannis has joined Technic as technical services and facilities manager, and will oversee technical service support of the company’s Western Region, as well as the company’s analytical laboratory, wafer plating lab, as well as assuming some facilities management functions. Christina Lane has been appointed by Prototron Circuits to manage sales in Northern California, and will be responsible for all sales efforts in the region. Ms. Lane has a background in the Northern California PCB market, including previous positions with Winonics, Westac, Phase 2 and Data Circuits. Steven N. Lach has joined the Merix Corporation its vice president of North American Operations. Mr. Lach was previously with sanmina-sCI Corporation as their VP of North American PCB Operations, and prior to that served as president of Photocircuits, and held positions at Viasystems/AT&T Microelectronics and Continental Circuits. July EVENTS JunE 3-6 Nepcon Malaysia 2008 Penang International Sports Arena Penang, Malaysia Contact: nepcon.com.my SMT/Hybrid/Packaging 2008 Mesago Messe Frankfurt Nuremberg, Germany Contact: smt-exhibition.com 3-5 8-13 45th Design Automation Conference Anaheim Convention Center Anaheim, CA Contact: dac.com 11-13 JPCA Show Hosted by JPCA Tokyo, Japan Contact: jpcashow.com/show2008/English/index.html 15-17 Componex Nepcon Chennai 2008 Chennai Trade Center Chennai, India Contact: componex-nepcon.com 15-17 Semicon West Moscone Center San Francisco, CA Contact: semiconwest.org/index.htm 28 2009 iNEMI Roadmap Workshop – Asia Shanghai, China Contact: inemi.org 17-21 SMTAI 2008 Disney's Coronado Springs Resort Lake Buena Vista, FL Contact: smta.org; joann@smta.org 2-5 ElectronicIndia 2008 Bangalore, India Contact: global-electronics.net/link/en/16545148 30th Annual EOS/ESD Symposium Westin La Paloma Resort Tucson, AZ Contact: esda.org/symposia.html SEPtEMBEr 7-12 14-19 PCB WEST 2008 MARRIOTT SANTA CLARA SANTA CLARA, CA CONTACT: FRANCES STEWART, FSTEWART@ uPMEDIAGROuP .COM; KAMDEN ROBB, KROBB@ uPMEDIAGROuP .COM; PCBWEST.COM IT’S A DEAL Hunter Technology has opened a Design Center in san Diego, expanding the company’s plans to provide PCB design and engineering services nationally through its subsidiary CADParts & Consulting LLC. Hunter states that it will add additional service centers in parts of the U.s. during the next several months. Present locations include California, New Jersey, Colorado, Tennessee and Pennsylvania. Fujitsu has announce that is will move between 110 and 140 PCB manufacturing jobs from Fujitsu Telecommunications europe in Birmingham, U.K to Fujitsu Network Communications in Richardson, Texas. Tony Oppenheim, COO in Birmingham, said moving the PCB work to the Richardson plant would consolidate manufacturing and help maintain the 12 company’s competitive position in the global telecommunications market. Orbotech, Inc. has announced that R&D Circuits Inc. has installed a Paragon 8000 laser direct imaging system for its PCB manufacturing operation in south Plainfield, NJ. The system will be used to insure registration accuracy on high density PCBs Adi Kahn, president of Orbotech said, “We are pleased that R&D Circuits is gaining important benefits from our LDI solution, as they continue to advance their operation to meet their very high standards for customer satisfaction. ” China Minmetals has reportedly purchased HPTec, Germany’s manufacturer of drills and cutters, for an unspeci- fied price. The company said that it will assume 100% control of the Ravensburg, Germany-based company, which produces printed circuit board (PCB) microcutting tools. Founded in 1977 HPTec has , locations in singapore, Korea and China. Cemco-FSL has announced that SDS Schaltungsdruck Storz GMBH in Kenzingen, Germany has purchased an Alchemy C type horizontal hot air solder leveling system. The company decision to purchase the new product is due to industry demand for LF Horizontal HAsL as a final finish. The system is equipped with an automated control system permitting adjustments via touch screen. Other features include online statistical analysis and modem back-up. JUNE 2008 printEd circuit dESign & fAB http://nepcon.com.my http://smt-exhibition.com http://dac.com http://www.jpcashow.com/show2008/English/index.html http://componex-nepcon.com http://semiconwest.org/index.htm http://inemi.org http://smta.org http://global-electronics.net/link/en/16545148 http://esda.org/symposia.html http://PCBWEST.COM
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - June 2008 Printed Circuit Design & Fab - June 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Interconnect Strategies Final Finish Forum DFA/DFT Signal Integrity From the Field DFA Fab Basics Drill Off the Shelf Marketplace Ad Index BGA Bulletin Printed Circuit Design & Fab - June 2008 Printed Circuit Design & Fab - June 2008 - Printed Circuit Design & Fab - June 2008 (Page Cover1) Printed Circuit Design & Fab - June 2008 - Printed Circuit Design & Fab - June 2008 (Page Cover2) Printed Circuit Design & Fab - June 2008 - Printed Circuit Design & Fab - June 2008 (Page 1) Printed Circuit Design & Fab - June 2008 - Contents (Page 2) Printed Circuit Design & Fab - June 2008 - Contents (Page 3) Printed Circuit Design & Fab - June 2008 - Our Line (Page 4) Printed Circuit Design & Fab - June 2008 - Our Line (Page 5) Printed Circuit Design & Fab - June 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - June 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - June 2008 - Around the World (Page 8) Printed Circuit Design & Fab - June 2008 - Around the World (Page 9) Printed Circuit Design & Fab - June 2008 - Around the World (Page 10) Printed Circuit Design & Fab - June 2008 - Around the World (Page 11) Printed Circuit Design & Fab - June 2008 - Happenings (Page 12) Printed Circuit Design & Fab - June 2008 - Happenings (Page 13) Printed Circuit Design & Fab - June 2008 - ROI (Page 14) Printed Circuit Design & Fab - June 2008 - ROI (Page 15) Printed Circuit Design & Fab - June 2008 - Tip Jar (Page 16) Printed Circuit Design & Fab - June 2008 - Tip Jar (Page 17) Printed Circuit Design & Fab - June 2008 - Interconnect Strategies (Page 18) Printed Circuit Design & Fab - June 2008 - Interconnect Strategies (Page 19) Printed Circuit Design & Fab - June 2008 - Final Finish Forum (Page 20) Printed Circuit Design & Fab - June 2008 - Final Finish Forum (Page 21) Printed Circuit Design & Fab - June 2008 - DFA/DFT (Page 22) Printed Circuit Design & Fab - June 2008 - DFA/DFT (Page 23) Printed Circuit Design & Fab - June 2008 - DFA/DFT (Page 24) Printed Circuit Design & Fab - June 2008 - DFA/DFT (Page 25) Printed Circuit Design & Fab - June 2008 - Signal Integrity (Page 26) Printed Circuit Design & Fab - June 2008 - Signal Integrity (Page 27) Printed Circuit Design & Fab - June 2008 - Signal Integrity (Page 28) Printed Circuit Design & Fab - June 2008 - Signal Integrity (Page 29) Printed Circuit Design & Fab - June 2008 - From the Field (Page 30) Printed Circuit Design & Fab - June 2008 - From the Field (Page 31) Printed Circuit Design & Fab - June 2008 - From the Field (Page 32) Printed Circuit Design & Fab - June 2008 - From the Field (Page 33) Printed Circuit Design & Fab - June 2008 - DFA (Page 34) Printed Circuit Design & Fab - June 2008 - DFA (Page 35) Printed Circuit Design & Fab - June 2008 - DFA (Page 36) Printed Circuit Design & Fab - June 2008 - DFA (Page 37) Printed Circuit Design & Fab - June 2008 - Fab Basics (Page 38) Printed Circuit Design & Fab - June 2008 - Fab Basics (Page 39) Printed Circuit Design & Fab - June 2008 - Drill (Page 40) Printed Circuit Design & Fab - June 2008 - Drill (Page 41) Printed Circuit Design & Fab - June 2008 - Drill (Page 42) Printed Circuit Design & Fab - June 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - June 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - June 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - June 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - June 2008 - Ad Index (Page 47) Printed Circuit Design & Fab - June 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - June 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - June 2008 - BGA Bulletin (Page Cover4)
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